Sensitization detection of aluminum alloy based on the resonant parameters of surface bonded piezoelectric wafer active sensor (PWAS)

2021 ◽  
Author(s):  
Abdraouf Abusoua ◽  
Haiying Huang
Keyword(s):  
Aluminum Alloy ◽  
Active Sensor ◽  
Piezoelectric Wafer

Piezoelectric Wafer Active Sensor Structural Health Monitoring of Space Structures

2010 ◽  
Vol 21 (9) ◽  
pp. 921-940 ◽  
Author(s):  
Andrei Zagrai ◽  
Derek Doyle ◽  
Vlasi Gigineishvili ◽  
Jacob Brown ◽  
Hugh Gardenier ◽  
...  
Keyword(s):  
Structural Health Monitoring ◽  
Health Monitoring ◽  
Space Structures ◽  
Structural Health ◽  
Active Sensor ◽  
Piezoelectric Wafer

Influence of a delamination on Lamb wave excitation by a nearby piezoelectric transducer

2020 ◽  
pp. 1045389X2091997 ◽  
Author(s):  
Alisa N Shpak ◽  
Mikhail V Golub ◽  
Inka Mueller ◽  
Artem Eremin ◽  
Jens Kathol ◽  
...  
Keyword(s):  
Mathematical Model ◽  
Piezoelectric Transducer ◽  
Lamb Wave ◽  
Lamb Waves ◽  
Boundary Integral ◽  
Experimental Investigations ◽  
Wave Excitation ◽  
Damage Scenarios ◽  
Active Sensor ◽  
Piezoelectric Wafer

This article presents the results of theoretical and experimental investigations of characteristic changes of Lamb wave excitation and scattering by a strip-like horizontal delamination in a layered elastic waveguide for Lamb waves induced by a piezoelectric wafer active sensor. The boundary integral equation method is used to describe wave propagation in an infinite layered waveguide with a delamination, while the frequency domain spectral element method is employed to model the dynamic behaviour of the piezoelectric wafer active sensor, which allows to simulate debonding between the piezoelectric wafer active sensor and the waveguide. Experimental investigations of the dynamic interaction of the piezoelectric wafer active sensor with a layered plate containing a horizontal delamination is conducted for several damage scenarios, showing a good agreement with the results obtained using the developed mathematical model. The obtained mathematical model is employed to analyse alteration of the piezo-induced Lamb waves including modes’ decomposition due to delamination. The conversion and/or conservation of the Lamb waves on account of a delamination is investigated. The electro-mechanical impedance of the piezoelectric transducer and the stress intensity factors of a delamination are analysed in dependence on the delamination location.

Discrete singular convolution and spectral finite element method for predicting electromechanical impedance applied on rectangular plates

2017 ◽  
Vol 28 (18) ◽  
pp. 2473-2488 ◽  
Author(s):  
Naserodin Sepehry ◽  
Firooz Bakhtiari-Nejad ◽  
Mahnaz Shamshirsaz
Keyword(s):  
Finite Element Method ◽  
Health Monitoring ◽  
Three Dimensional ◽  
High Frequencies ◽  
Active Sensor ◽  
Piezoelectric Wafer ◽  
Discrete Singular Convolution ◽  
Spectral Finite Element Method ◽  
Spectral Finite Element ◽  
Element Method

The impedance-based structural health monitoring using piezoelectric wafer-active sensor has been increasingly developed for aerospace, civil, and mechanical structures. Using electromechanical coupling effects of piezoelectric wafer-active sensor, impedance of piezoelectric wafer-active sensor can detect any change in a structure. Piezoelectric wafer-active sensor is embedded and bounded to the structure in order to monitor the structure in a preferred frequency range. This article presented a general model to predict the impedance of piezoelectric wafer-active sensor bounded to a plate structure and also developed a general model for the influence of interaction of piezoelectric wafer-active sensor and plate on the structural response in impedance-based structural health monitoring. To obtain equations of vibrations, in the first step, potential and kinetic energies of fully free Kirchhoff and Mindlin plates with piezoelectric wafer-active sensor are derived. Numerical solutions for structural vibration of the plate developed using discrete singular convolution methods and applied based on Rayleigh–Ritz method in very high frequencies. After calculating mass and stiffness matrices of structure and piezoelectric wafer-active sensor, impedance of piezoelectric wafer-active sensor was determined using piezoelectric constitutive equations. Also, a three-dimensional spectral finite element method was used to model impedance of plate. An experimental setup was used for modal analysis to obtain low natural frequencies and calculate the impedance of piezoelectric wafer-active sensor in high frequencies. Finally, the comparison of numerical results of three-dimensional spectral element method and experimental results verified this model.

scholarly journals Acoustic emission sensor effect and waveform evolution during fatigue crack growth in thin metallic plate

2017 ◽  
Vol 29 (7) ◽  
pp. 1275-1284 ◽  
Author(s):  
Md Yeasin Bhuiyan ◽  
Bin Lin ◽  
Victor Giurgiutiu
Keyword(s):  
Acoustic Emission ◽  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Fatigue Loading ◽  
Emission Measurement ◽  
Acoustic Emission Sensor ◽  
Active Sensor ◽  
Piezoelectric Wafer ◽  
Sensor Transducer

In this article, the effect of the acoustic emission sensor on the acoustic emission waveforms from fatigue crack growth in a thin aerospace specimen is presented. In situ acoustic emission fatigue experiments were performed on the test coupons made of aircraft grade aluminum plate. Commercial Mistras S9225 acoustic emission sensor and piezoelectric wafer active sensor were used to capture the acoustic emission waveforms from the fatigue crack. It has been shown that the piezoelectric wafer active sensor transducer successfully captured the fatigue crack–related acoustic emission waveforms in the thin plate. The piezoelectric wafer active sensor transducer seems to capture more frequency information of the acoustic emission waveform than the conventional acoustic emission sensor in this particular application. We have also shown the evolution of the acoustic emission waveforms as the fatigue crack grows. The signatures of the fatigue crack growth were captured by the evolution of the acoustic emission waveforms. This waveform evolution is highly related to the physical boundary conditions of the cracks as well as the fatigue crack growth mechanism. The fatigue loading and acoustic emission measurement were synchronized using the same acoustic emission instrumentation. This synchronization provided the exact load level when the acoustic emission signals had occurred during the fatigue crack growth.

scholarly journals Piezoelectric wafer active sensor embedded ultrasonics in beams and plates

2003 ◽  
Vol 43 (4) ◽  
pp. 428-449 ◽  
Author(s):  
V. Giurgiutiu ◽  
J. Bao ◽  
W. Zhao
Keyword(s):  
Active Sensor ◽  
Piezoelectric Wafer
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