A new high-frequency photoacoustic sensing probe using silicon acoustic delay lines
A method for preparing and bonding ultrasonic transducers used in high frequency digital delay lines
1968 ◽
Vol 56
(8)
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pp. 1375-1376
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1964 ◽
Vol 11
(2)
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pp. 85-88
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2007 ◽
Vol 35
(1)
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pp. 201-210
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1985 ◽
Vol 43
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pp. 236-237
1986 ◽
Vol 44
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pp. 544-545
1996 ◽
Vol 54
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pp. 142-143
1992 ◽
Vol 1
(4)
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pp. 52-55
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