Cutting the closed curve shape inside glass with laser induced thermal-crack propagation

2020 ◽  
Author(s):  
Chunyang Zhao ◽  
Ye Ding ◽  
Lijun Yang ◽  
Yang Wang ◽  
Zhenlong Wang
Keyword(s):  
Crack Propagation ◽  
Closed Curve ◽  
Curve Shape ◽  
Thermal Crack

Laser beam induced thermal-crack propagation for asymmetric linear cutting of silicon wafer

2019 ◽  
Vol 120 ◽  
pp. 105765 ◽  
Author(s):  
Xiaoliang Cheng ◽  
Lijun Yang ◽  
Maolu Wang ◽  
Yecheng Cai ◽  
Yang Wang ◽  
...  
Keyword(s):  
Laser Beam ◽  
Crack Propagation ◽  
Silicon Wafer ◽  
Thermal Crack

scholarly journals Study on Thermally Induced Crack Propagation Behavior of Functionally Graded Materials Using a Modified Peridynamic Model

2020 ◽  
Vol 2020 ◽  
pp. 1-17
Author(s):  
Fei Wang ◽  
Yu’e Ma ◽  
Yanning Guo ◽  
Wei Huang
Keyword(s):  
Fracture Toughness ◽  
Crack Propagation ◽  
Functionally Graded Materials ◽  
Initial Temperature ◽  
Functionally Graded ◽  
Thermal Crack ◽  
Graded Materials ◽  
Ceramic Fracture ◽  
Thermally Induced ◽  
Peridynamic Model

Peridynamic (PD) theory is used to study the thermally induced cracking behavior of functionally graded materials (FGMs). A modified thermomechanical peridynamic model is developed. The thermal crack propagation of a ceramic slab in quenching is calculated to validate the modified PD model. The results predicted by the modified PD model agree with previously published numerical and experimental ones. Compared with the original PD model, the calculation accuracy of the modified PD model for thermal cracking is improved. The thermal cracking in FGMs is also simulated. The effects of material shape, initial temperature, and ceramic fracture toughness on thermal crack propagation behaviors are studied. It can be found that the thermal cracks in FGMs are still in periodical and hierarchical forms. The metal materials in FGMs can prevent crack initiation and arrest the long cracks. The crack number tends to be increased with the increasing initial temperature, while the strengthened ceramic fracture toughness can decrease it.

Thermal Crack Propagation Behavior on Nitrided H13 Hot Work Die Steel

2007 ◽  
pp. 1191-1194
Author(s):  
Kuk Tae Youn ◽  
Young Mok Rhyim ◽  
Jong Hoon Lee ◽  
Chan Gyu Lee ◽  
Dong Bae Kim ◽  
...  
Keyword(s):  
Crack Propagation ◽  
Thermal Crack ◽  
Die Steel ◽  
Propagation Behavior ◽  
Hot Work Die ◽  
Crack Propagation Behavior

An Evaluation of Thermal Fatigue Cracking and Chemical Reaction in Die Casting Mould

2007 ◽  
Vol 345-346 ◽  
pp. 701-704 ◽  
Author(s):  
Kuk Tae Youn ◽  
Young Mok Rhyim ◽  
Jong Hoon Lee ◽  
Chan Gyu Lee ◽  
Yun Chul Jung
Keyword(s):  
Crack Propagation ◽  
Chemical Reaction ◽  
Tool Steel ◽  
Thermal Fatigue ◽  
Die Casting ◽  
Compound Layer ◽  
Thermal Crack ◽  
Propagation Resistance ◽  
Crack Propagation Resistance ◽  
Hot Work Tool Steel

It is well known that the main failure mechanisms in die-casting mould are heat checking due to thermal fatigue and melt-out caused by chemical reaction between die and molten alloys. Thermal fatigue tests were carried out using the thermal cycle simulator to establish the proper method to estimate the thermal fatigue resistance of hot die steel. In this study, the thermal shock tester consisted of induction heating and water spray cooling unit was constructed to evaluate thermal crack propagation resistance and the sum of crack length per unit specimen length, Lm is proposed as the index representing the susceptibility to crack initiation and propagation. Also, new concept of measurement for the melt-out behavior was suggested. AISI H13 hot work tool steel was solution treated and tempered at various temperatures, to control the hardness and toughness that have effect on the behavior of thermal crack propagation. The result of thermal fatigue test showed that there is optimum value of hardness and impact energy to maximize the thermal crack propagation resistance. The influence of nitriding on melt-out resistance was also investigated. The dissolution rate due to melt-out phenomenon tended to be smaller for thicker compound layer. Furthermore, the resistance to melt-out was affected by the compound layer thickness rather than that of diffusion layer. The results of the both tests properly reflect the effect of materials properties on failure modes of die-casting mould and it means those test methods are suitable to evaluate the durability of hot work tool steel for die-casting.

A simple method for predicting the machinability in microwave cutting ceramics with microwave-induced thermal-crack propagation

2020 ◽  
Vol 109 (9-12) ◽  
pp. 2639-2651
Author(s):  
Chunyang Zhao ◽  
Xiaoliang Cheng ◽  
Hailong Wang ◽  
Yang Wang ◽  
Xin Dou ◽  
...  
Keyword(s):  
Crack Propagation ◽  
Thermal Crack ◽  
Simple Method ◽  
Cutting Ceramics

Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation

2017 ◽  
Vol 93 ◽  
pp. 49-59 ◽  
Author(s):  
Yecheng Cai ◽  
Maolu Wang ◽  
Hongzhi Zhang ◽  
Lijun Yang ◽  
Xihong Fu ◽  
...  
Keyword(s):  
Crack Propagation ◽  
Laser Cutting ◽  
Sandwich Structure ◽  
Glass Wafer ◽  
Thermal Crack

Research on Laser Induced Thermal-Crack Propagation Cutting Silicon Wafer

2012 ◽  
Vol 628 ◽  
pp. 211-216 ◽  
Author(s):  
C.Y. Zhao ◽  
Hong Zhi Zhang ◽  
Y. Wang
Keyword(s):  
Finite Element ◽  
Crack Propagation ◽  
Silicon Wafer ◽  
Optical Microscope ◽  
Propagation Mechanism ◽  
Thermal Crack ◽  
Technological Parameters ◽  
Material Loss ◽  
Finite Element Software ◽  
The Impact

Laser molten cutting silicon wafer was focused more recently, but this method has the material loss disadvantage. So this paper indicates the finite element simulation and experiments of cutting silicon wafer with YAG laser induced thermal-crack propagation. A theoretical model of a thermal laser shock method for separation of the silicon wafer is developed, and the fracture propagation mechanism is studied by the stress fields using finite element software ABAQUS. Optical microscope and laser scan confocal microscope (LSCM) photographs of the separation surface and path are obtained to examine the cutting quality. The impact of technological parameters on the cutting quality is studied and the optimum processing parameters are presented in the paper.

Curve Cutting ZrO2 Ceramic and Cooling Lower Surface Cutting Silicon Wafer with Laser Induced Thermal-Crack Propagation

2014 ◽  
Vol 711 ◽  
pp. 222-226
Author(s):  
Chun Yang Zhao ◽  
Hong Zhi Zhang ◽  
Li Jun Yang ◽  
Yang Wang
Keyword(s):  
Finite Element ◽  
Crack Propagation ◽  
Silicon Wafer ◽  
Fracture Mechanism ◽  
Brittle Materials ◽  
Lower Surface ◽  
Thermal Crack ◽  
Surface Absorption ◽  
Finite Element Software

In laser induced thermal crack propagation (LITP) cutting brittle materials, according to the laser absorption ability, materials are divided into the body absorption and surface absorption. This paper indicates the fracture mechanism of LITP cutting surface absorption brittle materials. The crack extension appears in the lower surface firstly in this stress distribution state, then the crack extends to the upper surface and the laser scanning direction with the LITP cutting. The stress field of cutting ZrO2 ceramic is studied by finite element software ANSYS. The crack propagation process of cutting silicon wafer is studied by finite element software ABAQUS. According to the fracture mechanism, the curve cutting the ZrO2 ceramic experiments and the cooling lower surface cutting the silicon wafer experiments are carried out in this paper. Optical microscope and laser scan confocal microscope (LSCM) photographs of the curve path the ZrO2 ceramic and separation surface cutting the silicon wafer are obtained to examine the cutting quality. The quality of the curve path is very good. The quality of the separation surface in cutting the silicon wafer with the cooling lower surface is better than conventional environment.

Thermal Crack Propagation Behavior on Nitrided H13 Hot Work Die Steel

2007 ◽  
Vol 26-28 ◽  
pp. 1191-1194 ◽  
Author(s):  
Kuk Tae Youn ◽  
Young Mok Rhyim ◽  
Jong Hoon Lee ◽  
Chan Gyu Lee ◽  
Dong Bae Kim ◽  
...  
Keyword(s):  
Crack Propagation ◽  
Thermal Fatigue ◽  
Thermal Crack ◽  
Die Steel ◽  
Thermal Fatigue Test ◽  
Propagation Behavior ◽  
Heat Treated ◽  
Nitrided Specimen ◽  
Hot Work Die ◽  
Crack Propagation Behavior

The influence of nitriding type and condition on the thermal crack propagation behavior of hot work die steel was investigated. Thermal fatigue tests were carried out using a special apparatus, which is consisted of induction heating and water spray cooling unit. The sum of crack length per unit specimen length, Lm is proposed as an index representing the susceptibility to crack propagation. The Lm values of the gas and ion nitrided specimens were lower than that of as-heat treated specimen. But in the case of maximum and average crack length of nitrided specimen was higher than those of as-heat treated specimen. The nitrogen diffusion layer still remained although the oxide scale was formed and fell off during thermal fatigue test. After 1000 cycles of the thermal fatigue test, the interior region of nitrided specimen showed lower hardness by softening. In particular, ion nitrided specimens of relatively less softening condition showed reduction both the depth and number of cracks compared with the other surface conditions.

Sign in / Sign up

Export Citation Format

Share Document