Low capacitance SWIR photodetectors for high speed sensing applications

Author(s):  
Wei Zhang ◽  
Michael Evans ◽  
John Liobe ◽  
Wei Huang ◽  
Paul Bereznycky ◽  
...  
2019 ◽  
Vol 0 (0) ◽  
Author(s):  
IS Amiri ◽  
Ahmed Nabih Zaki Rashed ◽  
P. Yupapin

AbstractThis paper has outlined high-speed transmission circuits signaling in guided or unguided optical communication systems. An efficient prediction scheme to predict the signal distortion caused by intersymbol interference. As high-speed digital signals exceed many gigabits per second speeds, eye diagrams provide the means to quickly and accurately measure signal quality and system performance. Semiconductor understands the capacitance constraints that designers are faced with when using these high-speed interfaces and offers a wide line of ultra-low capacitance electrical spectral density protection devices that service these interfaces, and the noise can be reduced at the optimum circuit at both bandwidths of 167 MHz, and bandwidth of 200 MHz.


2009 ◽  
Vol 17 (10) ◽  
pp. 7901 ◽  
Author(s):  
Long Chen ◽  
Michal Lipson
Keyword(s):  

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000616-000632
Author(s):  
Philip Reiner ◽  
Arthur Jenkins ◽  
Sharon Sanchez ◽  
Tracy D. Hudson ◽  
Michael Kranz

MEMS based technologies provide a unique opportunity to develop micro-machined mechanical transducers for a variety of sensing applications. The micro-machining techniques that have been widely used for MEMS sensors provide a viable path for developing miniature sensors required for monitoring stress and strain for high speed impacts. Moreover, this technology allows sensors to be tailored to respond to specific vibrational modes and mode types. In particular, the electro-mechnical properties must be able to support very short response times without compromising signal strength. In this paper, we present the design and fabrication of micro-miniature PNZT based transducers for short duration mechanical impacts. Comparisons of their performance with conventional PZT transducers are presented. A discussion is also given of key performance parameters and the effects of post-fabrication processing and packaging on transducer performance.


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