Effects of soil properties, emplacement depth, and object composition on thermal signature

Author(s):  
Susan Frankenstein ◽  
Anna M. Wagner ◽  
Jay L. Clausen
2014 ◽  
Vol 11 (1) ◽  
pp. 15
Author(s):  
Set Foong Ng ◽  
Pei Eng Ch’ng ◽  
Yee Ming Chew ◽  
Kok Shien Ng

Soil properties are very crucial for civil engineers to differentiate one type of soil from another and to predict its mechanical behavior. However, it is not practical to measure soil properties at all the locations at a site. In this paper, an estimator is derived to estimate the unknown values for soil properties from locations where soil samples were not collected. The estimator is obtained by combining the concept of the ‘Inverse Distance Method’ into the technique of ‘Kriging’. The method of Lagrange Multipliers is applied in this paper. It is shown that the estimator derived in this paper is an unbiased estimator. The partiality of the estimator with respect to the true value is zero. Hence, the estimated value will be equal to the true value of the soil property. It is also shown that the variance between the estimator and the soil property is minimised. Hence, the distribution of this unbiased estimator with minimum variance spreads the least from the true value. With this characteristic of minimum variance unbiased estimator, a high accuracy estimation of soil property could be obtained.


2020 ◽  
Vol 16 (2) ◽  
pp. 41-63
Author(s):  
V.L. Zakharov ◽  
◽  
G.N. Pugachev ◽  

2018 ◽  
Vol 32 (5) ◽  
pp. 37
Author(s):  
Rajaram Majhi ◽  
Gouri Sankar Bhunia ◽  
Tapan Kumar Das ◽  
Pravat Kumar Shit ◽  
Rabindranath Chattopadhyay

2020 ◽  
Vol 5 (2) ◽  
pp. 37-42
Author(s):  
Inobat Ruzieva ◽  
◽  
Inobat Ruzieva ◽  
Islom Xaitov ◽  
Ulug`berdi Xursanov

Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.


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