Investigation of laser ablation destruction of polymer materials

2019 ◽  
Author(s):  
Oleg V. Mkrtychev ◽  
Valerii G. Shemanin ◽  
Yurii V. Shevtsov
Keyword(s):  
Laser Ablation ◽  
Polymer Materials

Optical strength of polymer materials subjected to laser ablation-induced destruction

2009 ◽  
Vol 54 (5) ◽  
pp. 746-748 ◽  
Author(s):  
E. I. Voronina ◽  
V. P. Efremov ◽  
V. E. Privalov ◽  
P. V. Chartiy ◽  
V. G. Shemanin
Keyword(s):  
Laser Ablation ◽  
Polymer Materials ◽  
Optical Strength

Laser ablation thresholds of polymer materials studies

2004 ◽  
Author(s):  
Ellina I. Voronina ◽  
Vladimir P. Efremov ◽  
Vadim E. Privalov ◽  
Valery G. Shemanin
Keyword(s):  
Laser Ablation ◽  
Polymer Materials

Energy efficiency of femtosecond laser ablation of polymer materials

2012 ◽  
Vol 79 (1) ◽  
pp. 104-112 ◽  
Author(s):  
E. Yu. Loktionov ◽  
A. V. Ovchinnikov ◽  
Yu. Yu. Protasov ◽  
Yu. S. Protasov ◽  
D. S. Sitnikov
Keyword(s):  
Energy Efficiency ◽  
Laser Ablation ◽  
Femtosecond Laser ◽  
Femtosecond Laser Ablation ◽  
Polymer Materials

scholarly journals Compact high-power optical source for resonant infrared pulsed laser ablation and deposition of polymer materials

2006 ◽  
Vol 14 (25) ◽  
pp. 12302 ◽  
Author(s):  
V. Z. Kolev ◽  
M. W. Duering ◽  
B. Luther-Davies ◽  
A. V. Rode
Keyword(s):  
Laser Ablation ◽  
High Power ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Polymer Materials ◽  
Optical Source

Fabrication Process Development and Characterization of Polymethylhydrosiloxane (PMHS) for Surface-Modified Microfluidic Chips

2007 ◽  
Author(s):  
Mukund Vijay ◽  
Ehson Ghandehari ◽  
Michel Goedert ◽  
Sang-Joon J. Lee
Keyword(s):  
Laser Ablation ◽  
Soft Lithography ◽  
Process Development ◽  
High Surface ◽  
Volume Ratio ◽  
Fused Silica ◽  
Polymer Materials ◽  
Microfluidic Chips ◽  
Separation Processes

Microfluidic chips made of polymer materials such as polydimethylsiloxane (PDMS), polyimide, and cyclic olefin co-polymer have cost and manufacturing advantages over materials such as fused silica and borosilicate glass. While these materials have been extensively investigated, polymethylhydrosiloxane (PMHS) is an alternative that has a unique combination of properties in terms of UV transparency and potential for chemical surface modification. The present study investigates process development and characterization of PMHS as a new candidate material for microfluidic chip applications, in particular separation processes that would benefit from the ability to custom-engineer its surface conditions. This paper compares different approaches for fabricating microchannel features as well as options for enhancing the surface area of the channel walls. The fabrication methods include replication by casting over patterned molds, soft lithography casting, and material removal by laser ablation. Casting into solid form is achieved in 48-hours at 110 °C. Laser ablation is studied with energy dose varying from 2 mJ to 160 mJ per millimeter scanned, with channels approximately 100 microns wide occurring at 0.2 mJ/mm. Mechanical characterization is applied to quantify the hardness of cast PMHS, because fine-resolution features are limited by mold removal. PMHS samples have been measured to have a Shore A hardness of 46.2, similar to PDMS that is well-established in polymer microfluidic devices. Surface enhancement techniques including laser and plasma treatment are investigated for the prospective benefit of separation processes that require high surface-to-volume ratio. Spectrophotometry shows that PMHS exhibits transmittance even below 250 nm, which is favorable for sample analysis by UV absorption methods.

Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser Ablation

2017 ◽  
Vol 2017 (1) ◽  
pp. 000113-000119
Author(s):  
Habib Hichri ◽  
Shohei Fujishima ◽  
Seongkuk Lee ◽  
Markus Arendt ◽  
Shigeo Nakamura
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Cost Reduction ◽  
High Energy ◽  
Polymer Materials ◽  
Large Field ◽  
Laser Source ◽  
Wafer Level ◽  
Excimer Laser Ablation ◽  
Laser Patterning

Abstract Fan-Out technologies continue to be the main driver for advanced packaging, be it on wafer level (FOWLP) or panel level (FOPLP). There is a continuing need for higher density routing and heterogeneous integration of different devices, but also for continuous cost reduction. While traditional organic flip-chip substrates using semi-additive processes (SAP) have not been able to scale to ultra-fine RDL pitches and via opening below 10um, photo-sensitive spin-on dielectrics and RDL processes used for wafer level packaging do not sufficiently address the cost reduction need, and also face serious technical challenges. This paper presents the latest results from an innovative package RDL and micro via processes using excimer laser ablation in an especially developed non-photo sensitive material, to meet the market's most stringent requirements. To enable panel and wafer based interposers to reduce RDL cost and scale interconnect pitch to 40um and below, excimer laser ablation is introduced as a direct patterning process that uses proven industrialized excimer laser sources to emit high-energy pulses at short wavelengths to remove polymer materials with high precision and high throughput. The combination of a high-power excimer laser source, large-field laser mask and precision projection optics enables the accurate replication and placement of fine resolution circuit patterns without the need for any wet-processing. With excimer laser patterning technology the industry gains a much wider choice of dielectric materials (photo and non-photo) to help achieve further reductions in manufacturing costs as well as enhancements in interposer and package performance. In this paper, we propose a novel patterning process that uses excimer laser ablation to integrate via and RDL traces in one patterning step, followed by seed layer deposition, plating and planarization. The capability of this excimer laser patterning process in non-photo materials Ajinomoto Build-up Film, which is abbreviated to “ABF” in this paper, will be discussed, and its technical robustness and commercial advantages are demonstrated. We will present electrical and reliability data of Via and RDL traces patterned by excimer laser in ABF material.

scholarly journals Laser ablation of various polymer materials.

1992 ◽  
Vol 5 (2) ◽  
pp. 289-296 ◽  
Author(s):  
MASAMI INOUE ◽  
KEIKO ITO ◽  
NOBUHIKO OHMORI
Keyword(s):  
Laser Ablation ◽  
Polymer Materials
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