Efficient light collection from a micromirror array: towards simultaneous hyperspectral and hypertemporal mapping of luminophores (Conference Presentation)

2020 ◽  
Author(s):  
Lukas Klein ◽  
Karel Zidek
Keyword(s):  
Light Collection ◽  
Micromirror Array

Advancements in the Micromirror Array Projector Technology

2003 ◽  
Author(s):  
D. B. Beasley ◽  
Matt Bender ◽  
Jay Crosby ◽  
Tim Messer ◽  
Daniel A. Saylor
Keyword(s):  
Micromirror Array

Normal and resonance Raman spectroelectrochemistry with fiber optic light collection

1986 ◽  
Vol 58 (12) ◽  
pp. 2486-2492 ◽  
Author(s):  
Scott D. Schwab ◽  
Richard L. McCreery ◽  
F. Trevor. Gamble
Keyword(s):  
Fiber Optic ◽  
Resonance Raman ◽  
Light Collection

Design and simulation of a micromirror array for a projection TV

1999 ◽  
Author(s):  
Bumkyoo Choi ◽  
Junghoon Lee ◽  
Kyuwon Jung ◽  
Hyungjae Shin
Keyword(s):  
Micromirror Array

scholarly journals Influence of a Surface Finishing Method on Light Collection Behaviour of PWO Scintillator Crystals

Photonics ◽  
2018 ◽  
Vol 5 (4) ◽  
pp. 47 ◽  
Author(s):  
Daniele Rinaldi ◽  
Luigi Montalto ◽  
Michel Lebeau ◽  
Paolo Mengucci
Keyword(s):  
High Energy Physics ◽  
Collection Efficiency ◽  
Removal Rate ◽  
Light Yield ◽  
Grazing Incidence ◽  
Structural Condition ◽  
High Energy ◽  
Production Performance ◽  
Surface Finishing ◽  
Light Collection

In the field of scintillators, high scintillation and light production performance require high-quality crystals. Although the composition and structure of crystals are fundamental in this direction, their ultimate optical performance is strongly dependent on the surface finishing treatment. This paper compares two surface finishing methods in terms of the final structural condition of the surface and the relative light yield performances. The first polishing method is the conventional “Mechanical Diamond Polishing” (MDP) technique. The second polishing technique is a method applied in the electronics industry which is envisaged for finishing the surface treatment of scintillator crystals. This method, named “Chemical Mechanical Polishing” (CMP), is efficient in terms of the cost and material removal rate and is expected to produce low perturbed surface layers, with a possible improvement of the internal reflectivity and, in turn, the light collection efficiency. The two methods have been applied to a lead tungstate PbWO4 (PWO) single crystal due to the wide diffusion of this material in high energy physics (CERN, PANDA project) and diagnostic medical applications. The light yield (LY) values of both the MDP and CMP treated crystals were measured by using the facilities at CERN while their surface structure was investigated by Scanning Electron Microscopy (SEM) and Grazing Incidence X-ray Diffraction (GID). We present here the corresponding optical results and their relationship with the processing conditions and subsurface structure.

High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array

2003 ◽  
Author(s):  
C. C. Wang ◽  
T. D. Kudrle ◽  
M. Bancu ◽  
J. Hsiao ◽  
C. H. Mastrangelo
Keyword(s):  
Flip Chip ◽  
High Density ◽  
Anodic Bonding ◽  
Thermal Coefficient ◽  
Electrical Interconnects ◽  
Via Holes ◽  
Multiple Levels ◽  
Micromirror Array

A method for the construction of high density (2.4 mm−2) vertical leads through a pyrex substrate is presented. The pyrex substrate behaves as a TCE (Thermal Coefficient of Expansion) matched interposer that permits anodic bonding of silicon micromirrors on one side and flip-chip bumping of multiplexing electronic chips on its opposite side. Electrical leads consist of 250±25 μm-diameter holes formed by AJM machining and coated with evaporated Au yielding via resistances of 0.5–0.7 Ω. The via holes are sealed with a new spin-cast polyimide tenting process that enables the subsequent patterning of multiple levels of metal using conventional lithographic techniques.

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