Research on picosecond laser processing technology of ceramic materials involving incident angle

2019 ◽  
Author(s):  
Heng Wang ◽  
Xiaoxiao Chen ◽  
Wenwu Zhang
Keyword(s):  
Laser Processing ◽  
Incident Angle ◽  
Picosecond Laser ◽  
Ceramic Materials ◽  
Processing Technology

Research and Application of Massive Micropores Water-Assisted Picosecond Laser Processing Technology

2020 ◽  
Vol 47 (3) ◽  
pp. 0302002
Author(s):  
朱帅杰 Zhu Shuaijie ◽  
张朝阳 Zhang Zhaoyang ◽  
储松林 Chu Songlin ◽  
杨志逸 Yang Zhiyi ◽  
张先烁 Zhang Xianshuo ◽  
...  
Keyword(s):  
Laser Processing ◽  
Picosecond Laser ◽  
Processing Technology

scholarly journals High Quality Laser Processing Technology with Deep Ultraviolet Picosecond Laser

2017 ◽  
Vol 45 (9) ◽  
pp. 554
Author(s):  
Junichi NISHIMAE ◽  
Masashi YOSHIMURA ◽  
Yusuke MORI ◽  
Yosuke ORII
Keyword(s):  
Laser Processing ◽  
Picosecond Laser ◽  
Processing Technology ◽  
High Quality ◽  
Deep Ultraviolet

The Effect of Parameters of Laser Processing on the Morphology of Glaze Cladding

2012 ◽  
Vol 586 ◽  
pp. 265-268 ◽  
Author(s):  
Ji Wei Fan ◽  
Zhi Qiang Jiao ◽  
Xiao Peng Li ◽  
Hui Jun Zhao ◽  
Zhen Guo Zhang ◽  
...  
Keyword(s):  
Output Power ◽  
Processing Speed ◽  
Laser Processing ◽  
Ceramic Materials ◽  
Processing Parameters ◽  
Laser Technique ◽  
Experimental Conditions ◽  
Melted Zone

Laser processing ceramic materials is a new application of laser technique. This paper presents the study of laser processing parameters of glaze cladding. It found out that the parameters of laser processing affected the morphology of glaze cladding significantly. Within the experimental conditions, rise of output power or drop of processing speed can increase the depth of melted zone and the width of glaze cladding, vice versa.

Effect of Laser Processing Parameters on Microhole Quality of Aluminium Nitride Ceramics

2021 ◽  
Vol 871 ◽  
pp. 277-283
Author(s):  
Chun Yan Yang ◽  
Yun Hao ◽  
Bozhe Wang ◽  
Hai Yuan ◽  
Liu Hui Li
Keyword(s):  
Laser Processing ◽  
Laser Power ◽  
Picosecond Laser ◽  
Scanning Speed ◽  
Processing Parameters ◽  
Recast Layer ◽  
Aluminium Nitride ◽  
Obvious Effect ◽  
Nitride Ceramics

A picosecond laser in spin-cutting mode was used to drill 500μm diameter microholes on 150μm thick aluminium nitride ceramic. The effects of laser processing parameters such as the laser power, scanning speed, and defocus amount on the microhole quality were studied. The results show that as the laser power increases, the inlet and outlet diameters of the holes increase, the taper decreases slightly, and the thickness of the recast layer decreases evidently. The scanning speed has no obvious effect on the diameter and taper of the hole; however, the hole can not be drilled through when the speed is too large. Positive defocus can effectively reduce the taper of the hole. Under 28.5W laser power, 400Hz frequency, 200mm/s scanning speed, and zero defocus amount conditions, high-quality microholes with a taper of 0.85° were obtained.

Residual heat generated during laser processing of CFRP with picosecond laser pulses

2018 ◽  
Vol 7 (3) ◽  
pp. 157-163
Author(s):  
Christian Freitag ◽  
Leon Pauly ◽  
Daniel J. Förster ◽  
Margit Wiedenmann ◽  
Rudolf Weber ◽  
...  
Keyword(s):  
Laser Pulse ◽  
Heat Affected Zone ◽  
Laser Processing ◽  
Picosecond Laser ◽  
Theoretical Models ◽  
Laser Pulses ◽  
Groove Depth ◽  
Interaction Zone ◽  
Heat Accumulation ◽  
Residual Heat

Abstract One of the major reasons for the formation of a heat-affected zone during laser processing of carbon fiber-reinforced plastics (CFRP) with repetitive picosecond (ps) laser pulses is heat accumulation. A fraction of every laser pulse is left as what we termed residual heat in the material also after the completed ablation process and leads to a gradual temperature increase in the processed workpiece. If the time between two consecutive pulses is too short to allow for a sufficient cooling of the material in the interaction zone, the resulting temperature can finally exceed a critical temperature and lead to the formation of a heat-affected zone. This accumulation effect depends on the amount of energy per laser pulse that is left in the material as residual heat. Which fraction of the incident pulse energy is left as residual heat in the workpiece depends on the laser and process parameters, the material properties, and the geometry of the interaction zone, but the influence of the individual quantities at the present state of knowledge is not known precisely due to the lack of comprehensive theoretical models. With the present study, we, therefore, experimentally determined the amount of residual heat by means of calorimetry. We investigated the dependence of the residual heat on the fluence, the pulse overlap, and the depth of laser-generated grooves in CRFP. As expected, the residual heat was found to increase with increasing groove depth. This increase occurs due to an indirect heating of the kerf walls by the ablation plasma and the change in the absorbed laser fluence caused by the altered geometry of the generated structures.

Laser processing of GaN-based LEDs with ultraviolet picosecond laser pulses

2012 ◽  
Author(s):  
Rüdiger Moser ◽  
Michael Kunzer ◽  
Christian Goßler ◽  
Ralf Schmidt ◽  
Klaus Köhler ◽  
...  
Keyword(s):  
Laser Processing ◽  
Picosecond Laser ◽  
Laser Pulses ◽  
Picosecond Laser Pulses

Laser processing of gallium nitride–based light-emitting diodes with ultraviolet picosecond laser pulses

2012 ◽  
Vol 51 (11) ◽  
pp. 114301 ◽  
Author(s):  
Rüdiger Moser ◽  
Michael Kunzer ◽  
Christian Goßler ◽  
Klaus Köhler ◽  
Wilfried Pletschen ◽  
...  
Keyword(s):  
Gallium Nitride ◽  
Laser Processing ◽  
Light Emitting Diodes ◽  
Picosecond Laser ◽  
Laser Pulses ◽  
Light Emitting ◽  
Picosecond Laser Pulses

scholarly journals Ultrafine and nanoparticle formation and emission mechanisms during laser processing of ceramic materials

2015 ◽  
Vol 88 ◽  
pp. 48-57 ◽  
Author(s):  
A.S. Fonseca ◽  
M. Viana ◽  
X. Querol ◽  
N. Moreno ◽  
I. de Francisco ◽  
...  
Keyword(s):  
Laser Processing ◽  
Ceramic Materials ◽  
Nanoparticle Formation
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