Temperature-dependent plasmonic properties as a key to high-temperature nanophotonic designs (Conference Presentation)

2019 ◽  
Author(s):  
Alexandra Boltasseva ◽  
Harsha V. Reddy ◽  
Urcan Guler ◽  
Zhaxylyk A. Kudyshev ◽  
Shaimaa I. Azzam ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Dependent

scholarly journals Using Reverse Osmosis Membrane at High Temperature for Water Recovery and Regeneration from Thermo-Responsive Ionic Liquid-Based Draw Solution for Efficient Forward Osmosis

Membranes ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 588
Author(s):  
Eiji Kamio ◽  
Hiroki Kurisu ◽  
Tomoki Takahashi ◽  
Atsushi Matsuoka ◽  
Tomohisa Yoshioka ◽  
...  
Keyword(s):  
Ionic Liquid ◽  
High Temperature ◽  
Energy Saving ◽  
Osmotic Pressure ◽  
Reverse Osmosis ◽  
Forward Osmosis ◽  
Solution Temperature ◽  
Water Recovery ◽  
Temperature Dependent ◽  
Draw Solution

Forward osmosis (FO) membrane process is expected to realize energy-saving seawater desalination. To this end, energy-saving water recovery from a draw solution (DS) and effective DS regeneration are essential. Recently, thermo-responsive DSs have been developed to realize energy-saving water recovery and DS regeneration. We previously reported that high-temperature reverse osmosis (RO) treatment was effective in recovering water from a thermo-responsive ionic liquid (IL)-based DS. In this study, to confirm the advantages of the high-temperature RO operation, thermo-sensitive IL-based DS was treated by an RO membrane at temperatures higher than the lower critical solution temperature (LCST) of the DS. Tetrabutylammonium 2,4,6-trimethylbenznenesulfonate ([N4444][TMBS]) with an LCST of 58 °C was used as the DS. The high-temperature RO treatment was conducted at 60 °C above the LCST using the [N4444][TMBS]-based DS-lean phase after phase separation. Because the [N4444][TMBS]-based DS has a significantly temperature-dependent osmotic pressure, the DS-lean phase can be concentrated to an osmotic pressure higher than that of seawater at room temperature (20 °C). In addition, water can be effectively recovered from the DS-lean phase until the DS concentration increased to 40 wt%, and the final DS concentration reached 70 wt%. From the results, the advantages of RO treatment of the thermo-responsive DS at temperatures higher than the LCST were confirmed.

Experimental and Numerical Characterisation of the Cyclic Thermo-Mechanical Behaviour of a High Temperature Forming Tool Alloy

2009 ◽  
Author(s):  
Aditya Deshpande ◽  
Sean B. Leen ◽  
Thomas H. Hyde
Keyword(s):  
High Temperature ◽  
Life Prediction ◽  
Creep Behaviour ◽  
Material Constant ◽  
Superplastic Forming ◽  
Material Model ◽  
Future Application ◽  
Temperature Dependent ◽  
Rate Dependent ◽  
Nickel Chromium

This paper describes high temperature cyclic and creep relaxation testing and modelling of a high nickel-chromium material (XN40F) for application to the life prediction of superplastic forming (SPF) tools. An experimental test programme to characterise the high temperature cyclic elastic-plastic-creep behaviour of the material over a range of temperatures between 20°C and 900°C is described. The objective of the material testing is the development of a high temperature material model for cyclic analyses and life prediction of superplastic forming (SPF) dies for SPF of titanium aerospace components. A two-layer visco-plasticity model which combines both creep and combined isotropic-kinematic plasticity is chosen to represent the material behaviour. The process of material constant identification for this model is presented and the predicted results are compared with the rate-dependent (isothermal) experimental results. The temperature-dependent material model is furthermore applied to simulative thermo-mechanical fatigue (TMF) tests, designed to represent the temperature and stress-strain cycling associated with the most damaging phase of the die cycle. The model is shown to give good correlation with the test data, thus vindicating future application of the material model in thermo-mechanical analyses of SPF dies, for distortion and life prediction.

Effects of Thermal Exposure on Microstructure and Mechanical Properties of Ni Based Superalloy GTD111

2011 ◽  
Vol 275 ◽  
pp. 31-34 ◽  
Author(s):  
Han Sang Lee ◽  
Keun Bong Yoo ◽  
Doo Soo Kim ◽  
Jae Hoon Kim
Keyword(s):  
High Temperature ◽  
Gas Turbine ◽  
Operating Temperature ◽  
Rupture Strength ◽  
Mechanical Test ◽  
Thermal Exposure ◽  
Creep Rupture Strength ◽  
Material Degradation ◽  
Temperature Dependent ◽  
Hot Gas

The rotating components in the hot sections of land-based gas turbine are exposed to severe environment during several ten thousand hours at above 1100 oC operating temperature. The failure mechanism of the hot gas components would be accompanied by material degradation in the properties of high temperature and creep rupture strength. Many hot gas components in gas turbine are made of Ni-based superalloy because of their high temperature performance. In this work, we surveyed the time and temperature dependent degradation of Ni-based superalloy. We prepared the specimens from GTD111 that are exposed at 871 oC and 982 oC in 1,000 ~ 10,000 hours. We carried out the mechanical test and microstructural observation.

High-temperature-dependent optical properties of ZnO film on sapphire substrate

2008 ◽  
Vol 516 (6) ◽  
pp. 1137-1141 ◽  
Author(s):  
Chenghua Sui ◽  
Naibo Chen ◽  
Xiaojun Xu ◽  
Gaoyao Wei ◽  
Pinggen Cai ◽  
...  
Keyword(s):  
Optical Properties ◽  
High Temperature ◽  
Sapphire Substrate ◽  
Zno Film ◽  
Temperature Dependent

scholarly journals Thermoregulation of Escherichia coli hchA Transcript Stability

2007 ◽  
Vol 189 (15) ◽  
pp. 5779-5781 ◽  
Author(s):  
Aviram Rasouly ◽  
Yotam Shenhar ◽  
Eliora Z. Ron
Keyword(s):  
Escherichia Coli ◽  
High Temperature ◽  
Low Temperatures ◽  
Temperature Dependent ◽  
Present Evidence ◽  
Transcript Stability

ABSTRACT The conserved chaperone Hsp31 of Escherichia coli is transcribed at low temperatures by σS and repressed by H-NS, whereas at high temperature, transcription is by σ70 independently of both σS and H-NS. Here we present evidence for an additional, novel, temperature-dependent control of Hsp31 expression by increased transcript stability.

Improvement of Dielectric Performance of a Prototype AlN High Temperature Chip-level Package

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000052-000057 ◽  
Author(s):  
Liang-Yu Chen
Keyword(s):  
High Temperature ◽  
Dielectric Properties ◽  
High Temperatures ◽  
Substrate Surface ◽  
Substrate Material ◽  
Glass Coating ◽  
Temperature Dependent ◽  
High Temperature Electronics ◽  
Dielectric Performance ◽  
Parasitic Parameters

Aluminum nitride (AlN) has been proposed as a packaging substrate material for reliable high temperature electronics operating in a wide temperature range. However, it was discovered in a recent study that the dielectric properties of some commercial polycrystalline AlN materials change quite significantly with temperature at high temperatures. These material properties resulted in undesired large and temperature-dependent parasitic parameters for a prototype chip-level package based on an AlN substrate with the yttrium oxide dopant. This paper reports a method using a coating layer of a commercial thick-film glass on the AlN substrate surface to significantly reduce both the parasitic capacitances and parasitic conductances between neighboring inputs/outputs (I/Os) of a prototype AlN chip-level package. The parasitic parameters of 8-I/Os low power chip-level packages with the insulating glass coating were characterized at frequencies from 120 Hz to 1 MHz between room temperature and 500°C. These results were compared with the parameters of AlN packages without the glass coating. The results indicate that the parasitic capacitances and conductances between I/Os of the improved prototype AlN packages are significantly reduced and stable at high temperatures. The method using a glass coating provides a feasible way to mitigate the temperature dependence of dielectric properties of AlN and further utilize AlN as a reliable packaging substrate material for high temperature applications.

scholarly journals Pauli-limit upper critical field of high-temperature superconductor La1.84Sr0.16CuO4

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Daisuke Nakamura ◽  
Tadashi Adachi ◽  
Keisuke Omori ◽  
Yoji Koike ◽  
Shojiro Takeyama
Keyword(s):  
High Temperature ◽  
Critical Field ◽  
High Temperature Superconductor ◽  
Upper Critical Field ◽  
Small Contribution ◽  
Spin Orbit Coupling ◽  
Temperature Dependent ◽  
First Order ◽  
First Order Phase Transition ◽  
First Order Phase

AbstractThe upper critical field of a cuprate high-temperature superconductor, La1.84Sr0.16CuO4, was investigated by high-frequency self-resonant contactless electrical conductivity measurements in magnetic fields up to 102 T. An irreversible transition was observed at 85 T (T = 4.2 K), defined as the upper critical field. The temperature-dependent upper critical field was argued on the basis of the Werthamer-Helfand-Hohenberg theory. The Pauli-limiting pair-breaking process with a small contribution of the spin-orbit coupling explained the first-order phase transition exhibiting a hysteresis observed at low temperatures.

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