scholarly journals Frequency doubling, absorption, and grating formation in glass fibers: effective defects or defective effects?

Author(s):  
Philip S. Russell ◽  
L. J. Poyntz-Wright ◽  
Duncan P. Hand
1988 ◽  
Author(s):  
Walter Margulis ◽  
Ulf Osterberg

1991 ◽  
Vol 1 (9) ◽  
pp. 1563-1567
Author(s):  
M. D. Selker ◽  
N. M. Lawandy

Author(s):  
Daniel Nuez ◽  
Phoumra Tan

Abstract Conductive anodic filament (CAF) formation is a mechanism caused by an electrochemical migration of metals from a metal trace in ICs or in PCBs. This is commonly caused by the moisture build-up in the affected metal terminals in an IC package or PC board caused by critical temperature, high humidity and high voltage gradients conditions. This phenomenon is known to have caused catastrophic field failures on various OEMs electronic components in the past [1,7]. Most published articles on CAF described the formation of the filament in a lateral formation through the glass fiber interfaces between two adjacent metal planes [1-6, 8-12]. One common example is the CAF formation seen between PTH (Plated through Hole) in the laminated substrate with two different potentials causing shorts [1-6, 8-12]. In this paper, the Cu filament grows in a vertical fashion (z-axis formation) creating a vertical plane shorts between the upper and lower metal terminals in a laminated IC package substrate. The copper growth migration does not follow the fiber strands laterally or vertically through them. Instead, it grows through the stress created gaps between the impregnated carbon epoxy fillers from the upper metal trace to the lower metal trace with two different potentials, between the glass fibers. This vertical CAF mechanism creates a low resistive short that was sometimes found to be intermittent in nature. This paper presents some successful failure analysis approaches used to isolate and detect the failure locations for this type of failing devices. This paper also exposes the unique physical appearance of the vertical CAF formation.


1993 ◽  
Vol 29 (1) ◽  
pp. 77-78 ◽  
Author(s):  
L.E. Busse ◽  
L. Goldberg ◽  
D. Mehuys ◽  
G. Mizell

2021 ◽  
pp. 089270572199319
Author(s):  
Gustavo B Carvalho

Ternary hybrid composites of Polypropylene (PP)/Short Glass Fibers (GF)/Hollow Glass Beads (HGB) were prepared using untreated and aminosilane-treated HGB, compatibilized with maleated-PP, and with varying total and relative GF/HGB contents. Static/short-term flexural strength properties data revealed, through lower flexural strength values, that the presence of untreated HGB particles induces to fiber-polymer interfacial decoupling at much higher extent than in the presence of aminosilane-treated HGB particles. This phenomenon is also evident when evaluating the data from displacement-controlled three-point bending fatigue tests. Monitored up to 106 cycles, the analyzed hybrid composites presented distinct performance relative to their fatigue stress relaxation rate: the lower the matrix-reinforcements’ interfacial adhesion, more pronounced the stress relaxation rate as a function of the number of fatigue cycles. Dynamic Mechanical Thermal Analysis (DMTA) results could successfully reveal the hybrid composites behavior at the microstructural level when they were submitted to both static flexural test and fatigue, depending on the degree of interfacial interactions between the polymer matrix of PP and the hybrid reinforcements of GF and HGB (with and without aminosilane surface treatment).


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