Amorphous silicon x-ray image sensor

Author(s):  
Jean Chabbal ◽  
Christophe Chaussat ◽  
Thierry Ducourant ◽  
Lionel Fritsch ◽  
Jean Michailos ◽  
...  
Keyword(s):  
1985 ◽  
Vol 24 (Part 2, No. 2) ◽  
pp. L129-L130 ◽  
Author(s):  
Yoshinori Hatanaka ◽  
textscZeng Bai Chuang ◽  
Hidenori Mimura

1995 ◽  
Author(s):  
Thorsten Graeve ◽  
Wingo Huang ◽  
Stephen M. Alexander ◽  
Youming Li
Keyword(s):  

1997 ◽  
Vol 467 ◽  
Author(s):  
M J Powell ◽  
C Glasse ◽  
I D French ◽  
A R Franklin ◽  
J R Hughes ◽  
...  

ABSTRACTWe have developed a new amorphous silicon image sensor technology using a matrix array of amorphous silicon thin film transistors and photodiodes, where the amorphous silicon nip photodiode is fabricated on top of a thick insulating layer, on top of the thin film transistor array. We call this ‘diode on top’ technology or DOTTY. The active diode area can be as high as 93%, compared to 50% for our conventional photodiode-TFT technology. This leads to a higher signal to noise performance, which is important for medical X-ray applications.


1997 ◽  
Author(s):  
Richard L. Weisfield ◽  
Robert A. Street ◽  
Raj B. Apte ◽  
Andrew M. Moore

1998 ◽  
Author(s):  
Richard L. Weisfield ◽  
Mark A. Hartney ◽  
Robert A. Street ◽  
Raj B. Apte

1999 ◽  
Author(s):  
Richard L. Weisfield ◽  
Mark A. Hartney ◽  
Roger Schneider ◽  
Koorosh Aflatooni ◽  
Rene Lujan

1997 ◽  
Vol 487 ◽  
Author(s):  
R. A. Street ◽  
R. B. Apte ◽  
S. E. Ready ◽  
R. L. Weisfield ◽  
P. Nylen

AbstractLarge area amorphous silicon image sensor arrays are important for x-ray medical imaging and document scanning as well as a variety of other applications where large sensor size is required. The paper first summarizes the present state of the flat panel x-ray imager technology, and compares the two main approaches for x-ray detection. We then describe the performance of a new, large area, high resolution, radiographic imager based on a single amorphous silicon array with 2304×3200 pixels, and an active area of 30×40 cm (12×1 6”).


2018 ◽  
Vol 23 (6) ◽  
pp. 573-585
Author(s):  
D.A. Suponnikov ◽  
◽  
A.N. Putilin ◽  
E.A. Tatarinova ◽  
Z.G. Zhgunev ◽  
...  
Keyword(s):  

2008 ◽  
Vol 1066 ◽  
Author(s):  
Kyung-Wook Shin ◽  
Mohammad R. Esmaeili-Rad ◽  
Andrei Sazonov ◽  
Arokia Nathan

ABSTRACTHydrogenated nanocrystalline silicon (nc-Si:H) has strong potential to replace the hydrogenated amorphous silicon (a-Si:H) in thin film transistors (TFTs) due to its compatibility with the current industrial a-Si:H processes, and its better threshold voltage stability [1]. In this paper, we present an experimental TFT array backplane for direct conversion X-ray detector, using inverted staggered bottom gate nc-Si:H TFT as switching element. The TFTs employed a nc-Si:H/a-Si:H bilayer as the channel layer and hydrogenated amorphous silicon nitride (a-SiNx) as the gate dielectric; both layers deposited by plasma enhanced chemical vapor deposition (PECVD) at 280°C. Each pixel consists of a switching TFT, a charge storage capacitor (Cpx), and a mushroom electrode which serves as the bottom contact for X-ray detector such as amorphous selenium photoconductor. The chemical composition of the a-SiNx was studied by Fourier transform infrared spectroscopy. Current-voltage measurements of the a-SiNx film demonstrate that a breakdown field of 4.3 MV/cm.. TFTs in the array exhibits a field effect mobility (μEF) of 0.15 cm2/V·s, a threshold voltage (VTh) of 5.71 V, and a subthreshold leakage current (Isub) of 10−10 A. The fabrication sequence and TFT characteristics will be discussed in details.


Sign in / Sign up

Export Citation Format

Share Document