Indium bump deposition for flip-chip micro-array image sensing and display applications

2018 ◽  
Author(s):  
Mohamed Bah ◽  
Alexander Manasson ◽  
Craig Outten ◽  
Matthew Robinson ◽  
Chen Zhang ◽  
...  
Keyword(s):  
Flip Chip ◽  
Image Sensing ◽  
Indium Bump ◽  
Micro Array

Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Applications

2004 ◽  
Vol 833 ◽  
Author(s):  
Kun-Mo Chu ◽  
Jung-Hwan Choi ◽  
Jung-Sub Lee ◽  
Han Seo Cho ◽  
Seong-Ook Park ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Heating Temperature ◽  
Coplanar Waveguide ◽  
Fused Silica ◽  
Cavity Surface ◽  
Silver Coating ◽  
Flip Chip Bonding ◽  
Indium Bump ◽  
Polymeric Waveguide

ABSTRACTWe have conducted low-temperature flip-chip bonding for both optical interconnect and microwave applications. Flip-chip bonding of vertical-cavity surface-emitting laser (VCSEL) arrays was performed on a fused silica substrate that provides propagation paths of laser beams and also supports a polymeric waveguide. To avoid thermal damage of the polymeric waveguide during the flip-chip bonding, indium bumps were used and the bonding condition of the flip-chip was determined as a heating temperature of 150 °C and a pressure of 500 gf. Experimentally, a thin silver (Ag) layer coated on the indium bump was very effective to enhance the adhesion strength between the indium bump and the VCSEL chip pads. In addition, the microwave characteristic of coplanar waveguide (CPW) package was slightly improved by the Ag coating.

Characteristics of Indium Bump for Flip-Chip Bonding Used in Polymeric-Waveguide-Integrated Optical Interconnection Systems

2004 ◽  
Vol 43 (8B) ◽  
pp. 5922-5927 ◽  
Author(s):  
Kun-Mo Chu ◽  
Jung-Sub Lee ◽  
Han Seo Cho ◽  
Byung Sup Rho ◽  
Hyo-Hoon Park ◽  
...  
Keyword(s):  
Flip Chip ◽  
Optical Interconnection ◽  
Flip Chip Bonding ◽  
Integrated Optical ◽  
Indium Bump ◽  
Polymeric Waveguide

Indium bump array fabrication on small CMOS circuit for flip-chip bonding

2011 ◽  
Vol 32 (11) ◽  
pp. 115014
Author(s):  
Yuyang Huang ◽  
Yuxiang Zhang ◽  
Zhizhen Yin ◽  
Guoxin Cui ◽  
H C Liu ◽  
...  
Keyword(s):  
Flip Chip ◽  
Cmos Circuit ◽  
Flip Chip Bonding ◽  
Indium Bump ◽  
Array Fabrication

Analysis of Characteristics of Halogen and LED Automobile Lamps

2020 ◽  
pp. 57-62
Author(s):  
Olga Yu. Kovalenko ◽  
Yulia A. Zhuravlyova
Keyword(s):  
Power Consumption ◽  
Flip Chip ◽  
Weather Conditions ◽  
Luminous Flux ◽  
Luminous Efficacy ◽  
Colour Temperature ◽  
Study Results ◽  
Calculation Results ◽  
Mandatory Rules ◽  
Halogen Lamps

This work contains analysis of characteristics of automobile lamps by Philips, KOITO, ETI flip chip LEDs, Osram, General Electric (GE), Gtinthebox, OSLAMPledbulbs with H1, H4, H7, H11 caps: luminous flux, luminous efficacy, correlated colour temperature. Characteristics of the studied samples are analysed before the operation of the lamps. The analysis of the calculation results allows us to make a conclusion that the values of correlated colour temperature of halogen lamps are close to the parameters declared by manufacturers. The analysis of the study results has shown that, based on actual values of correlated colour temperature, it is not advisable to use LED lamps in unfavourable weather conditions (such as rain, fog, snow). The results of the study demonstrate that there is a slight dispersion of actual values of luminous flux of halogen lamps by different manufacturers. Maximum variation between values of luminous flux of different lamps does not exceed 14 %. The analysis of the measurement results has shown that actual values of luminous flux of all halogen lamps comply with the mandatory rules specified in the UN/ECE Regulation No. 37 and luminous flux of LED lamps exceeds maximum allowable value by more than 8 %. Luminous efficacy of LED lamps is higher than that of halogen lamps: more than 82 lm/W and lower power consumption. The results of the measurements have shown that power consumption of a LED automobile lamp is lower than that of similar halogen lamps by 3 times and their luminous efficacy is higher by 5 times.

A driver drowsiness and distraction warning system based on raspberry Pi 3 Kit

2019 ◽  
Vol 70 (3) ◽  
pp. 184-192
Author(s):  
Toan Dao Thanh ◽  
Vo Thien Linh
Keyword(s):  
Processing System ◽  
Warning System ◽  
Raspberry Pi ◽  
Data Set ◽  
Lower Lip ◽  
Driver Drowsiness ◽  
Image Sensing ◽  
The Face ◽  
The Common ◽  
University Laboratory

In this article, a system to detect driver drowsiness and distraction based on image sensing technique is created. With a camera used to observe the face of driver, the image processing system embedded in the Raspberry Pi 3 Kit will generate a warning sound when the driver shows drowsiness based on the eye-closed state or a yawn. To detect the closed eye state, we use the ratio of the distance between the eyelids and the ratio of the distance between the upper lip and the lower lip when yawning. A trained data set to extract 68 facial features and “frontal face detectors” in Dlib are utilized to determine the eyes and mouth positions needed to carry out identification. Experimental data from the tests of the system on Vietnamese volunteers in our University laboratory show that the system can detect at realtime the common driver states of “Normal”, “Close eyes”, “Yawn” or “Distraction”

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages

2002 ◽  
Author(s):  
George F. Gaut
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Solder Bump ◽  
Selective Area ◽  
Fill Material ◽  
Solder Bumps ◽  
Time Required

Abstract Access to the solder bump and under-fill material of flip-chip devices has presented a new problem for failure analysts. The under-fill and solder bumps have also added a new source for failure causes. A new tool has become available that can reduce the time required to analyze this area of a flip-chip package. By using precision selective area milling it is possible to remove material (die or PCB) that will allow other tools to expose the source of the failure.

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