Flip-chip optical fiber attachment to a monolithic optical receiver chip

1995 ◽  
Author(s):  
Vijayanand Vusirikala ◽  
Peter J. Heim ◽  
Mario Dagenais ◽  
C. Philip McClay
Keyword(s):  
Optical Fiber ◽  
Flip Chip ◽  
Optical Receiver

65 GHz bandwidth optical receiver combining a flip-chip mounted waveguide photodiode and GaAs-based HEMT distributed amplifier

2002 ◽  
Vol 38 (25) ◽  
pp. 1706 ◽  
Author(s):  
M. Leich ◽  
V. Hurm ◽  
J. Sohn ◽  
T. Feltgen ◽  
W. Bronner ◽  
...  
Keyword(s):  
Flip Chip ◽  
Optical Receiver ◽  
Distributed Amplifier

A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks

2009 ◽  
Vol 131 (4) ◽  
Author(s):  
Chuen-Ching Wang ◽  
Wen-Ran Yang ◽  
Jin-Jia Chen ◽  
Wei-Wen Shi
Keyword(s):  
Optical Fiber ◽  
Communication Networks ◽  
Communication Systems ◽  
Flip Chip ◽  
Light Emitting Diode ◽  
Coupling Efficiency ◽  
Boundary Surface ◽  
Data Communication ◽  
Plastic Optical Fiber ◽  
Curved Boundary

The explosive growth in the use of the Internet and multimedia applications in both the home and the office has fueled the requirement for high-bandwidth communication systems capable of processing huge volumes of data in a prompt and reliable manner. Plastic optical fiber (POF) has emerged as an ideal solution for meeting this requirement and is now specified by many architects as a simple, one-cable solution for home and office data communication networks. This study presents a modified flip-chip light emitting diode (LED) package for use in short-distance, POF-based communication systems. In contrast to the planar surface of the traditional design, the proposed LED package has a curved boundary surface between the underfill and the air. This boundary surface functions as a virtual lens, which focuses the light emitted by the LED into the acceptance cone of the optical fiber such that the amount of light coupled into the fiber core is maximized. The proposed design yields an average coupling efficiency of around 49.6% over an LED-optical core misalignment range of 0.4–3 mm. Furthermore, the curved boundary surface reduces the distance between the emitting source and the ambient environment; therefore, it improves the thermal dispersion efficiency of the LED package.

40 Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

1998 ◽  
Vol 34 (5) ◽  
pp. 493 ◽  
Author(s):  
Y. Miyamoto ◽  
M. Yoneyama ◽  
Y. Imai ◽  
K. Kato ◽  
H. Tsunetsugu
Keyword(s):  
Flip Chip ◽  
Optical Receiver ◽  
Flip Chip Bonding ◽  
Receiver Module ◽  
Bonding Technique

scholarly journals A 150-Mb/s CMOS Monolithic Optical Receiver for Plastic Optical Fiber Link

2012 ◽  
Vol 16 (1) ◽  
pp. 1-5
Author(s):  
Kang-Yeob Park ◽  
Won-Seok Oh ◽  
Kyung-Sun Ham ◽  
Woo-Young Choi
Keyword(s):  
Optical Fiber ◽  
Optical Receiver ◽  
Plastic Optical Fiber ◽  
Fiber Link

Optical receiver based on BCD process for plastic optical fiber

2014 ◽  
Vol 22 (7) ◽  
pp. 1715-1722 ◽  
Author(s):  
史晓凤 SHI Xiao-feng ◽  
程翔 CHENG Xiang ◽  
陈朝 CHEN Chao ◽  
颜黄苹 YAN Huang-ping ◽  
范程程 FAN Cheng-cheng
Keyword(s):  
Optical Fiber ◽  
Optical Receiver ◽  
Plastic Optical Fiber
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