Theory of spin loss at metallic interfaces (Conference Presentation)

Spintronics X ◽  
2017 ◽  
Author(s):  
Kirill D. Belashchenko ◽  
Giovanni G. Baez Flores ◽  
Alexey A. Kovalev ◽  
Mark van Schilfgaarde
Keyword(s):  
Metallic Interfaces

Growth of spinel into alumina

1987 ◽  
Vol 45 ◽  
pp. 294-295
Author(s):  
Y. Kouh Simpson ◽  
C. B. Carter
Keyword(s):  
Misfit Dislocations ◽  
Phase Boundaries ◽  
Large Rotation ◽  
Alumina Phase ◽  
Metallic Interfaces ◽  
Small Rotation

The structure of spinel/alumina phase boundaries has recently been studied using the selected- area diffraction technique. It has been found that there exist several dominant topotactic relationships; of these, the two most common situations are when the {111} plane of spinel is parallel to either the (0001) plane or the {1120} plane of alumina. In both of these cases, it has been found that there is often a small rotation from exact topotaxy (typically 0° to 2° but with larger rotations possible) which partially eliminates the need for misfit dislocations. This rotation is a special phenomenon that may be unique to non-metallic interfaces such as phase boundaries in ceramics. In this report, a special spinel/alumina interface in which a large rotation from the exact topotaxy exists between the (111) plane of spinel and the (OOOl) plane of alumina is discussed.

A Study of Organo-Metallic Interfaces Using DBAR

2001 ◽  
Vol 363-365 ◽  
pp. 457-459
Author(s):  
C.E. Tucker ◽  
F.A. Smith ◽  
Paul G. Coleman
Keyword(s):  
Metallic Interfaces

Refraction-reflection of electrons at lateral metallic interfaces

2017 ◽  
Vol 524 ◽  
pp. 127-136 ◽  
Author(s):  
M.A. Kher-Elden ◽  
Z.M. Abd El-Fattah ◽  
O. Yassin ◽  
M.M. El-Okr
Keyword(s):  
Metallic Interfaces

Core Level Shifts and Grain Boundary Cohesion

1998 ◽  
Vol 4 (S2) ◽  
pp. 766-767
Author(s):  
D. A. Muller
Keyword(s):  
Charge Transfer ◽  
Valence Band ◽  
Core Level ◽  
Level Shift ◽  
The Core ◽  
Metallic Interfaces ◽  
Level Shifts ◽  
Electron Energy Loss ◽  
Valence Band Width

The role of core level shifts at metallic interfaces has often been ignored in electron energy loss spectroscopy (EELS) even though very small changes in bond length can lead to large core level shifts. However, the popular interpretation of core level shifts as measures of charge transfer is highly problematic. For instance, in binary alloys systems, the core level shifts can be the same sign for both atomic constituents[l]. The simple interpretation would require that both atomic species had lost or gained charge. Further, the signs of the core level shifts can be opposite to those expected from electronegativity arguments[2]. A core level shift (CLS) is still possible, even when no charge transfer occurs. As illustrated in Fig. 1, if the valence band width is increased, the position of the center of the valence band with respect to the Fermi energy will change (as the number of electrons remains unchanged).

Oscillation of the Magnetic Moment at Metallic Interfaces

1998 ◽  
Vol 61-62 ◽  
pp. 151-154
Author(s):  
Ž.V. Šljivančanin ◽  
F.R. Vukajlović
Keyword(s):  
Magnetic Moment ◽  
Metallic Interfaces

LT-TLPS Die Attach for High Temperature Electronic Packaging

2014 ◽  
Vol 11 (1) ◽  
pp. 7-15
Author(s):  
Hannes Greve ◽  
F. Patrick McCluskey
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Melting Point ◽  
Low Temperature ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Die Attach ◽  
Metallic Interfaces ◽  
Dsc Analyses ◽  
Transient Liquid Phase Sintering

Low temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures. In this paper, process analyses and shear strength studies of paste-based approaches to LT-TLPS are presented. The process progression studies include DSC analyses and observations of intermetallic compound (IMC) formation by cross-sectioning. It was found that the sintering process reaches completion after sintering times of 15 min for process temperatures approximately 50°C above the melting point of the low temperature constituent. For the shear studies, test samples consisting of copper dice and copper substrates joined by sintering with a variety of sinter pastes with different ratios of copper and tin have been assessed. A fixture was designed for high temperature enabled shear tests at 25°C, 125°C, 250°C, 400°C, and 600°C. The influence of the ratio of the amount of high melting-point constituent to the amount of low melting-point constituent on the maximum application temperature of the sinter paste was analyzed. Ag20Sn and Cu50Sn pastes showed no reduction in shear strength up to 400°C, and Cu40Sn pastes showed high shear strengths up to 600°C. It was shown that LT-TLPS can be used to form high temperature stable joints at low temperatures without the need to apply pressure during processing.

Probing Subnanometric-Scale Hotspots in Metallic Interfaces

Plasmonics ◽  
2019 ◽  
Vol 14 (6) ◽  
pp. 2031-2043
Author(s):  
Mufasila Mumthaz Muhammed ◽  
Junais Habeeb Mokkath
Keyword(s):  
Metallic Interfaces
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