Asynchronous Geiger-mode APD cameras with free-running InGaAsP pixels (Conference Presentation)

Author(s):  
Mark Itzler ◽  
Gennaro Salzano ◽  
Mark Entwistle ◽  
Xudong Jiang ◽  
Mark Owens ◽  
...  
Keyword(s):  
2014 ◽  
Vol 644-650 ◽  
pp. 3709-3712
Author(s):  
Chong Hu ◽  
Teh Hua Ju ◽  
Yong Yao

A single-element passive quenching with active reset (PQAR) circuit is proposed. Its operation mechanism is studied in theory to show that this single element, based on thyristor, can provide similar function of quenching and reset for the free-running Geiger-mode operation of single photon avalanche diodes (SPADs) as the conventional PQAR circuits, but with significant simplicity. Requirement for the thyristor is identified, and an InP sample was designed, fabricated and characterized. Future work for further demonstration is also discussed.


Author(s):  
Mark A. Itzler ◽  
Mark Entwistle ◽  
Xudong Jiang ◽  
Gennaro Salzano ◽  
Mark Owens ◽  
...  
Keyword(s):  

2016 ◽  
Vol 28 (17) ◽  
pp. 1890-1893 ◽  
Author(s):  
Peng Zhao ◽  
Yan Zhang ◽  
Kunpeng Wang ◽  
Weiping Qian

2013 ◽  
Vol E96.C (2) ◽  
pp. 241-244
Author(s):  
Ryuta YAMANAKA ◽  
Taka FUJITA ◽  
Hideyuki SOTOBAYASHI ◽  
Atsushi KANNO ◽  
Tetsuya KAWANISHI

Author(s):  
O. Breitenstein ◽  
J.P. Rakotoniaina ◽  
F. Altmann ◽  
J. Schulz ◽  
G. Linse

Abstract In this paper new thermographic techniques with significant improved temperature and/or spatial resolution are presented and compared with existing techniques. In infrared (IR) lock-in thermography heat sources in an electronic device are periodically activated electrically, and the surface is imaged by a free-running IR camera. By computer processing and averaging the images over a certain acquisition time, a surface temperature modulation below 100 µK can be resolved. Moreover, the effective spatial resolution is considerably improved compared to stead-state thermal imaging techniques, since the lateral heat diffusion is suppressed in this a.c. technique. However, a serious limitation is that the spatial resolution is limited to about 5 microns due to the IR wavelength range of 3 -5 µm used by the IR camera. Nevertheless, we demonstrate that lock-in thermography reliably allows the detection of defects in ICs if their power exceeds some 10 µW. The imaging can be performed also through the silicon substrate from the backside of the chip. Also the well-known fluorescent microthermal imaging (FMI) technique can be be used in lock-in mode, leading to a temperature resolution in the mK range, but a spatial resolution below 1 micron.


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