High-speed ultrafast laser machining with tertiary beam positioning (Conference Presentation)

Author(s):  
Chuan Yang ◽  
Haibin Zhang
Author(s):  
Norman Hodgson ◽  
Albrecht Steinkopff ◽  
Sebastian Heming ◽  
Hortense Allegre ◽  
Hatim Haloui ◽  
...  

Author(s):  
Girolamo Mincuzzi ◽  
Rainer Kling ◽  
John Lopez ◽  
Clemens Hönninger ◽  
Eric Audouard ◽  
...  

2014 ◽  
Vol 939 ◽  
pp. 230-236
Author(s):  
Chien Kai Chung ◽  
Wen Tse Hsaio ◽  
Shih Feng Tseng ◽  
Kuo Cheng Huang ◽  
Ming Fei Chen

Polymethylmethacrylate (PMMA) material has excellent characteristics, such as being light weight, low cost, ease of machining, and optical quality, which are useful in numerous applications such as backlit LCD display panels, lens optics, and other photoelectric fields. Laser machining of polymerization material results in a superior machining quality, high accuracy, high speed, and high reproducibility, produces a small variety of products, reduces mold costs, and enables the rapid manufacture of products based on complex graphics by processing different depths and widths of the 3D structure. This paper presents the fabrication of symmetrical array microstructures on PMMA material by using a UV laser system. The PMMA material dimensions and thickness were 20 x 20 mm and 1 mm, respectively. Regarding the machining quality, the laser pulse energy, pulse repetition frequency, and fill spacing were adjusted. For the experiments, a semiconductor laser source (635 nm/5 mW/TEM00) and a beam profiler were used to measure the characteristics of a laser beam passing through the microstructures. The microstructure pitches and morphologies also affected the light uniformity. After laser machining, the surface morphology and the light transmittance were measured using a spectrophotometer.


2015 ◽  
Vol 23 (8) ◽  
pp. 10521 ◽  
Author(s):  
Bryan T. Bosworth ◽  
Jasper R. Stroud ◽  
Dung N. Tran ◽  
Trac D. Tran ◽  
Sang Chin ◽  
...  

2014 ◽  
Vol 5 (7) ◽  
pp. 2023 ◽  
Author(s):  
Onur Ferhanoglu ◽  
Murat Yildirim ◽  
Kaushik Subramanian ◽  
Adela Ben-Yakar

2012 ◽  
Vol 50 (2) ◽  
pp. 210-214 ◽  
Author(s):  
Samira Darvishi ◽  
Thomas Cubaud ◽  
Jon P. Longtin

2015 ◽  
Author(s):  
W. S. Góra ◽  
R. M. Carter ◽  
B. Dhillon ◽  
D. P. Hand ◽  
J. D. Shephard

1983 ◽  
Author(s):  
T. Uyemura ◽  
S. Ozono ◽  
Y. Yamamoto, ◽  
N. Yokoyama ◽  
J Kato ◽  
...  

2016 ◽  
Vol 835 ◽  
pp. 144-148 ◽  
Author(s):  
Wisan Charee ◽  
Viboon Tangwarodomnukun ◽  
Chaiya Dumkum

Thermal damage of workpiece material induced by laser machining process can be reduced by using the underwater technique. This method requies the whole workpiece to be submerged in water while a laser beam strikes the work surface for ablation. Though water can cool the workpiece during the ablation, the dynamic features of water can adversely interfere the laser beam. The vapor bubbles created in water can scatter the laser beam and in turn attenuate the laser intensity at the work surface so as the ablation performance. In this paper, the bubble formation caused by laser machining of silicon in water was investigated and analyzed. The shadowgraph technique associated with the high speed camera was used to capture and measure the vapor bubble in water. The bubble size was found to increase with the laser pulse energy. After a number of laser pulses irradiated on the workpiece surface, the bubble was broken up into small ones which can significantly disturb the laser beam so as the ablation performance.


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