Testing a high-power LED based light source for hyperspectral imaging microscopy

2017 ◽  
Author(s):  
Phiwat Klomkaew ◽  
Sam A. Mayes ◽  
Thomas C. Rich ◽  
Silas J. Leavesley
2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.


2019 ◽  
Vol 12 ◽  
pp. 361-367 ◽  
Author(s):  
Hongwei Liu ◽  
Dandan Yu ◽  
Pingjuan Niu ◽  
Zanyun Zhang ◽  
Kai Guo ◽  
...  

2018 ◽  
Author(s):  
Xiaolong Yu ◽  
Xueye Wei ◽  
Ou Zhang ◽  
Xinwei Zhang

2014 ◽  
Vol 1082 ◽  
pp. 340-343
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  

Excess heat generated by the high power LED package significantly impacts the performance and reliability of the light source. Significance of heat dissipation are influenced by each packaging component of high power LED. This paper demonstrates simulation analysis on single chip high power LED where the significance of the copper based heat slug structure on the heat dissipation was analyzed. The simulation analysis was carried out by using Ansys version 11 and heat dissipation of two types of heat slug structure, rectangular and cylindrical were compared. The outcome exhibited that the structure of the heat slug significantly influences the heat dissipation of LED chip due to its surface area.


Author(s):  
Masato Hagimoto ◽  
Shintaro Miyamoto ◽  
Yuki Kimura ◽  
Haruki Fukai ◽  
Manabu Hashizume ◽  
...  
Keyword(s):  

2019 ◽  
Vol 1309 ◽  
pp. 012016
Author(s):  
A D Kurilov ◽  
V V Belyaev ◽  
K D Nessemon ◽  
E D Besprozvannyi ◽  
A O Osin ◽  
...  

2017 ◽  
Vol 19 ◽  
pp. 348-351 ◽  
Author(s):  
Alberto Sabin Moura Borba ◽  
Sângela Maria da Silva Pereira ◽  
Mellyna Cavalcante Mendes Borba ◽  
Marco Aurélio Benini Paschoal ◽  
Rudys Rodolfo de Jesus Tavarez ◽  
...  

2021 ◽  
Vol 53 (1) ◽  
Author(s):  
Huamao Huang ◽  
Tianxiang Lan ◽  
Cheng Huang ◽  
Chao Wang ◽  
Chukun Huang ◽  
...  

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