Minimum energy of silver and copper nanoparticles for laser sintering (Conference Presentation)

2016 ◽  
Author(s):  
Changmin Lee ◽  
Jae W. Hahn
Keyword(s):  
Copper Nanoparticles ◽  
Minimum Energy ◽  
Laser Sintering

scholarly journals Process Optimization Variables for Direct Metal Laser Sintering

2015 ◽  
Vol 15 (4) ◽  
pp. 38-51 ◽  
Author(s):  
Ż. A. Mierzejewska
Keyword(s):  
Selective Laser Sintering ◽  
Minimum Energy ◽  
Systems Design ◽  
Laser Sintering ◽  
Physical Models ◽  
Cad Model ◽  
Direct Metal Laser Sintering ◽  
3D Cad ◽  
Short Period ◽  
Wide Range

AbstractManufacturing is crucial to creation of wealth and provision of quality of life. Manufacturing covers numerous aspects from systems design and organization, technology and logistics, operational planning and control. The study of manufacturing technology is usually classified into conventional and non-conventional processes. As it is well known, the term "rapid prototyping" refers to a number of different but related technologies that can be used for building very complex physical models and prototype parts directly from 3D CAD model. Among these technologies are selective laser sintering (SLS) and direct metal laser sintering (DMLS). RP technologies can use wide range of materials which gives possibility for their application in different fields. RP has primary been developed for manufacturing industry in order to speed up the development of new products (prototypes, concept models, form, fit, and function testing, tooling patterns, final products - direct parts). Sintering is a term in the field of powder metallurgy and describes a process which takes place under a certain pressure and temperature over a period of time. During sintering particles of a powder material are bound together in a mold to a solid part. In selective laser sintering the crucial elements pressure and time are obsolete and the powder particles are only heated for a short period of time. SLS uses the fact that every physical system tends to achieve a condition of minimum energy. In the case of powder the partially melted particles aim to minimize their in comparison to a solid block of material enormous surface area through fusing their outer skins. Like all generative manufacturing processes laser sintering gains the geometrical information out of a 3D CAD model. This model is subdivided into slices or layers of a certain layer thickness. Following this is a revolving process which consists of three basic process steps: recoating, exposure, and lowering of the build platform until the part is finished completely.

Laser Sintering of Copper Nanoparticles: A Simplified Model for Fluence Estimation and Validation

2017 ◽  
Author(s):  
Nilabh Roy ◽  
William Jou ◽  
He Feng ◽  
Jihoon Jeong ◽  
Yaguo Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Copper Nanoparticles ◽  
Integrated Circuit ◽  
Laser Sintering ◽  
Simplified Model ◽  
Flexible Substrates ◽  
Copper Nanoparticle ◽  
Pulsed Lasers ◽  
Low Resistivity ◽  
Rc Delay

Copper (Cu) has already replaced aluminum as the primary material for interconnect fabrication due to its superior electrical and thermal conductivity. Low resistivity of Cu decreases the RC delay which in turn increases the integrated circuit (IC) speed. Copper nanoparticle (NP) inks can also serve as a promising replacement of silver NP inks in 2D printing applications on solid and flexible substrates. This paper presents a simplified model to estimate optimum laser sintering parameters of Cu NPs. The model is validated by the experimental sintering results using nanosecond and femtosecond pulsed lasers. The predicted sintering thresholds agree well with sintering experiments.

Laser sintering of copper nanoparticles

2013 ◽  
Vol 47 (2) ◽  
pp. 025501 ◽  
Author(s):  
Michael Zenou ◽  
Oleg Ermak ◽  
Amir Saar ◽  
Zvi Kotler
Keyword(s):  
Copper Nanoparticles ◽  
Laser Sintering

scholarly journals Laser sintering of copper nanoparticles on top of silicon substrates

2015 ◽  
Vol 27 (3) ◽  
pp. 035203 ◽  
Author(s):  
A Soltani ◽  
B Khorramdel Vahed ◽  
A Mardoukhi ◽  
M Mäntysalo
Keyword(s):  
Copper Nanoparticles ◽  
Laser Sintering ◽  
Silicon Substrates

scholarly journals Fabrication of Porous SiC by Direct Selective Laser Sintering Effect of Boron Carbide

Metals ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 737
Author(s):  
Rongzhen Liu ◽  
Gong Chen ◽  
Yudi Qiu ◽  
Peng Chen ◽  
Yusheng Shi ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Selective Laser Sintering ◽  
Minimum Energy ◽  
Laser Sintering ◽  
Extreme Conditions ◽  
Sintering Process ◽  
Application Performance ◽  
Chemical Corrosion ◽  
Porous Sic ◽  
Sintered Silicon

Additive manufactured porous SiC is a promising material applied in extreme conditions characterised by high temperatures, chemical corrosion, and irradiation etc. However, residual Si’s existence deteriorates its performance and limits its application in harsh environments. In this study, B4C was introduced into the selective laser sintering process of SiC, and its effects on forming ability, pore parameters, microstructure, and phases were investigated. The results showed that when B4C was added, the processing window was enlarged. The minimum energy density was reduced from 457 J/cm2 to 214 J/cm2 when the content of B4C reached 15 wt%. Microstructure orientation was enhanced, and the residual silicon content was decreased from 38 at.% to about 8 at.%. Small pores were turned into large pores with the increase of B4C addition. The findings indicate that the addition of B4C increases the amount of liquid phase during the laser sintering process of silicon carbide, improving the SiC struts’ density and reducing the residual silicon by reacting with it. Therefore, the addition of B4C will help improve the application performance of selected laser-sintered silicon carbide under extreme conditions.

scholarly journals Laser sintering of oxidized copper nanoparticles deposited by dry aerosol printing

2021 ◽  
Vol 2086 (1) ◽  
pp. 012019
Author(s):  
D V Kornyushin ◽  
A A Efimov ◽  
A I Buchnev ◽  
E I Kameneva ◽  
V V Ivanov
Keyword(s):  
Laser Radiation ◽  
Copper Nanoparticles ◽  
Electrical Resistance ◽  
Local Treatment ◽  
Laser Sintering ◽  
Specific Electrical Resistance ◽  
Aerosol Printing ◽  
Aerosol Jets ◽  
Semiconductor Arrays ◽  
Nanoparticle Sizes

Abstract Sintering of oxidized copper nanoparticles arrays in the form of lines by the local treatment of laser radiation with wavelengths of 527 nm and 980 nm was studied. To form lines with a width equal to 40–150 μm and a thickness equal to 0.5–4 μm focused aerosol jets with average nanoparticle sizes of 110 and 65 nm were used. The production of semiconductor arrays from oxidized copper nanoparticles with a specific electrical resistance of 2⋅10−3 Ω⋅m using laser radiation with a wavelength of 980 nm was demonstrated.

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