Process design kit and circuits at a 2 µm technology node for flexible wearable electronics applications (Conference Presentation)

2016 ◽  
Author(s):  
Miguel Torres-Miranda ◽  
Andreas Petritz ◽  
Herbert Gold ◽  
Barbara Stadlober
Keyword(s):  
Process Design ◽  
Wearable Electronics ◽  
Technology Node

scholarly journals Process Design Kit and Design Automation for Flexible Hybrid Electronics

2019 ◽  
Vol 16 (3) ◽  
pp. 117-123
Author(s):  
Tsung-Ching Huang ◽  
Ting Lei ◽  
Leilai Shao ◽  
Sridhar Sivapurapu ◽  
Madhavan Swaminathan ◽  
...  
Keyword(s):  
Process Design ◽  
Design Automation ◽  
High Performance ◽  
Large Scale ◽  
Low Cost ◽  
Thin Film Transistor ◽  
Solution Process ◽  
Oxide Semiconductor ◽  
Wearable Electronics ◽  
Wide Range

Abstract High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things and wearable electronics. Carbon nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers, and sense amplifiers, can be printed and hybrid-integrated with thinned (<50 μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications, from flexible displays to wearable medical devices. Here, we report (1) a process design kit (PDK) to enable FHE design automation for large-scale FHE circuits and (2) solution process-proven intellectual property blocks for TFT circuits design, including Pseudo-Complementary Metal-Oxide-Semiconductor (Pseudo-CMOS) flexible digital logic and analog amplifiers. The FHE-PDK is fully compatible with popular silicon design tools for design and simulation of hybrid-integrated flexible circuits.

Formulation of Automated Process-Design Problems in CNC Systems

2020 ◽  
Vol 40 (6) ◽  
pp. 488-490
Author(s):  
S. Yu. Kalyakulin ◽  
V. V. Kuz’min ◽  
E. V. Mitin ◽  
S. P. Sul’din
Keyword(s):  
Process Design ◽  
Design Problems ◽  
Automated Process

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

A Case Study of Defects Due to Process-Design Interaction in Nano Scale Technology

2007 ◽  
Author(s):  
Hung-Sung Lin ◽  
Ying-Chin Hou ◽  
Juimei Fu ◽  
Mong-Sheng Wu ◽  
Vincent Huang ◽  
...  
Keyword(s):  
Liquid Crystal ◽  
Circuit Design ◽  
Process Design ◽  
Integrated Circuit ◽  
Photon Emission ◽  
Integrated Circuit Design ◽  
Nano Scale ◽  
Leakage Path ◽  
Related Defect

Abstract The difficulties in identifying the precise defect location and real leakage path is increasing as the integrated circuit design and process have become more and more complicated in nano scale technology node. Most of the defects causing chip leakage are detectable with only one of the FA (Failure Analysis) tools such as LCD (Liquid Crystal Detection) or PEM (Photon Emission Microscope). However, due to marginality of process-design interaction some defects are often not detectable with only one FA tool [1][2]. This paper present an example of an abnormal power consumption process-design interaction related defect which could only be detected with more advanced FA tools.

Process design and equipment selection for optimized steam and power concepts – the “zero” process steam sugar factory

2020 ◽  
pp. 40-50
Author(s):  
Boris Morgenroth ◽  
Thomas Stark ◽  
Julian Pelster ◽  
Harjeet Singh Bola
Keyword(s):  
Process Design ◽  
Sugar Industry ◽  
Electrical Power ◽  
Power Requirement ◽  
Equipment Selection ◽  
Good Potential ◽  
Set Up ◽  
The Right ◽  
Key Aspects ◽  
Steam Drying

Optimization of process steam requirement in order to maximize sugar recovery and export power along with manpower optimization is a must for sugar factories to survive under difficult conditions and to earn additional revenues. The process steam demand of greenfield and revamped plants has been reduced to levels of 32–38% from originally more than 50% steam on cane in the case of the brownfield plants. In addition, significant improvement in the power requirement of the plants has been achieved. Bagasse drying offers a good potential to improve the power export. Different available concepts are compared with a focus on bagasse steam drying and low temperature bagasse drying. In order to set up an optimized highly efficient plant or to optimize an existing plant to achieve competitive benchmarks, good process design and the right equipment selection are very important. Experience has been gained with multiple stage or double effect crystallization in the beet sugar industry offering further steam optimization potential. Vapour recompression is also an option to substitute live steam by electrical power. This even provides options to reduce the steam demand from the power plant for the sugar process down to zero. Key aspects concerning the process design and equipment selection are described.

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