Next-generation high-reliability laser light engine by glass phosphor-converted layer (Conference Presentation)

2016 ◽  
Author(s):  
Yung Peng Chang ◽  
Jin-Kai Chang ◽  
Wei-Chih Cheng ◽  
Chun-Nien Liu ◽  
Li-Yin Chen ◽  
...  
Keyword(s):  
Laser Light ◽  
High Reliability ◽  
Next Generation ◽  
Glass Phosphor ◽  
Light Engine

Next-generation glass-base phosphor-converted laser light engine

2015 ◽  
Author(s):  
Jin-Kai Chang ◽  
Wei-Chih Cheng ◽  
Yung-Peng Chang ◽  
Yi-Yin Kuo ◽  
Chun-Chin Tsai ◽  
...  
Keyword(s):  
Laser Light ◽  
Next Generation ◽  
Glass Base ◽  
Light Engine

scholarly journals New scheme of a highly-reliable glass-based color wheel for next-generation laser light engine

2017 ◽  
Vol 7 (3) ◽  
pp. 1029 ◽  
Author(s):  
Yung-Peng Chang ◽  
Jin-Kai Chang ◽  
Wei-Chih Cheng ◽  
Yi-Yin Kuo ◽  
Chun-Nien Liu ◽  
...  
Keyword(s):  
Laser Light ◽  
Next Generation ◽  
Color Wheel ◽  
Light Engine

scholarly journals A Review of the Application of Next Generation Sequencing (NGS) in Wild Terrestrial Vertebrate Research

2019 ◽  
pp. 1-9 ◽  
Author(s):  
Ramitha Arumugam ◽  
Joey Ee Uli ◽  
Geetha Annavi
Keyword(s):  
Life Science ◽  
Review Paper ◽  
High Reliability ◽  
Next Generation ◽  
Detailed Understanding ◽  
Terrestrial Vertebrate ◽  
Look Back ◽  
History Of ◽  
Next Generation Sequencing Ngs ◽  
Generation Sequencing

In era of sequencing revolution, scientists seek for knowledge about the ever-expanding field of technology, Next Generation Sequence (NGS) to be applied in their research due to its high reliability and rate of discovery. What is NGS? To obtain a detailed understanding about NGS, it is required to look back the history of sequencing and how the NGS stepped into life science. This review paper gives an overview of NGS projects in wild terrestrial vertebrate including applications such as whole genome sequencing and metagenomics.

scholarly journals Future of Communication~Next Generation Network (NGN Network)

2020 ◽  
Vol 9 (5) ◽  
pp. 1920-1923
Keyword(s):  
Telecommunication Network ◽  
High Reliability ◽  
Core Layer ◽  
Future Generation ◽  
Internet Technology ◽  
Next Generation Network ◽  
Next Generation ◽  
Service Creation ◽  
Other Information ◽  
Generation Network

The Next Generation Network is not a overnight transformation, it brings the architectural change in telecommunication network, which has been elaborate in this paper. The basic idea behind this network is to transfer all PSTN, Internet, Mobile & other information services into IP packets.NGN based on four layers: Access Layer, Core Layer, Control Layer & Service Layer. And is based on IP (Internet Protocol) & MPLS (Multiprotocol Level Switching) internet technology. The technological advancements in telecommunication is forcing a trend towards unification of network & services, setting up a stage for the emergence of Next Generation Network -NGN. The Relocation to NGN diminishes arrange and operational multifaceted nature bringing about better and dependable assistance. NGN is a Self network& is used for future generation for better transport technologies, systematic service creation, High modularity, high reliability, security & QoS support. To discuss the fundamental of NGN for future aspect is the aim of this paper.

Low Temperature Curable PI/PBO for Advanced Packaging

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-15 ◽  
Author(s):  
Daisaku Matsukawa ◽  
Tadamitsu Nakamura ◽  
Tetsuya Enomoto ◽  
Noriyuki Yamazaki ◽  
Masayuki Ohe ◽  
...  
Keyword(s):  
Low Temperature ◽  
Chemical Resistance ◽  
High Reliability ◽  
Dielectric Materials ◽  
The Novel ◽  
Next Generation ◽  
Wafer Level ◽  
High Chemical ◽  
High Chemical Resistance ◽  
Advanced Packaging

Photo-definable polyimides (PI) and polybenzoxazoles (PBO) have been widely used as dielectrics for re-distribution layers in wafer level chip size packages (WL-CSP). These materials can simplify the manufacturing process and ensure high reliability owing to their good mechanical properties and high thermal stability. For next generation electronic components fabricated by utilizing advanced packaging technologies such as 3D-stacking using TSV, package-on-package, fan-out WL-CSP etc., the most important requirements for dielectric materials are high lithographic performance, high adhesion to Cu RDL, high chemical resistance and low temperature curability. In this paper, we will report on our novel low temperature (<200C) curable PBO and PI. A novel alkaline positive tone PBO was developed by re-designing key components of the formulation to enhance lithographic performance, Cu adhesion and chemical resistance. It was found that the new PBO material showed higher lithographic performance than conventional PBOs due to its high dissolution contrast and which resulted in a resolution of 2micron (L/S) with a 7μm cured thickness and 3micron (L/S) with a 15micron cured thickness, respectively. This material also produced strong Cu adhesion and high chemical resistance at curing temperatures <200C with no delamination from the Cu RDL being observed after a 168hr Pressure Cooker Test (PCT). Furthermore, the new formulation showed high TCT resistance due to its high elongation below 0C. In addition, a novel solvent negative tone PI was also developed by incorporating a cross-linker to accelerate low temperature curability as well a photo-initiator to improve lithographic properties. As a result, the novel PI when cured at 175C for 1hr showed high Cu adhesion after 168hr PCT as well as high film properties. The new PI also showed excellent lithographic properties with a resolution of 6micron (L/S). Furthermore, the low temperature curable PI and PBO materials were used as dielectrics to fabricate WL-CSPs for both chip and board level reliability testing. The test results indicated that both the novel PBO and PI showed excellent reliability after thermal cycling (TCT) due to the significant improvements made to Cu adhesion and chemical resistance. These materials are expected to be promising for next generation WLP applications. Details are described in the presentation.

Development of an advanced multifunction head-up display using a DMD/laser light engine

2002 ◽  
Author(s):  
Michael Billings ◽  
James Fernandez ◽  
Joe Fittanto ◽  
Glenn Tisdale
Keyword(s):  
Laser Light ◽  
Light Engine
Sign in / Sign up

Export Citation Format

Share Document