Electrowetting liquid lens array on curved substrates for wide field of view image sensor

2016 ◽  
Author(s):  
Yousung Bang ◽  
Muyoung Lee ◽  
Yong Hyub Won
2010 ◽  
Vol 6 (4) ◽  
pp. 141-144 ◽  
Author(s):  
Sang Won Seo ◽  
Seungoh Han ◽  
Jun Ho Seo ◽  
Woo Bum Choi ◽  
Man Young Sung

Photonics ◽  
2021 ◽  
Vol 8 (4) ◽  
pp. 89
Author(s):  
Dongmok Kim ◽  
Sehui Chang ◽  
Hyuk-Sang Kwon

In the past few decades, video endoscopy has become one of the primary medical devices in diverse clinical fields for examination, treatment, and early disease diagnosis of the gastrointestinal tract. For an accurate diagnosis, an endoscopic camera offering bright and wide field-of-view images is required while maintaining its compact dimensions to enter the long, narrow, and dark tract inside of the body. Recent endoscopic lenses successfully provide wide fields-of-view and have compact sizes for the system; however, their f-numbers still remain at 2.8 or higher. Therefore, further improvement in f-numbers is required to compensate for the restricted illumination system of the endoscopic probe. Here, we present a low f-number endoscopic lens design while providing wide field-of-view and high-resolution imaging. The proposed lens system achieved a low f-number of 2.2 and a field-of-view of 140 deg. The modulation transfer function (MTF) is over 20% at 180 lp/mm, and relative illumination is more than 60% in the full field. Additionally, the proposed lens is designed for a 1/4” 5-megapixel complementary metal-oxide-semiconductor (CMOS) image sensor with a pixel size of 1.4 µm. This all-plastic lens design could help develop a high-performance disposable endoscope that prevents the risk of infection or cross-contamination with mass manufacture and low cost.


Author(s):  
Bertrand Chambion ◽  
G. Moulin ◽  
S. Caplet ◽  
C. Gaschet ◽  
S. Getin ◽  
...  

Since few years, there has been an increasing interest and demand in flexible electronics. Standard imaging system consists of an optical module (set of lenses) and an image sensor. For wide field of view applications, and due to the curved shape of lenses and mirrors, the flat image after being propagated through the optical system is not flat but curved, i.e. the off-axis light focuses in a curved manner. This problem is called Petzval Field Curvature Aberration (Petzval FCA). It is generally fixed by additional complex lenses to “flatten” the image plane. We propose another approach with a hemispherical curved sensor technology. It allows eliminating FCA directly at the sensor level and thus makes it possible to drastically simplify, and hence miniaturize, the optical system architecture. First, a brief state of the art on curved detectors will be detailed for different application fields. Bendable capacities of hydrid detectors (included interconnection layer) were fully investigated and tested in the past [1, 2]. Moreover, a hemi-spherically curved visible image sensor with better optical characteristics (image quality) was realized and patented by Sony Company in 2014 [3]. Recently, a tunable curving packaging technology, with new optical functions possibilities has been presented in Electronic Component and Technology Conference 2016 [4]. Then, CEA-LETI curving technologies will be explained to address fixed and tunable curvature packaging applications, included modeling and technical process steps. Characterization of curved sensors prototypes have been performed to understand mechanical and electro-optical bending limits and will be also presented in the paper. Based on an existing fisheye flat sensor optical design, a curved focal plane will be described, showing that it's possible to simplify the standard system from 14 lenses (11 types of optical glass) with 2 aspheric lenses, to only 9 lenses (−35%), 3 types of optical glasses, without aspheric surfaces. The benefits of a curved sensor will be summarized into two categories: those related to the optical system design and those related to the quality of images produced by a camera with curved sensor. Optical system:» Miniaturization of optical devices (volume, weight);» Simplification of the lenses alignment process (due to reduced number of lenses);» Suppression of aspheric lenses;» Wide field of view enhancement. Image quality:» More homogeneous image quality (reduced image noise);» Similar or improved resolution and higher sensitivity;» Corrected distortion occurring along the image edges. Finally, curved CMOS image sensor roadmaps and perspectives will be discussed: from a market point of view, application field surveys have been done on mass market applications (mobile, consumer…), photography, automotive… From a technical aspect, a curving technologies roadmap will be proposed, leaded by applications needs, on single chip, collective, and wafer level processes.


Author(s):  
M. G. Lagally

It has been recognized since the earliest days of crystal growth that kinetic processes of all Kinds control the nature of the growth. As the technology of crystal growth has become ever more refined, with the advent of such atomistic processes as molecular beam epitaxy, chemical vapor deposition, sputter deposition, and plasma enhanced techniques for the creation of “crystals” as little as one or a few atomic layers thick, multilayer structures, and novel materials combinations, the need to understand the mechanisms controlling the growth process is becoming more critical. Unfortunately, available techniques have not lent themselves well to obtaining a truly microscopic picture of such processes. Because of its atomic resolution on the one hand, and the achievable wide field of view on the other (of the order of micrometers) scanning tunneling microscopy (STM) gives us this opportunity. In this talk, we briefly review the types of growth kinetics measurements that can be made using STM. The use of STM for studies of kinetics is one of the more recent applications of what is itself still a very young field.


2020 ◽  
Vol 13 (6) ◽  
pp. 1-9
Author(s):  
XU Hong-gang ◽  
◽  
HAN Bing ◽  
LI Man-li ◽  
MA Hong-tao ◽  
...  

2012 ◽  
Vol 100 (13) ◽  
pp. 133701 ◽  
Author(s):  
Hewei Liu ◽  
Feng Chen ◽  
Qing Yang ◽  
Pubo Qu ◽  
Shengguan He ◽  
...  

Lab on a Chip ◽  
2010 ◽  
Vol 10 (7) ◽  
pp. 824 ◽  
Author(s):  
Ahmet F. Coskun ◽  
Ting-Wei Su ◽  
Aydogan Ozcan

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