What to do when your CTQs (critical-to-quality characteristics) turn into WTFs (what-the-flig): a guide to root cause analysis and corrective action

2015 ◽  
Author(s):  
Lance B. Coleman
Keyword(s):  
Root Cause Analysis ◽  
Quality Characteristics ◽  
Corrective Action ◽  
Cause Analysis ◽  
Root Cause

Using root cause analysis (RCA) to facilitate corrective actions, after action reports (AARs), and improvement plans

2018 ◽  
Vol 10 (6) ◽  
pp. 442
Author(s):  
Ralph Renger, PhD, MEP ◽  
Mary Davis, DrPH ◽  
Brenda Granillo, MS
Keyword(s):  
Homeland Security ◽  
Research Evidence ◽  
Root Cause Analysis ◽  
Corrective Action ◽  
Prevention Study ◽  
Cause Analysis ◽  
Root Cause ◽  
Is Research ◽  
Control And Prevention ◽  
Facilitation Skills

Root cause analysis (RCA) is methodology recommended by the Homeland Security Exercise and Evaluation Program (HSEEP) for examining why exercise objectives were not met and providing specific recommendations for corrective action. The consequence of not completing the RCA as required by HSEEP is significant. In the absence of a RCA arriving at the best corrective action is less likely. Despite its importance, there is research evidence from a Centers for Disease Control and Prevention study that the RCA is seldom completed. Several reasons are presented as to why the RCA is not completed including a lack of guidance as to how to conduct a RCA. An example of how to complete a RCA is provided followed by a discussion of the benefits of using the approach over traditional exercise debriefing methods. Reasons why there may be continued resistance to using RCA despite having the necessary facilitation skills and dedicated time are also discussed.

scholarly journals PERBAIKAN PADA FISHBONE DIAGRAM SEBAGAI ROOT CAUSE ANALYSIS TOOL

2013 ◽  
Vol 3 (3) ◽  
Author(s):  
Hari Agung Yuniarto ◽  
Annisa Dewi Akbari ◽  
Nur Aini Masruroh
Keyword(s):  
Bayesian Network ◽  
Root Cause Analysis ◽  
Quality Characteristics ◽  
Analysis Tool ◽  
Machine Method ◽  
Cause Analysis ◽  
Common Cause ◽  
Root Cause ◽  
Fishbone Diagram

<p>Diagram Fishbone (tulang ikan), atau biasa pula disebut ishikawa diagram ataupun cause effect<br />diagram, adalah salah satu dari root cause analysis tools yang paling populer di kalangan praktisi industri<br />untuk melakukan quality improvement mendasarkan pada usaha mengenali akar penyebab terjadinya variasi<br />pada quality characteristics tertentu yang ingin dicapai. Meski telah banyak dipakai di dunia industri,<br />disayangkan tool ini menderita kelemahan karena tidak memfasilitasi analisa korelasi antar potential root<br />causes dari masing-masing kategori yang ada (5M1E - man machine method measurement material<br />environment), selain tentu saja penyajian datanya yang hanya kualitatif. Kelemahan ini diyakini menjadi<br />kontributor utama penyebab kegagalan fishbone diagram dalam mengenali root causes yang berupa sumber<br />variasi common cause dan hanya mampu mengenali yang berasal dari sumber variasi special cause. Bertolak<br />belakang dengan karakteristik special cause variations, common cause variations adalah variasi yang terjadi<br />pada quality characteristics tertentu yang ingin dicapai di mana kemunculannya tidak mudah teridentifikasi<br />dan jikapun berhasil dikenali akan sulit dihilangkan karena sifatnya yang seolah adalah merupakan bagian<br />dari sistem (embedded in a system), cenderung berakar penyebab berupa soft factors serta kemunculannya yang<br />tidak random namun tersamar dalam pola tertentu.<br />Penelitian ini bertujuan melakukan improvement pada kelemahan yang terdapat di fishbone diagram<br />dengan mengadopsi kelebihan yang dimiliki oleh bayesian network agar mampu mengenali root causes yang<br />merupakan common cause variations. Kelebihan bayesian network mengatasi kekurangan fishbone diagram,<br />demikian pula sebaliknya. Oleh karena itu, analisa dilakukan terhadap fishbone diagram dan bayesian network<br />untuk mengenali characteristics dan kelebihan/kekurangannya. Hasil dari analisa tersebut mengarahkan pada<br />sifat-sifat komplementer dari keduanya yang diyakini mampu mengisi gap pada fishbone diagram.<br />Mendasarkan padanya, dikembangkan sebuah model untuk mengintegrasikan konsep serta sifat komplementer<br />yang dimiliki bayesian network dan fishbone diagram. Model ini merepresentasikan metodologi baru dalam<br />root cause analysis, bayes-fishbone. Metodologi yang dikembangkan ini kemudian diujikan ke sebuah case<br />study company untuk melihat applicability-nya.<br />Hasil dari penelitian ini menunjukkan bahwa metodologi bayes-fishbone yang dikembangkan terbukti<br />telah valid mampu merepresentasikan kondisi probabilitas produk cacat sebenarnya pada case study company<br />dengan prosentase perbedaan nilai yang ditunjukkan antara model yang dikembangkan dengan kondisi aktual<br />yang besarnya tidak signifikan yaitu kurang dari 1 % (0,9597%). Dengan menerapkan metode contructive<br />research approach, terbukti pula bahwa metodologi bayes-fishbone berhasil lolos weak-market test yang<br />menunjukkan bahwa metodologi yang dikembangkan applicable pada case study company atau perusahaan lain<br />yang sejenis characteristics dan production process-nya.</p>

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

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