Research on ultrasonic vibration aided femtosecond laser machining process of transparent materials

2015 ◽  
Author(s):  
Yutang Dai ◽  
Bin Liu ◽  
Guanglin Yin ◽  
Tao Li ◽  
Joseph M. Karanja
Keyword(s):  
Femtosecond Laser ◽  
Ultrasonic Vibration ◽  
Machining Process ◽  
Laser Machining ◽  
Transparent Materials

Exploration on Ultrasonic Vibration Aided Femtosecond Laser Machining Process of Fiber Optic Materials

2016 ◽  
Vol 43 (3) ◽  
pp. 0303005 ◽  
Author(s):  
刘斌 Liu Bin ◽  
戴玉堂 Dai Yutang ◽  
殷广林 Yin Guanglin ◽  
李涛 Li Tao
Keyword(s):  
Femtosecond Laser ◽  
Ultrasonic Vibration ◽  
Fiber Optic ◽  
Machining Process ◽  
Laser Machining

Femtosecond Laser Machining of Silica and Transparent Materials

2014 ◽  
Vol 525 ◽  
pp. 128-132 ◽  
Author(s):  
M. Yu. Babiy ◽  
S. S. Golik ◽  
A. V. Kolesnikov ◽  
F. G. Bystrov
Keyword(s):  
Femtosecond Laser ◽  
Focal Spot ◽  
Optical Breakdown ◽  
Laser Induced Breakdown Spectroscopy ◽  
Laser Machining ◽  
Practical Applications ◽  
Breakdown Spectroscopy ◽  
Laser Induced Breakdown ◽  
Laser Spark ◽  
Transparent Materials

Recently, interest in the study of processes occurring in the optical breakdown on the surface of solid targets associated with the increasing number of practical applications of the laser spark, such as laser induced breakdown spectroscopy and micro-and nanomaterials processing. One of the most important tasks - to reduce the diameter of the focal spot, because the size of the modifications directly related to it. However, it is not the only problem faced by the transition to sub-micron range modifications.

scholarly journals In Situ Collection of Nanoparticles during Femtosecond Laser Machining in Air

Nanomaterials ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 2264
Author(s):  
Nithin Joy ◽  
Anne-Marie Kietzig
Keyword(s):  
Femtosecond Laser ◽  
Applied Field ◽  
Target Surface ◽  
Machining Process ◽  
Laser Machining ◽  
Floating Potential ◽  
Laser Material Processing ◽  
Collector Plate ◽  
High Laser Fluence

Nanoparticles generated during laser material processing are often seen as annoying side products, yet they might find useful application upon proper collection. We present a parametric study to identify the dominant factors in nanoparticle removal and collection with the goal of establishing an in situ removal method during femtosecond laser machining. Several target materials of different electrical resistivity, such as Cu, Ti, and Si were laser machined at a relatively high laser fluence. Machining was performed under three different charge conditions, i.e., machining without an externally applied charge (alike atmospheric pulsed laser deposition (PLD)) was compared to machining with a floating potential and with an applied field. Thereby, we investigated the influence of three different charge conditions on the behavior of laser-generated nanoparticles, in particular considering plume deflection, nanoparticle accumulation on a collector plate and their redeposition onto the target. We found that both strategies, machining under a floating potential or under an applied field, were effective for collecting laser-generated nanoparticles. The applied field condition led to the strongest confinement of the nanoparticle plume and tightest resulting nanoparticle collection pattern. Raster-scanning direction was found to influence the nanoparticle collection pattern and ablation depth. However, the laser-processed target surface remained unaffected by the chosen nanoparticle collection strategy. We conclude that machining under a floating potential or an applied field is a promising setup for removing and collecting nanoparticles during the machining process, and thus provides an outlook to circular waste-free laser process design.

Optimization of μEDM process assisted with rotating magnetic pulling force and ultrasonic vibration

2021 ◽  
pp. 095440892098440
Author(s):  
Gurpreet Singh ◽  
DR Prajapati ◽  
PS Satsangi
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Electrical Discharge ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Machining Process ◽  
Micro Electrical Discharge Machining ◽  
Pulling Force ◽  
Tool Rotation

The micro-electrical discharge machining process is hindered by low material removal rate and low surface quality, which bound its capability. The assistance of ultrasonic vibration and magnetic pulling force in micro-electrical discharge machining helps to overcome this limitation and increase the stability of the machining process. In the present research, an attempt has been made on Taguchi based GRA optimization for µEDM assisted with ultrasonic vibration and magnetic pulling force while µEDM of SKD-5 die steel with the tubular copper electrode. The process parameters such as ultrasonic vibration, magnetic pulling force, tool rotation, energy and feed rate have been chosen as process variables. Material removal rate and taper of the feature have been selected as response measures. From the experimental study, it has been found that response output measures have been significantly improved by 18% as compared to non assisted µEDM. The best optimal combination of input parameters for improved performance measures were recorded as machining with ultrasonic vibration (U1), 0.25 kgf of magnetic pulling force (M1), 600 rpm of tool rotation (R2), 3.38 mJ of energy (E3) and 1.5 mm/min of Tool feed rate (F3). The confirmation trail was also carried out for the validation of the results attained by Grey Relational Analysis and confirmed that there is a substantial improvement with both assistance applied simultaneously.

scholarly journals Dry-etching-assisted femtosecond laser machining (Laser Photonics Rev. 11(3)/2017)

2017 ◽  
Vol 11 (3) ◽  
pp. 1770032
Author(s):  
Xue-Qing Liu ◽  
Qi-Dai Chen ◽  
Kai-Min Guan ◽  
Zhuo-Chen Ma ◽  
Yan-Hao Yu ◽  
...  
Keyword(s):  
Femtosecond Laser ◽  
Dry Etching ◽  
Laser Machining

Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses

2006 ◽  
Vol 89 (2) ◽  
pp. 021106 ◽  
Author(s):  
Wataru Watanabe ◽  
Satoshi Onda ◽  
Takayuki Tamaki ◽  
Kazuyoshi Itoh ◽  
Junji Nishii
Keyword(s):  
Femtosecond Laser ◽  
Laser Pulses ◽  
Femtosecond Laser Pulses ◽  
Laser Joining ◽  
Transparent Materials

Femtosecond Laser Machining At Submicron And Nano Scale

2021 ◽  
Author(s):  
Alireza. Dalili
Keyword(s):  
Femtosecond Laser ◽  
Laser Machining ◽  
Nano Scale

Femtosecond Laser Machining At Submicron And Nano Scale

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