Advances in three-dimensional integration technologies in support of infrared focal plane arrays

2015 ◽  
Author(s):  
D. S. Temple ◽  
E. P. Vick ◽  
D. Malta ◽  
M. R. Lueck ◽  
M. R. Skokan ◽  
...  
Keyword(s):  
Focal Plane ◽  
Three Dimensional ◽  
Focal Plane Arrays ◽  
Infrared Focal Plane Arrays

Dependence of the Deformation of 128×128 InSb Focal-plane Arrays on the Silicon Readout Integrated Circuit Thickness

2015 ◽  
Vol 9 (1) ◽  
pp. 170-174 ◽  
Author(s):  
Xiaoling Zhang ◽  
Qingduan Meng ◽  
Liwen Zhang
Keyword(s):  
Thermal Shock ◽  
Indium Antimonide ◽  
Integrated Circuit ◽  
Focal Plane ◽  
Three Dimensional ◽  
Fracture Probability ◽  
Focal Plane Arrays ◽  
Thermal Shock Test ◽  
Readout Integrated Circuit ◽  
Three Dimensional Modeling

The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface of InSb IRFPAs. Simulation results show that when the silicon ROIC is thinned from 300 μm to 20 μm, the maximal displacement in the InSb IRFPAs linearly decreases from 7.115 μm to 0.670 μm in the upward direction, and also decreases linearly from 14.013 μm to 1.612 μm in the downward direction. Once the thickness of the silicon ROIC is less than 50 μm, the square checkerboard buckling deformation distribution presenting in the thicker InSb IRFPAs disappears, and the top surface of the InSb IRFPAs becomes flat. All these findings imply that the thickness of the silicon ROIC determines the degree of deformation in the InSb IRFPAs under a thermal shock test, that the method of thinning a silicon ROIC is suitable for decreasing the fracture probability of the InSb chip, and that this approach improves the reliability of InSb IRFPAs.

Modulation transfer function of infrared focal plane arrays

2015 ◽  
Author(s):  
S. D. Gunapala ◽  
S. B. Rafol ◽  
D. Z. Ting ◽  
A. Soibel ◽  
C. J. Hill ◽  
...  
Keyword(s):  
Transfer Function ◽  
Modulation Transfer Function ◽  
Focal Plane ◽  
Focal Plane Arrays ◽  
Modulation Transfer ◽  
Infrared Focal Plane Arrays

Methodology for testing infrared focal-plane arrays in simulated nuclear radiation environments

1992 ◽  
Author(s):  
Edward L. Divita ◽  
Robert E. Mills ◽  
Thomas L. Koch ◽  
M. J. Gordon ◽  
R. A. Wilcox ◽  
...  
Keyword(s):  
Focal Plane ◽  
Focal Plane Arrays ◽  
Nuclear Radiation ◽  
Infrared Focal Plane Arrays

Advanced III/V quantum-structure devices for high performance infrared focal plane arrays

2009 ◽  
Author(s):  
Robert Rehm ◽  
Martin Walther ◽  
Johannes Schmitz ◽  
Frank Rutz ◽  
Joachim Fleissner ◽  
...  
Keyword(s):  
Focal Plane ◽  
High Performance ◽  
Focal Plane Arrays ◽  
Quantum Structure ◽  
Infrared Focal Plane Arrays

scholarly journals Radiometric packaging of uncooled bolometric infrared focal plane arrays

2017 ◽  
Author(s):  
Timothy Pope ◽  
Patrice Côté ◽  
Sonia García-Blanco ◽  
Mélanie Leclerc ◽  
Linh Ngo Phong ◽  
...  
Keyword(s):  
Focal Plane ◽  
Focal Plane Arrays ◽  
Infrared Focal Plane Arrays
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