J-integral evaluation for an interface crack under thermal load using digital image correlation

2015 ◽  
Author(s):  
Hiroto Yamane ◽  
Shuichi Arikawa ◽  
Satoru Yoneyama ◽  
Yasuaki Watanabe ◽  
Tatsuhiko Asai ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Interface Crack ◽  
Digital Image ◽  
Thermal Load ◽  
Image Correlation ◽  
J Integral ◽  
Integral Evaluation

scholarly journals G0310505 J-integral Evaluation from Measured Displacement Fields Using Digital Image Correlation

2014 ◽  
Vol 2014 (0) ◽  
pp. _G0310505--_G0310505-
Author(s):  
Hiroto YAMANE ◽  
Satoru YONEYAMA ◽  
Shuichi ARIKAWA ◽  
Yasuaki WATANABE ◽  
Tatsuhiko ASAI ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Image Correlation ◽  
J Integral ◽  
Displacement Fields ◽  
Integral Evaluation ◽  
Measured Displacement

scholarly journals Investigation by Digital Image Correlation of Mixed-Mode I and II Fracture Behavior of Polymeric IASCB Specimens with Additive Manufactured Crack-Like Notch

Materials ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1084
Author(s):  
Tommaso Maria Brugo ◽  
Ivo Campione ◽  
Giangiacomo Minak
Keyword(s):  
Additive Manufacturing ◽  
Digital Image Correlation ◽  
Digital Image ◽  
Complex Geometry ◽  
Selective Laser Sintering ◽  
Fem Analysis ◽  
Image Correlation ◽  
Mode I ◽  
Plastic Behavior ◽  
J Integral

In this work, the fracture mechanics properties of polyamide (PA) specimens manufactured by the selective laser sintering (SLS) technology are investigated, in which an embedded crack-like notch was inserted in the design and produced during the additive manufacturing (AM) phase. To cover a wide variety of mode I/II mixity levels, the inclined asymmetrical semicircular specimen subjected to three points loading (IASCB) was employed. The investigation was carried out by analyzing the full displacement field in the proximity of the crack tip by means of the digital image correlation (DIC) technique. To characterize the material, which exhibits a marked elastic-plastic behavior, the quantity J-integral was evaluated by two different methods: the first one exploits the full fields measured by the DIC, whereas the second one exploits the experimental load–displacement curves along with FEM analysis. The DIC methodology was experimentally validated and proposed as an alternative method to evaluate the J-integral. It is especially suited for conditions in which it is not possible to use the conventional LDC method due to complex and possibly unknown loading conditions. Furthermore, results showed that the AM technique could be used effectively to induce cracks in this type of material. These two aspects together can lead to both a simplification of the fracture characterization process and to the possibility of dealing with a wider number of practical, real-world scenarios. Indeed, because of the nature of the additive manufacturing process, AM crack-like notches can be sintered even having complex geometry, being three-dimensional and/or inside the tested structure.

Evaluating J-integral from Displacement Fields Measured by Digital Image Correlation

Strain ◽  
2013 ◽  
Vol 50 (2) ◽  
pp. 147-160 ◽  
Author(s):  
S. Yoneyama ◽  
S. Arikawa ◽  
S. Kusayanagi ◽  
K. Hazumi
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Image Correlation ◽  
J Integral ◽  
Displacement Fields
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