High rate premetallization sputter etching of submicron vias using a high-density dual-frequency plasma source
Keyword(s):
2010 ◽
Vol 19
(4)
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pp. 045012
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Keyword(s):
2013 ◽
Vol 41
(8)
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pp. 1856-1862
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1994 ◽
Vol 138
(1-4)
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pp. 443-447
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1971 ◽
Vol 29
(3_suppl)
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pp. 1196-1198
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Keyword(s):
1997 ◽
Vol 144
(7)
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pp. 2455-2461
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2000 ◽
Vol 39
(Part 1, No. 4A)
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pp. 1903-1907
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2015 ◽
Vol 86
(7)
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pp. 073506
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