Temperature measurements on metallic lines under current stresses by laser probing and correlation with electromigration tests at wafer level

1993 ◽  
Author(s):  
Wilfrid Claeys ◽  
Francois Giroux ◽  
S. Dilhaire ◽  
C. Gounelle ◽  
V. Quintard ◽  
...  
Keyword(s):  
Temperature Measurements ◽  
Wafer Level ◽  
Laser Probing

Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing

2011 ◽  
Author(s):  
Steven Kasapi ◽  
William Lo ◽  
Joy Liao ◽  
Bruce Cory ◽  
Howard Marks
Keyword(s):  
Failure Analysis ◽  
Continuous Wave ◽  
Wafer Level ◽  
Root Cause ◽  
Non Invasive ◽  
Laser Probing ◽  
Volume Yield ◽  
Scan Chain ◽  
Leakage Failure ◽  
Root Cause Identification

Abstract A variety of EFA techniques have been deployed to improve scan chain failure isolation. In contrast to other laser techniques, modulation mapping (MM) does not require electrically perturbing of the device. Beginning with a review of MM and continuous-wave (CW) probing as well as shift debug using MM, this paper presents three case studies involving scan chains with subtle resistive and leakage failure mechanisms, including transition, bridge, and slow-to-rise/fall failures, using a combination of these techniques. Combining modulation mapping with laser probing has proven to be a very effective and efficient methodology for isolating shift defects, even challenging timing-related shift defects. So far, every device submitted for physical failure analysis using this workflow has led to successful root cause identification. The techniques are sufficiently non-invasive and straightforward that they can be successfully applied at wafer level for volume, yield-oriented EFA.

Transient gain-versus-absorption laser probing of spin-orbit states, kinetics and dynamics

1987 ◽  
Vol 84 ◽  
pp. 385-391
Author(s):  
Smedley John E. ◽  
Hess Wayne P. ◽  
Haugen Harold K. ◽  
R. Leone Stephen
Keyword(s):  
Spin Orbit ◽  
Laser Probing ◽  
Kinetics And Dynamics

CARS TEMPERATURE MEASUREMENTS IN A PLASMA HEATED COAL COMBUSTOR

1987 ◽  
Vol 48 (C7) ◽  
pp. C7-757-C7-760
Author(s):  
P. SPIBERG ◽  
C. CAHEN ◽  
P. DESCHAMPS
Keyword(s):  
Temperature Measurements

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level
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