Three-dimensional finite element calculations of thermal stress in aluminum interconnect with tungsten via-studs

1993 ◽  
Author(s):  
Lloyd G. Burrell ◽  
Amit X. Kapur
Keyword(s):  
Finite Element ◽  
Thermal Stress ◽  
Three Dimensional ◽  
Finite Element Calculations ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element

Thermal-stress analysis and calculation of single and dual chip set double-sided circuit board based on three-dimensional finite element algorithm

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 49-54
Author(s):  
Lan Song ◽  
Yang Zhao ◽  
Yaoming Zhou ◽  
Haifei Xiang
Keyword(s):  
Finite Element ◽  
Temperature Field ◽  
Thermal Stress ◽  
Three Dimensional ◽  
Circuit Board ◽  
Content Type ◽  
Thermal Stress Field ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element ◽  
Element Algorithm

Purpose – The purpose of this paper is to analyze and figure out the temperature field and thermal stress field with the calculation model of thermal insulation material and composite material. Design/methodology/approach – The paper adopted the three-dimensional finite element algorithm. Findings – The simulated results showed great shearing strength between the chipset and the printed circuit board. The position of chip exerts great influence on the distribution of temperature field and thermal stress field of circuit board. The reasonable distribution of chip will effectively reduce the temperature extremum and stress extremum of circuit board. Originality/value – The paper analyzes and presents a discussion of the problems relating to the density of electronic packaging. The analysis process and the method of the paper provide essential help in resolving electronic device heat problems.

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