Characterization of WF[sub 6]/N[sub 2]/H[sub 2] plasma enhanced chemical vapor deposited W[sub x]N films as barriers for Cu metallization
2000 ◽
Vol 18
(1)
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pp. 242
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1999 ◽
Vol 425
(2-3)
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pp. 245-258
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1995 ◽
Vol 34
(Part 1, No. 12B)
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pp. 6857-6860
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2006 ◽
Vol 89
(11)
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pp. 3560-3563
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2011 ◽
Vol 485
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pp. 133-136
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2003 ◽
Vol 163-164
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pp. 214-219
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2013 ◽
Vol 16
(1)
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pp. 126-130
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2011 ◽
Vol 32
(4)
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pp. 560-562
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