Tungsten silicide composition analysis by Rutherford backscattering spectroscopy, Auger electron spectroscopy, and x-ray photoelectron spectroscopy

1998 ◽  
Vol 16 (3) ◽  
pp. 1103-1105 ◽  
Author(s):  
C. A. Bradbury ◽  
D. K. Fillmore
1989 ◽  
Vol 170 ◽  
Author(s):  
P. D. Stupik ◽  
T. R. Jervis ◽  
M. Nastasi ◽  
M. M. Donovan ◽  
A. R. Barron

AbstractSilicon coatings on niobium substrates were subjected to thermal, ion beam and laser mixing, and the effectiveness of the different methods for the synthesis of graded interfaces was compared. The resulting metal/silicon interfaces were characterized by X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES) and Rutherford backscattering (RBS).


1978 ◽  
Vol 32 (2) ◽  
pp. 175-177 ◽  
Author(s):  
L. Bradley ◽  
Y. M. Bosworth ◽  
D. Briggs ◽  
V. A. Gibson ◽  
R. J. Oldman ◽  
...  

The difficulties of nonuniform ion etching which hamper depth profiling by X-ray photoelectron spectroscopy (XPS) have been overcome by use of a mechanically scanned saddle-field ion source. The system and its calibration for uniformity are described, and its performance is illustrated by the depth profile of a Si3N4/SiO2/Si metal nitride oxide silicon device. This also allows the potential advantages of XPS profiling over Auger electron spectroscopy profiling to be discussed.


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