Method for the study of grain boundary diffusion effects by Auger electron spectroscopy sputter depth profiling

1997 ◽  
Vol 15 (4) ◽  
pp. 2013-2016 ◽  
Author(s):  
Y. S. Lee ◽  
K. Y. Lim ◽  
Y. D. Chung ◽  
C. N. Whang ◽  
J. J. Woo ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Depth Profiling ◽  
Grain Boundary Diffusion ◽  
Diffusion Effects

Investigation of Ta grain boundary diffusion in copper by means of Auger electron spectroscopy

2004 ◽  
Vol 459 (1-2) ◽  
pp. 303-307 ◽  
Author(s):  
G Erdélyi ◽  
G Langer ◽  
J Nyéki ◽  
L Kövér ◽  
C Tomastik ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

Determination of grain-boundary diffusion coefficients by Auger electron spectroscopy

2000 ◽  
Vol 162-163 ◽  
pp. 213-218 ◽  
Author(s):  
Z. Erdélyi ◽  
Ch. Girardeaux ◽  
G.A. Langer ◽  
L. Daróczi ◽  
A. Rolland ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Diffusion Coefficients ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

Investigation of grain-boundary diffusion of nickel in molybdenum by auger electron spectroscopy

1992 ◽  
Vol 35 (7) ◽  
pp. 611-614 ◽  
Author(s):  
I. V. Ratochka ◽  
V. B. Marvin ◽  
I. K. Zverev ◽  
V. M. Adeev ◽  
Yu. N. Ivashchenko ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

Grain Boundary Diffusion of Silver in Copper-Iron Alloys

2012 ◽  
Vol 323-325 ◽  
pp. 161-164 ◽  
Author(s):  
Danil V. Vaganov ◽  
Sergei Zhevnenko ◽  
Yuri Terentyev
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Grain Boundaries ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Alloy Composition ◽  
Electrochemical Etching ◽  
Triple Product ◽  
Sem Investigation

Grain boundary (GB) diffusion of Ag in Cu-based alloys with Fe (0, 0.14, 0.29, 0.43, 0.55 and 0.99 at. % Fe) was investigated. The experiments were performed at 600, 650 and 700 °C, which corresponded to B-regime. It was proved by the presence of diffusion wedges. The triple product of silver GB diffusion was obtained by measuring of angle at the top of isoconcentration profiles which was detected by electrochemical etching. It was shown that iron decreased the triple product at higher temperatures and didnt affect significantly at lower temperatures. SEM investigation showed the presence of small (10-100 nm) precipitates on the copper grain boundaries. Analysis of particles composition by Auger electron spectroscopy indicated higher concentration of iron comparing with the alloy composition.

Sidewall-Less Depth Profiling with Auger Electron Spectroscopy

1995 ◽  
Vol 34 (Part 1, No. 12A) ◽  
pp. 6483-6486
Author(s):  
Kazuyuki Inoue ◽  
Maki Tokoro ◽  
Noritomo Suzuki ◽  
Ryohji Matsubara ◽  
KenjiNakano
Keyword(s):  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Depth Profiling
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