Approximate method for reducing the effect of beam misalignment on low‐energy electron diffraction I(E) curves at the normal incidence: The horizontal‐beam method

1994 ◽  
Vol 12 (2) ◽  
pp. 471-475 ◽  
Author(s):  
Seigi Mizuno ◽  
Hiroshi Tochihara ◽  
Takaaki Kawamura
1990 ◽  
Vol 208 ◽  
Author(s):  
W. N. Unertl ◽  
C. S. Shern

ABSTRACTMirror Electron Microscopy – Low Energy Electron Diffraction (MEMLEED) combines a LEED with MEM in a single simple instrument for studies of surface processes such as phase transitions and premelting under ultra-high vacuum (uhv) conditions. In MEMLEED, 5–20 keV primary electrons are decelerated by an electrostatic mirror-objective lens in which the sample is the mirror element. In the MEN mode, electrons are reflected just above the surface, reaccelerated through the objective lens and imaged. Contrast is due to variations in both surface potential and topography. Current uhv instruments have lateral resolution of about 1 μm. In the LEED mode, 0-100 eV electrons strike the sample at near normal incidence. Diffracted electrons are accelerated through the objective lens. Beam spacings in the imaged diffraction pattern are proportional to k11 and beams do not move as the incident energy is varied. MEMLEED has intrinsically higher transfer width and is less sensitive to magnetic fields near the sample than conventional LEED. Design considerations for uhv instruments are discussed. Applications to the study of order-disorder transitions, premelting phenomena, and to measurements of changes in surface potential are described.


1990 ◽  
Vol 68 (4-5) ◽  
pp. 353-356 ◽  
Author(s):  
H. C. Zeng ◽  
R. A. McFarlane ◽  
K. A. R. Mitchell

A low-energy electron diffraction (LEED) crystallographic analysis has been undertaken to assess the lateral and vertical relaxations for the Cu(100)-(2 × 2)-S surface structure. The study uses five normal-incidence beams and seven beams with an off-normal direction for a polar angle of incidence equal to 8°. Both lateral and vertical relaxations in the copper structure are small (0.03 Å or less) compared with the structure in bulk copper, but the senses are unchanged from the recent normal-incidence analysis (H. C. Zeng, R. A. McFarlane, and K. A. R. Mitchell, Phys. Rev. B, 39, 8000 (1989)). The new LEED-determined S—Cu bond length is 2.23 ± 0.06 Å, while the S to topmost Cu interlayer spacing is 1.28 ± 0.03 Å.


2014 ◽  
Vol 59 (6) ◽  
pp. 612-621 ◽  
Author(s):  
P.V. Galiy ◽  
◽  
Ya.B. Losovyj ◽  
T.M. Nenchuk ◽  
I.R. Yarovets’ ◽  
...  

2000 ◽  
Vol 458 (1-3) ◽  
pp. 155-161 ◽  
Author(s):  
S Walter ◽  
V Blum ◽  
L Hammer ◽  
S Müller ◽  
K Heinz ◽  
...  

1985 ◽  
Vol 32 (10) ◽  
pp. 6131-6137 ◽  
Author(s):  
J.-M. Baribeau ◽  
J.-D. Carette ◽  
P. J. Jennings ◽  
R. O. Jones

Sign in / Sign up

Export Citation Format

Share Document