Summary Abstract: Structure and electrical properties of grain boundaries in semiconductor crystals

1987 ◽  
Vol 5 (4) ◽  
pp. 1690-1691
Author(s):  
J.‐L. Maurice ◽  
J.‐Y. Laval
Keyword(s):  
Electrical Properties ◽  
Grain Boundaries ◽  
Semiconductor Crystals ◽  
Abstract Structure

scholarly journals Effects of Charge Compensation on Colossal Permittivity and Electrical Properties of Grain Boundary of CaCu3Ti4O12 Ceramics Substituted by Al3+ and Ta5+/Nb5+

Molecules ◽  
2021 ◽  
Vol 26 (11) ◽  
pp. 3294
Author(s):  
Jakkree Boonlakhorn ◽  
Jedsada Manyam ◽  
Pornjuk Srepusharawoot ◽  
Sriprajak Krongsuk ◽  
Prasit Thongbai
Keyword(s):  
Dielectric Properties ◽  
Electrical Properties ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Barrier Height ◽  
Potential Barrier ◽  
Charge Compensation ◽  
Solid State Reaction Method ◽  
Wide Frequency Range ◽  
Potential Barrier Height

The effects of charge compensation on dielectric and electrical properties of CaCu3Ti4-x(Al1/2Ta1/4Nb1/4)xO12 ceramics (x = 0−0.05) prepared by a solid-state reaction method were studied based on the configuration of defect dipoles. A single phase of CaCu3Ti4O12 was observed in all ceramics with a slight change in lattice parameters. The mean grain size of CaCu3Ti4-x(Al1/2Ta1/4Nb1/4)xO12 ceramics was slightly smaller than that of the undoped ceramic. The dielectric loss tangent can be reduced by a factor of 13 (tanδ ~0.017), while the dielectric permittivity was higher than 104 over a wide frequency range. Impedance spectroscopy showed that the significant decrease in tanδ was attributed to the highly increased resistance of the grain boundary by two orders of magnitude. The DFT calculation showed that the preferential sites of Al and Nb/Ta were closed together in the Ti sites, forming self-charge compensation, and resulting in the enhanced potential barrier height at the grain boundary. Therefore, the improved dielectric properties of CaCu3Ti4-x(Al1/2Ta1/4Nb1/4)xO12 ceramics associated with the enhanced electrical properties of grain boundaries. In addition, the non-Ohmic properties were also improved. Characterization of the grain boundaries under a DC bias showed the reduction of potential barrier height at the grain boundary. The overall results indicated that the origin of the colossal dielectric properties was caused by the internal barrier layer capacitor structure, in which the Schottky barriers at the grain boundaries were formed.

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Naokazu Murata ◽  
Naoki Saito ◽  
Kinji Tamakawa ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Electrical Properties ◽  
Grain Boundaries ◽  
Fatigue Fracture ◽  
High Crystallinity ◽  
Mechanical And Electrical Properties ◽  
Copper Interconnection ◽  
Electroplated Copper ◽  
Two Parameters ◽  
Low Crystallinity

Effects of crystallographic quality of grain boundaries on mechanical and electrical properties were investigated experimentally. A novel method using two parameters of image quality (IQ) and confidence index (CI) values based on electron back-scattering diffraction (EBSD) analysis was proposed in order to evaluate crystallographic quality of grain boundaries. IQ value was defined as an index to evaluate crystallinity in region irradiated with electron beam. CI value determined existence of grain boundaries in the region. It was found that brittle intergranular fatigue fracture occurred in the film without annealing and the film annealed at 200 °C because network of grain boundaries with low crystallinity remained in these films. On the other hand, the film annealed at 400 °C caused only ductile transgranular fatigue fracture because grain boundaries with low crystallinity almost disappeared. From results of measurement of electrical properties, electrical resistivity of copper interconnection annealed at 400 °C with high crystallinity (2.09 × 10−8 Ωm) was low and electron migration (EM) resistance was high compared with an copper interconnection without annealing with low crystallinity (3.33 × 10−8 Ωm). It was clarified that the interconnection with high crystallinity had superior electrical properties. Thus, it was clarified that the crystallographic quality of grain boundaries has a strong correlation of mechanical and electrical reliability.

scholarly journals Structural and Electrical Studies on ZnO-Based Thin Films by Laser Irradiation

2016 ◽  
Vol 2016 ◽  
pp. 1-6 ◽  
Author(s):  
Shanyue Zhao ◽  
Yinqun Hua ◽  
Ruifang Chen ◽  
Jian Zhang ◽  
Ping Ji
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Electrical Properties ◽  
Grain Boundaries ◽  
Laser Irradiation ◽  
Nonlinear Coefficient ◽  
Acceptor State ◽  
Xrd Pattern ◽  
Electrical Studies ◽  
Structural And Electrical Properties

The effects of laser irradiation on the structural and electrical properties of ZnO-based thin films were investigated. The XRD pattern shows that the thin films were highly textured along thec-axis and perpendicular to the surface of the substrate. Raman spectra reveal that Bi2O3segregates mainly at ZnO-ZnO grain boundaries. After laser irradiation processing, the grain size of the film was reduced significantly, and the intrinsic atomic defects of grain boundaries and Bi element segregated at the grain boundary were interacted frequently and formed the composite defects of acceptor state. The nonlinear coefficient increased to 24.31 and the breakdown voltage reduced to 5.34 V.

Electrical Properties of Dislocations and Boundaries in Semiconductors

1982 ◽  
Vol 14 ◽  
Author(s):  
Hans J. Queisser
Keyword(s):  
Electrical Properties ◽  
Imaging Techniques ◽  
Experimental Methods ◽  
Actual Situation ◽  
Dangling Bond ◽  
Semiconductor Crystals ◽  
Capacitance Spectroscopy ◽  
Electron Microscopes ◽  
Regular Arrays ◽  
Electronic Behavior

ABSTRACTSimple models have been suggested to predict electronic properties of lattice defects in semiconductor crystals: dislocations ought to act via the acceptor character of dangling bonds, and small-angle grain boundaries ought to consist of regular arrays of dislocations. The actual situation in most semiconductors is, however, much more complicated. The observed electrical effects of dislocations do not confirm the dangling-bond concept, they are affected by dissociation and reconstruction. There appear to be differences between straight and kinked dislocations. Dislocations owe much of their electronic behavior to clouds and precipitates of impurities; oxygen in silicon plays a significant role. This review summarizes the present status of experimental methods and results, including luminescence and capacitance spectroscopy as well as mapping and imaging techniques using electron-microscopes.

scholarly journals Electrical properties of mechanically activated zinc oxide

2006 ◽  
Vol 38 (2) ◽  
pp. 131-138 ◽  
Author(s):  
K. Vojisavljevic ◽  
M. Zunic ◽  
G. Brankovic ◽  
T. Sreckovic
Keyword(s):  
Zinc Oxide ◽  
Electrical Properties ◽  
Grain Boundaries ◽  
Arrhenius Equation ◽  
Electrical Response ◽  
High Energy ◽  
Microstructural Properties ◽  
Impedance Analyzer ◽  
Zinc Oxide Powder ◽  
Zno Ceramics

Microstructural properties of a commercial zinc oxide powder were modified by mechanical activation in a high-energy vibro-mill. The obtained powders were dry pressed and sintered at 1100?C for 2 h. The electrical properties of grain boundaries of obtained ZnO ceramics were studied using an ac impedance analyzer. For that purpose, the ac electrical response was measured in the temperature range from 23 to 240?C in order to determine the resistance and capacitance of grain boundaries. The activation energies of conduction were obtained using an Arrhenius equation. Donor densities were calculated from Mott-Schottky measurements. The influence of microstructure, types and concentrations of defects on electrical properties was discussed.

scholarly journals Relaxation type Kinetic equation for electrons in polycrystalline metal

2021 ◽  
Vol 2056 (1) ◽  
pp. 012021
Author(s):  
T N Lam ◽  
F Karimov ◽  
A A Yushkanov
Keyword(s):  
Kinetic Equation ◽  
Electrical Properties ◽  
Grain Boundaries ◽  
Electron Scattering ◽  
Bulk Conductivity ◽  
Polycrystalline Metal ◽  
Conduction Electrons

Abstract The kinetic equation for electrons in a polycrystalline metal is considered. A kinetic equation is written that describes in a unified manner the scattering of conduction electrons both by impurities or phonons and by grain boundaries. This kinetic equation takes into account the scattering of electrons at the boundaries of crystallites of a polycrystalline metal An expression is obtained for the bulk conductivity in the general case. Let us analyze the effect of electron scattering at grain boundaries on its electrical properties.

Microtexture Dependence of Mechanical and Electrical Properties of Gold Thin Films Used for Micro Bumps of 3D Stacking Structures

2020 ◽  
Author(s):  
Genta Nakauchi ◽  
Shota Akasaki ◽  
Hideo Miura
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Electrical Properties ◽  
Grain Boundaries ◽  
Indentation Test ◽  
Electron Back Scatter Diffraction ◽  
Effective Lifetime ◽  
Mechanical And Electrical Properties ◽  
Gold Thin Films ◽  
3D Stacking

Abstract The variation of their crystallinity, in other words, the order of atom arrangement of grain boundaries in electroplated gold thin films was investigated by changing their manufacturing conditions. Then, the effect of the crystallinity on both their mechanical and electrical properties was measured by using nano-indentation test and electromigration test. The crystallinity of the gold thin films was varied by changing the under-layer material used for electroplating. Also, the micro texture of gold thin films was evaluated by EBSD (Electron Back-Scatter Diffraction) and XRD (X-Ray Diffraction). It was clarified that the crystallinity of the electroplated gold thin films changed drastically depending on the crystallinity of the under-layer materials and electroplating conditions such as current density and temperature. This variation of the crystallinity should have caused wide variation of mechanical properties of the films. In addition, their mechanical properties such as Young’s modulus and hardness showed wide variation by about 3 times comparing with those of bulk gold. Similarly, the EM resistance of the electroplated gold bumps varied drastically depending on the ratio of porous grain boundaries and their crystallinity. Both the ratio and crystallinity also varied depending on the crystallinity of the under layer and electroplating conditions. The effective lifetime of the gold bumps was successfully predicted by considering both the crystallinity and residual stress of fine gold bumps. The lifetime varied more than 10 times as a strong function of the crystallinity of grain boundaries in the fine bumps. Therefore, it is very important to control the crystallinity of the under-layer for electroplating in order to control the distribution of the mechanical properties and reliability of the electroplated gold thin films.

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