Thermal atomic layer deposition of Sn metal using SnCl4 and a vapor phase silyl dihydropyrazine reducing agent
2018 ◽
Vol 36
(6)
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pp. 06A106
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2001 ◽
Vol 148
(10)
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pp. G566
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2016 ◽
Vol 379
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pp. 523-529
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2013 ◽
Vol 135
(28)
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pp. 10294-10297
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