Role of atomic layer deposited aluminum oxide as oxidation barrier for silicon based materials

2015 ◽  
Vol 33 (1) ◽  
pp. 01A142 ◽  
Author(s):  
Giuseppe Fiorentino ◽  
Bruno Morana ◽  
Salvatore Forte ◽  
Pasqualina Maria Sarro
2021 ◽  
pp. 2101117
Author(s):  
Emanuela Schilirò ◽  
Raffaella Lo Nigro ◽  
Salvatore E. Panasci ◽  
Simonpietro Agnello ◽  
Marco Cannas ◽  
...  

Author(s):  
Sungho Park ◽  
Byung Jun Kim ◽  
Tae Yeon Kim ◽  
Eui Young Jung ◽  
Kyu-Myung Lee ◽  
...  

We have developed a visible-light phototransistor with excellent photodetection characteristics and stability via atomic layer deposition (ALD) to add a thin layer of aluminum oxide (Al2O3) to quantum dot (QD)/zinc oxide (ZnO) films.


2021 ◽  
Vol 23 (5) ◽  
pp. 3467-3478
Author(s):  
J. I. Paez-Ornelas ◽  
H. N. Fernández-Escamilla ◽  
H. A. Borbón-Nuñez ◽  
H. Tiznado ◽  
Noboru Takeuchi ◽  
...  

Atomic description of ALD in systems that combine large surface area and high reactivity is key for selecting the right functional group to enhance the ligand-exchange reactions.


2011 ◽  
Vol 334 (1) ◽  
pp. 113-117 ◽  
Author(s):  
Kevin Goodman ◽  
Vladimir Protasenko ◽  
Jai Verma ◽  
Tom Kosel ◽  
Grace Xing ◽  
...  

2010 ◽  
Vol 20 (18) ◽  
pp. 3099-3105 ◽  
Author(s):  
David J. Comstock ◽  
Steven T. Christensen ◽  
Jeffrey W. Elam ◽  
Michael J. Pellin ◽  
Mark C. Hersam

2021 ◽  
Author(s):  
Matthias Marcus Minjauw ◽  
Ji-Yu Feng ◽  
Timo Sajavaara ◽  
Christophe Detavernier ◽  
Jolien Dendooven

In this work, the use of ruthenium tetroxide (RuO4) as a co-reactant for atomic layer deposition (ALD) is reported. The role of RuO4 as a co-reactant is twofold: it acts...


2007 ◽  
Vol 129 (03) ◽  
pp. 24-29 ◽  
Author(s):  
Arthur C. Ratzel

This article discusses growing role of silicon micro-electron-mechanical systems (MEMS) technology in automotive and consumer products, telecommunications, radio-frequency applications, and medical care. The article also highlights that silicon-based MEMS devices must be constructed in clean rooms, such as one at Sandia's Microelectronics Development laboratory. According to engineers, the search for an in-depth understanding of wear mechanisms in dynamic silicon MEMS is expected to drive an ambitious wave of leading-edge research into microscale science and engineering, distinct from that which prevailed at the mesoscale. It has been found that gas damping between MEMS structures and the substrate, within the sealed package, can cause serious nonlinearities. While this doesn't lead to failure in the classic sense, it may make it harder to close a switch. On the plus side, gas damping can provide a cushion that enables a MEMS device to survive surprisingly high shock loads.


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