Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy

2008 ◽  
Vol 26 (5) ◽  
pp. 1109-1114 ◽  
Author(s):  
Chi-Cheng Hung ◽  
Wen-Hsi Lee ◽  
Ying-Lang Wang ◽  
Din-Yuen Chan ◽  
Gwo-Jen Hwang
Keyword(s):  
Polyethylene Glycol ◽  
Electrochemical Impedance Spectroscopy ◽  
Impedance Spectroscopy ◽  
Electrochemical Impedance ◽  
Suppression Effect ◽  
Copper Electroplating

Magnetic Effect during Copper Electroplating Using Electrochemical Impedance Spectroscopy

2009 ◽  
Vol 48 (7) ◽  
pp. 076506 ◽  
Author(s):  
Chi-Cheng Hung ◽  
Wen-Hsi Lee ◽  
Shih-Chieh Chang ◽  
Gwo-Jen Hwang ◽  
Ying-Lang Wang
Keyword(s):  
Electrochemical Impedance Spectroscopy ◽  
Impedance Spectroscopy ◽  
Electrochemical Impedance ◽  
Magnetic Effect ◽  
Copper Electroplating
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