Effect of process parameters on via formation in Si using deep reactive ion etching

I. U. Abhulimen; S. Polamreddy; S. Burkett; L. Cai; L. Schaper

doi:10.1116/1.2787869

Effect of process parameters on via formation in Si using deep reactive ion etching

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ◽

10.1116/1.2787869 ◽

2007 ◽

Vol 25 (6) ◽

pp. 1762 ◽

Cited By ~ 22

Author(s):

I. U. Abhulimen ◽

S. Polamreddy ◽

S. Burkett ◽

L. Cai ◽

L. Schaper

Keyword(s):

Process Parameters ◽

Reactive Ion Etching ◽

Ion Etching ◽

Deep Reactive Ion Etching

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Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)

Journal of Microelectromechanical Systems ◽

10.1109/jmems.2002.1007405 ◽

2002 ◽

Vol 11 (3) ◽

pp. 264-275 ◽

Cited By ~ 156

Author(s):

Kuo-Shen Chen ◽

A.A. Ayon ◽

Xin Zhang ◽

S.M. Spearing

Keyword(s):

Surface Morphology ◽

Process Parameters ◽

Mechanical Performance ◽

Reactive Ion Etching ◽

Ion Etching ◽

Deep Reactive Ion Etching ◽

Silicon Structures

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Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching

Korean Journal of Metals and Materials ◽

10.3365/kjmm.2010.48.11.1028 ◽

2010 ◽

Vol 48 (11) ◽

pp. 1028-1034 ◽

Cited By ~ 12

Author(s):

Kwang-Seok Kim ◽

Young-Chul Lee ◽

Jee-Hyuk Ahn ◽

Jun Yeob Song ◽

Choong D. Yoo ◽

...

Keyword(s):

Process Parameters ◽

Reactive Ion Etching ◽

Ion Etching ◽

Deep Reactive Ion Etching

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Streamlined cryogenic deep reactive ion etching protocol for hybrid micronozzle arrays

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/21/10/105001 ◽

2011 ◽

Vol 21 (10) ◽

pp. 105001

Author(s):

Ahmet Erten ◽

Milan Makale ◽

Xuekun Lu ◽

Bernd Fruhberger ◽

Santosh Kesari ◽

...

Keyword(s):

Reactive Ion Etching ◽

Ion Etching ◽

Deep Reactive Ion Etching

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Formation of silicon nanostructures with a combination of spacer technology and deep reactive ion etching

Nanoscale Research Letters ◽

10.1186/1556-276x-7-288 ◽

2012 ◽

Vol 7 (1) ◽

Cited By ~ 6

Author(s):

Daniel CS Bien ◽

Hing Wah Lee ◽

Siti Aishah Mohamad Badaruddin

Keyword(s):

Reactive Ion Etching ◽

Silicon Nanostructures ◽

Ion Etching ◽

Deep Reactive Ion Etching

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Correction to Ultrahigh Resolution Titanium Deep Reactive Ion Etching

ACS Applied Materials & Interfaces ◽

10.1021/acsami.7b08904 ◽

2017 ◽

Vol 9 (27) ◽

pp. 23263-23263

Author(s):

Bryan W. K. Woo ◽

Shannon C. Gott ◽

Ryan A. Peck ◽

Dong Yan ◽

Mathias W. Rommelfanger ◽

...

Keyword(s):

Reactive Ion Etching ◽

Ultrahigh Resolution ◽

Ion Etching ◽

Deep Reactive Ion Etching

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Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching

Journal of Microelectromechanical Systems ◽

10.1109/84.767111 ◽

1999 ◽

Vol 8 (2) ◽

pp. 152-160 ◽

Cited By ~ 53

Author(s):

A. Mehra ◽

A.A. Ayon ◽

I.A. Waitz ◽

M.A. Schmidt

Keyword(s):

High Temperature ◽

Wafer Bonding ◽

Reactive Ion Etching ◽

Ion Etching ◽

Deep Reactive Ion Etching ◽

Silicon Devices

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Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

Microelectronic Engineering ◽

10.1016/j.mee.2013.06.010 ◽

2014 ◽

Vol 113 ◽

pp. 35-39 ◽

Cited By ~ 36

Author(s):

Jayalakshmi Parasuraman ◽

Anand Summanwar ◽

Frédéric Marty ◽

Philippe Basset ◽

Dan E. Angelescu ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Reactive Ion Etching ◽

Ion Etching ◽

Deep Reactive Ion Etching

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Nanoindentation of crystalline silicon pillars fabricated by soft UV nanoimprint lithography and cryogenic deep reactive ion etching

Sensors and Actuators A Physical ◽

10.1016/j.sna.2018.09.035 ◽

2018 ◽

Vol 283 ◽

pp. 65-78 ◽

Cited By ~ 11

Author(s):

Gerry Hamdana ◽

Prabowo Puranto ◽

Jannick Langfahl-Klabes ◽

Zhi Li ◽

Frank Pohlenz ◽

...

Keyword(s):

Nanoimprint Lithography ◽

Crystalline Silicon ◽

Reactive Ion Etching ◽

Ion Etching ◽

Deep Reactive Ion Etching ◽

Silicon Pillars

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Modeling and simulation of the lag effect in a deep reactive ion etching process

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/16/12/008 ◽

2006 ◽

Vol 16 (12) ◽

pp. 2570-2575 ◽

Cited By ~ 23

Author(s):

Yiyong Tan ◽

Rongchun Zhou ◽

Haixia Zhang ◽

Guizhang Lu ◽

Zhihong Li

Keyword(s):

Modeling And Simulation ◽

Reactive Ion Etching ◽

Etching Process ◽

Ion Etching ◽

Deep Reactive Ion Etching ◽

Lag Effect

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Development and characterization of deep reactive ion etching technology for through silicon interconnection

10.32657/10356/41775 ◽

2010 ◽

Author(s):

Ranganathan Nagarajan

Keyword(s):

Reactive Ion Etching ◽

Ion Etching ◽

Deep Reactive Ion Etching

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