Creation of sub-20-nm contact using diblock copolymer on a 300 mm wafer for complementary metal oxide semiconductor applications
2003 ◽
Vol 21
(6)
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pp. 2352
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2014 ◽
Vol 14
(1)
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pp. 011007
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2002 ◽
Vol 41
(Part 2, No. 8B)
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pp. L919-L921
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2011 ◽
pp. n/a-n/a
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1998 ◽
Vol 37
(Part 1, No. 3B)
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pp. 1050-1053
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