Three-dimensional simulation of top down scanning electron microscopy images

Author(s):  
Luca Grella ◽  
Gian Lorusso ◽  
Paul Lee ◽  
Fan Frank ◽  
David L. Adler
CrystEngComm ◽  
2018 ◽  
Vol 20 (14) ◽  
pp. 1935-1944 ◽  
Author(s):  
E. M. Woo ◽  
G. Lugito ◽  
S. M. Chang

Polarized optical, atomic force, and scanning electron microscopy images showing the correlations of three-dimensional crystal arrangements with optical properties exhibited by poly(dodecamethylene terephthalate).


Author(s):  
Armin Shahmohmmadi ◽  
Mostafa Baghani ◽  
Masoud Shariat Panahi ◽  
Kui Wang ◽  
Ehsan Hasanpur ◽  
...  

In this study, the corrosion behavior of biodegradable composites is modeled. These composites are made of Poly-Lactic acid and Magnesium with different volume fractions. The scanning electron microscopy images of these composites were taken, and statistical reconstruction of the composite based on scanning electron microscopy images was done by the phase recovery algorithm, the three-dimensional structure of this composite was extracted with this reconstruction, then a three-dimensional cellular automata model was developed to predict the corrosion of this composite. Results of experiments for the composite with 10% of Magnesium volume fraction were used to calibrate the parameters of the cellular automata model, and with these parameters, the results for the composite with 5% of Magnesium volume fraction was obtained, and with comparing these data with the results of the experiment, our model was validated. In the end, we estimated the mechanical properties of these composites and analyzed the results.


Author(s):  
Jack Lee ◽  
Kuo-Hui Huang ◽  
Jen-Lang Lue

Abstract A novel method has been developed to reveal the entire three dimensional (3D) deep trench (DT) capacitors for inspection in DRAM, especially NO capacitor dielectrics, ASG residues at corners, morphology etc., for process evaluation and failure analysis. It offers an alternative to conventional cross-section polishing, top down polishing or FIB milling methods. A DRAM chip was ground and polished down to a certain level from the chip backside. An etching solution was then applied to enhance the DTs appearance. 3D DTs can be inspected in scanning electron microscopy (SEM). The entire DTs or specific DT also can be lifted out for detailed investigation in transmission electron microscopy (TEM). The innovation of this technique is to provide a quick 3D observation in SEM, and much more flexibility to an entire DT inspection in TEM, which were not presented before.


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