Relationship between deprotection and film thickness loss during plasma etching of positive tone chemically amplified resists

2001 ◽  
Vol 19 (4) ◽  
pp. 1374-1378 ◽  
Author(s):  
A. P. Mahorowala ◽  
D. R. Medeiros
Keyword(s):  
Film Thickness ◽  
Plasma Etching ◽  
Thickness Loss ◽  
Chemically Amplified ◽  
Chemically Amplified Resists

High resolution patterning in chemically amplified resists: the effect of film thickness

2001 ◽  
Author(s):  
David R. Medeiros ◽  
Wayne M. Moreau ◽  
Karen E. Petrillo ◽  
Maharshi Chauhan ◽  
Wu-Song Huang ◽  
...  
Keyword(s):  
High Resolution ◽  
Film Thickness ◽  
Chemically Amplified ◽  
Chemically Amplified Resists

Effects of film thickness and alkaline concentration on dissolution kinetics of poly(4-hydroxystyrene) in alkaline aqueous solution

2022 ◽  
Author(s):  
Naoki Tanaka ◽  
Kyoko Matsuoka ◽  
Takahiro KOZAWA ◽  
Takuya Ikeda ◽  
Yoshitaka Komuro ◽  
...  
Keyword(s):  
Aqueous Solution ◽  
Film Thickness ◽  
Thick Films ◽  
Dissolution Kinetics ◽  
Dissolution Behavior ◽  
Chemically Amplified ◽  
Fundamental Understanding ◽  
Chemically Amplified Resists ◽  
Kinetics Of ◽  
Simple Combination

Abstract The dissolution behavior of a simple combination of poly(4-hydroxystyrene) (PHS) films and tetramethylammonium hydroxide (TMAH) aqueous solution was analyzed to gain a fundamental understanding of the effects of film thickness and alkaline concentration on the dissolution kinetics of chemically amplified resists (CARs). Films of four different thicknesses, from thick (approximately 900 nm) to thin (approximately 50 nm), were developed in 22 different developers of different concentrations. The dissolution behavior of each combination was observed using a quartz crystal microbalance (QCM). Differences in dissolution kinetics due to film thickness were observed even between relatively thick films such as 900- and 500-nm thick films in dilute developers. These differences were considered to be caused by the diffusion of the solution into the films. Thin films also showed characteristic behavior with dilution. This behavior was due to the interaction between the substrate and the films, unlike in the case of thick films.

scholarly journals Effect of Polymer Protection and Film Thickness on Acid Generator Distribution in Chemically Amplified Resists

2009 ◽  
Vol 22 (1) ◽  
pp. 105-109 ◽  
Author(s):  
Takehiro Fukuyam ◽  
Takahiro Kozawa ◽  
Hiroki Yamamoto ◽  
Seiichi Tagawa ◽  
Makiko Irie ◽  
...  
Keyword(s):  
Film Thickness ◽  
Chemically Amplified ◽  
Chemically Amplified Resists

Heating effect of the radiation chemistry of polyhydroxystyrene-type chemically amplified resists

2020 ◽  
Vol 59 (8) ◽  
pp. 086506
Author(s):  
Yuta Ikari ◽  
Kazumasa Okamoto ◽  
Akihiro Konda ◽  
Takahiro Kozawa ◽  
Takao Tamura
Keyword(s):  
Radiation Chemistry ◽  
Heating Effect ◽  
Chemically Amplified ◽  
Chemically Amplified Resists

Characterizing acid diffusion lengths in chemically amplified resists from measurements of deprotection kinetics

2014 ◽  
Vol 13 (4) ◽  
pp. 043017 ◽  
Author(s):  
Abhijit A. Patil ◽  
Yogendra Narayan Pandey ◽  
Manolis Doxastakis ◽  
Gila E. Stein
Keyword(s):  
Acid Diffusion ◽  
Chemically Amplified ◽  
Chemically Amplified Resists

Design and Lithographic Characteristics of Alicyclic Fluoropolymer for ArF Chemically Amplified Resists

2006 ◽  
Vol 45 (No. 46) ◽  
pp. L1230-L1231
Author(s):  
Katsumi Maeda ◽  
Kaichiro Nakano ◽  
Masamitsu Shirai
Keyword(s):  
Chemically Amplified ◽  
Chemically Amplified Resists

6-inch circle template fabrication for patterned media using a conventional resist and new chemically amplified resists

2009 ◽  
Author(s):  
Morihisa Hoga ◽  
Masaharu Fukuda ◽  
Tsuyoshi Chiba ◽  
Mikio Ishikawa ◽  
Kimio Itoh ◽  
...  
Keyword(s):  
Patterned Media ◽  
Chemically Amplified ◽  
Chemically Amplified Resists
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