A Numerical Investigation on Water Slamming of Stiffened Panels

2018 ◽  
Author(s):  
Shan Wang ◽  
C. Guedes Soares
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Mesh Size ◽  
Stiffened Panel ◽  
Fe Model ◽  
Explicit Finite Element ◽  
Numerical Predictions ◽  
Eulerian Formulation ◽  
The Impact ◽  
Element Method

To investigate the slamming pressure on the bottom of a wet-deck structure of a multihull vessel, the water impact problem of a stiffened steel panel is simulated by using a fully coupled ALE/FEM algorithm which is implemented in the commercial software LS-DYNA. The Lagrangian formulation is used to describe plane-strain deformations of the hull panel while the Eulerian formulation is applied to describe the fluid flow. The governing equations of this coupling problem are solved by using finite element method. The explicit finite element method is firstly validated through the comparisons of the slamming pressure and structural deflection between the numerical predictions and the published experimental data, for an elastic horizontal plate. Secondly, the parametric study of the mesh size in the impact domain of the FE model is performed. The total slamming forces obtained from three models are compared. To study the effects of the flexibility of the structure on the slamming load, the predictions of slamming pressure on several locations of the elastic panel are compared with the values obtained by using the rigid body model. The water entries of the stiffened panel with two different deadrise angles, entry velocities, and thickness of plating are simulated. The results of the total slamming force, slamming pressure are presented and discussed.

Study of Spurious Wave Reflection at the Interface of Peridynamics and Finite Element Regions

2018 ◽  
Author(s):  
Shank S. Kulkarni ◽  
Alireza Tabarraei ◽  
Xiaonan Wang
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Computational Cost ◽  
Mesh Size ◽  
Reflected Waves ◽  
High Frequency Waves ◽  
Arlequin Method ◽  
The Impact ◽  
Spurious Wave ◽  
Element Method

Peridynamics ability to model crack as a material response removes deficiencies associated with using classical continuum-based methods in modeling discontinuities. Due to its nonlocal formulation, however, peridynamics is computationally more expensive than the classical continuum-based numerical methods such as finite element method. To reduce the computational cost, peridynamics can be coupled with finite element method. In this method, peridynamics is used only in critical areas such as the vicinity of crack tip and finite element method is used everywhere else. The main issue associated with such coupling methods is the spurious wave reflections occurring at the interface of peridynamics and finite elements. High frequency waves traveling from peridynamics to finite element spuriously reflect back at the interface and the amplitude of transmitted waves also alter. In this paper, we take an analytical approach to study this phenomenon of spurious reflections. We study the impact of factors such as horizon size of peridynamic formulation, discretization, and change in mesh size on the amplitude of spuriously reflected waves. Finally, we present a method to reduce these spurious reflections by using Arlequin method.

Tire Cornering Simulation Using an Explicit Finite Element Analysis Code

1998 ◽  
Vol 26 (2) ◽  
pp. 109-119 ◽  
Author(s):  
M. Koishi ◽  
K. Kabe ◽  
M. Shiratori
Keyword(s):  
Finite Element Method ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Test System ◽  
Experimental Results ◽  
The Finite Element Method ◽  
Element Analysis ◽  
Explicit Finite Element ◽  
Explicit Finite Element Analysis ◽  
Element Method

Abstract The finite element method has been used widely in tire engineering. Most tire simulations using the finite element method are static analyses, because tires are very complex nonlinear structures. Recently, transient phenomena have been studied with explicit finite element analysis codes. In this paper, the authors demonstrate the feasibility of tire cornering simulation using an explicit finite element code, PAM-SHOCK. First, we propose the cornering simulation using the explicit finite element analysis code. To demonstrate the efficiency of the proposed simulation, computed cornering forces for a 175SR14 tire are compared with experimental results from an MTS Flat-Trac Tire Test System. The computed cornering forces agree well with experimental results. After that, parametric studies are conducted by using the proposed simulation.

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

2013 ◽  
Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Parametric Study ◽  
Initial Crack ◽  
Bonding Interface ◽  
Interface Condition ◽  
Large Temperature ◽  
Bonded Interface ◽  
The Impact ◽  
Element Method

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.

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