High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
Ken Blecker

Abstract In many industries, such as automotive, oil and gas, aerospace, medical technologies, electronic parts can often be exposed to high strain loads during shocks, vibrations and drop-impact conditions. Such electronic parts can often be subjected to extreme low and high temperatures ranging from −65°C to 200°C. Also, these electronic devices can be subjected to strain rates of 1 to 100 per second in the critical environment. Recently, many doped SAC solder alloys are being introduced in the electronic component including SAC-Q, SAC-R, Innolot. SAC-Q is made with addition of Bi in Sn-Ag-Cu composition. Mechanical characteristic results and data for lead-free solder alloys are extremely important for optimizing electronic package reliability, at high temperature storage and elevated strain rates. Furthermore, the mechanical properties of solder alloys can be changed significantly due to a thermal aging, which is causing modification of microstructure. Data for the SAC-Q solder alloy with a high temp aging and testing at extreme low to high operating temperatures are not available. SAC-Q material was tested and analyzed for this study at range of operating temperatures of −65°C to 200°C and at a strain rate up to 75 per second. After the specimens were manufactured and reflowed, specimens were stored at 100°C for the isothermal aging for up to 90 days, before tensile tests were carried out at different operating temperatures. For the wide range of strain rates and test temperatures, stress-strain curves are established. In addition, the measured experimental results and data were fitted to the Anand viscoplasticity model and the Anand constants were calculated by estimating the stress-strain behavior measured in the wide range of operating temperatures and strain rates.

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
Ken Blecker

Abstract Electronic parts may often get exposed to high strains during shocks, vibrations and drop conditions in both commercial and defense applications. In addition, such electronic parts can often be simultaneously exposed to extreme surrounding temperatures between −65°C and 200°C after storage in non-climate-controlled conditions. Electronic equipment can be subjected to strain rates of 1 to 100 per second in shock and vibration. Many of the doped SAC soldering alloys in the electronic components, including SAC-Q, SAC-R, Innolot have found applications in long-term thermal exposure environments. Low temperature high strain-rate properties are needed to assure durability under high temperature storage followed by shock and vibration. There is scarcity of high strain-rate data on alloys exposed to high temperature aging operating at extreme low-temperatures and extremely-high temperatures. For this study, SAC-Q material was tested and analyzed at temperatures from −65°C to 200°C and at a strain rates of from 10 to 75 per second. Following the production and retrieval of the specimens, specimens were stored for isothermal aging for up to 6 months at 100°C temperature, before performing tensile test experiments at various operating temperatures. Stress vs strain curves are formed for the wide range of strain rates and surrounding temperatures. In addition, test results and data were complemented by the Anand viscoplasticity model and by calculating stress-strain behavior, evaluated in a wide range of working temperatures and strains rates.


2021 ◽  
Author(s):  
SAGAR M. DOSHI, SAGAR M. DOSHI, ◽  
NITHINKUMAR MANOHARAN ◽  
BAZLE Z. (GAMA) HAQUE, ◽  
JOSEPH DEITZEL ◽  
JOHN W. GILLESPIE, JR.

Epoxy resin-based composite panels used for armors may be subjected to a wide range of operating temperatures (-55°C to 76°C) and high strain rates on the order of 103-104 s-1. Over the life cycle, various environmental factors also affect the resin properties and hence influence the performance of the composites. Therefore, it is critical to determine the stress-strain behavior of the epoxy resin over a wide range of strain rates and temperatures for accurate multi-scale modeling of composites and to investigate the influence of environmental aging on the resin properties. Additionally, the characterization of key mechanical properties such as yield stress, modulus, and energy absorption (i.e. area under the stress-strain curve) at varying temperatures and moisture can provide critical data to calculate the material operating limits. In this study, we characterize mechanical properties of neat epoxy resin, SC-15 (currently used in structural armor) and RDL-RDC using uniaxial compression testing. RDL-RDC, developed by Huntsman Corporation, has a glass transition temperature of ~ 120°C, compared to ~ 85°C of SC-15. A split Hopkinson pressure bar is used for high strain rate testing. Quasistatic testing is conducted using a screw-driven testing machine (Instron 4484) at 10-3 s-1 and 10-1 s-1 strain rates and varying temperatures. The yield stress is fit to a modified Eyring model over the varying strain rates at room temperature. For rapid investigation of resistance to environmental aging, accelerated aging tests are conducted by immersing the specimens in 100°C water for 48 hours. Specimens are conditioned in an environmental chamber at 76 °C and 88% RH until they reach equilibrium. Tests are then conducted at five different temperatures from 0°C to 95°C, and key mechanical properties are then plotted vs. temperature. The results presented are an important step towards developing a methodology to identify environmental operating conditions for composite ground vehicle applications.


2014 ◽  
Vol 566 ◽  
pp. 80-85
Author(s):  
Kenji Nakai ◽  
Takashi Yokoyama

The present paper is concerned with constitutive modeling of the compressive stress-strain behavior of selected polymers at strain rates from 10-3 to 103/s using a modified Ramberg-Osgood equation. High strain-rate compressive stress-strain curves up to strains of nearly 0.08 for four different commercially available extruded polymers were determined on the standard split Hopkinson pressure bar (SHPB). The low and intermediate strain-rate compressive stress-strain relations were measured in an Instron testing machine. Six parameters in the modified Ramberg-Osgood equation were determined by fitting to the experimental stress-strain data using a least-squares fit. It was shown that the monotonic compressive stress-strain behavior over a wide range of strain rates can successfully be described by the modified Ramberg-Osgood constitutive model. The limitations of the model were discussed.


2014 ◽  
Vol 660 ◽  
pp. 562-566 ◽  
Author(s):  
Akbar Afdhal ◽  
Leonardo Gunawan ◽  
Sigit P. Santosa ◽  
Ichsan Setya Putra ◽  
Hoon Huh

The dynamic mechanical properties of a material are important keys to investigate the impact characteristic of a structure such as a crash box. For some materials, the stress-strain relationships at high strain rate loadings are different than that at the static condition. These mechanical properties depend on the strain rate of the loadings, and hence an appropriate testing technique is required to measure them. To measure the mechanical properties of a material at high strain rates, ranging from 500 s-1 to 10000 s-1, a Split Hopkinson Pressure Bar is commonly used. In the measurements, strain pulses are generated in the bars system, and pulses being reflected and transmitted by a test specimen in the bar system are measured. The stress-strain curves as the material properties of the test specimen are obtained by processing the measured reflected and transmitted pulses. This paper presents the measurements of the mechanical properties of St 37 mild steel at several strain rates using a Split Hopkinson Pressure Bar. The stress-strain curves obtained in the measurement were curve fitted using the Power Law. The results show that the strength of St 37 material increases as the strain rate increases.


Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeffrey C. Suhling ◽  
Ken Blecker

Abstract In many industries, such as automotive, oil and gas, aerospace, medical technologies, electronic parts can often be exposed to high strain loads during shocks, vibrations and drop-impact conditions. Such electronic parts can often be subjected to extreme low and high temperatures ranging from -65oC to 200oC. Also, these electronic devices can be subjected to strain rates of 1 to 100 per second in the critical environment. Recently, many doped SAC solder alloys are being introduced in the electronic component e.g. SAC-Q, SAC-R, Innolot, etc. SAC-Q is made with addition of Bi in Sn-Ag-Cu are composition. Mechanical characteristic results and data for lead-free solder alloys are extremely important for optimizing electronic package reliability, at high temperature storage and elevated strain rates. Furthermore, the mechanical properties of solder alloys can be changed significantly due to a thermal aging, which is causing modification of microstructure. Data for the SAC-Q solder alloy with a high temp aging and testing at extreme low to high operating temperatures are not available.


2017 ◽  
Vol 31 (27) ◽  
pp. 1750247 ◽  
Author(s):  
Guo-Jie Shi ◽  
Jin-Guo Wang ◽  
Zhao-Yang Hou ◽  
Zhen Wang ◽  
Rang-Su Liu

The mechanical properties and deformation mechanisms of Au nanowire during the tensile processes at different strain rates are revealed by the molecular dynamics method. It is found that the Au nanowire displays three distinct types of mechanical behaviors when tensioning at low, medium and high strain rates, respectively. At the low strain rate, the stress–strain curve displays a periodic zigzag increase–decrease feature, and the plastic deformation is resulted from the slide of dislocation. The dislocations nucleate, propagate, and finally annihilate in every decreasing stages of stress, and the nanowire always can recover to FCC-ordered structure. At the medium strain rate, the stress–strain curve gently decreases during the plastic process, and the deformation is contributed from sliding and twinning. The dislocations formed in the yield stage do not fully propagate and further escape from the nanowire. At the high strain rate, the stress-strain curve wave-like oscillates during the plastic process, and the deformation is resulted from amorphization. The FCC atoms quickly transform into disordered amorphous structure in the yield stage. The relative magnitude between the loading velocity of strain and the propagation velocity of phonons determines the different deformation mechanisms. The mechanical behavior of Au nanowire is similar to Ni, Cu and Pt nanowires, but their deformation mechanisms are not completely identical with each other.


2019 ◽  
Vol 812 ◽  
pp. 38-44
Author(s):  
Shuai Chen ◽  
Wen Bin Li ◽  
Xiao Ming Wang ◽  
Wen Jin Yao

This work compares the pure copper (T2 copper)’s stress-strain relationship at different strain rates in the uni-axial tension test and Split Hopkinson Pressure Bar (SHPB) test. Small samples were utilized in the high strain rate SHPB test in which the accuracy was modified by numerical simulation. The experimental results showed that the T2 copper’s yield strength at high strain rates largely outweighed the quasi static yield strength. The flow stress in the stress-strain curves at different strain rates appeared to be divergent and increased with the increase in strain rates, showing great strain strengthening and strain rate hardening effects. Metallographic observation showed that the microstructure of T2 copper changed from equiaxed grains to twins and the interaction between the dislocation slip zone grain boundary and twins promoted the super plasticity distortion in T2 copper.


Polymers ◽  
2020 ◽  
Vol 12 (7) ◽  
pp. 1561 ◽  
Author(s):  
Kebin Zhang ◽  
Wenbin Li ◽  
Yu Zheng ◽  
Wenjin Yao ◽  
Changfang Zhao

The temperature and strain rate significantly affect the ballistic performance of UHMWPE, but the deformation of UHMWPE under thermo-mechanical coupling has been rarely studied. To investigate the influences of the temperature and the strain rate on the mechanical properties of UHMWPE, a Split Hopkinson Pressure Bar (SHPB) apparatus was used to conduct uniaxial compression experiments on UHMWPE. The stress–strain curves of UHMWPE were obtained at temperatures of 20–100 °C and strain rates of 1300–4300 s−1. Based on the experimental results, the UHMWPE belongs to viscoelastic–plastic material, and a hardening effect occurs once UHMWPE enters the plastic zone. By comparing the stress–strain curves at different temperatures and strain rates, it was found that UHMWPE exhibits strain rate strengthening and temperature softening effects. By modifying the Sherwood–Frost model, a constitutive model was established to describe the dynamic mechanical properties of UHMWPE at different temperatures. The results calculated using the constitutive model were in good agreement with the experimental data. This study provides a reference for the design of UHMWPE as a ballistic-resistant material.


2021 ◽  
Vol 2021 ◽  
pp. 1-12
Author(s):  
Jie Chen ◽  
Haifeng Zhang ◽  
Yunlong Zhang ◽  
Hongtao Zhang ◽  
Qingxiang Yang ◽  
...  

In this paper, the dynamic mechanical properties of GH4720Li nickel-base alloy under a large temperature range and high and low strain rates were studied by the hot compression test. The difference of mechanical properties of GH4720Li alloy under high and low strain rates was analyzed from the perspective of microstructure. The hot compression test experimental results showed that the true stress of GH4720Li alloy decreased at a low strain rate as the trial temperature elevated. Nevertheless, it was abnormal that the true stress increased at high strain rate condition as temperature elevated. By comparing the microstructure under high and low strain rates, it was found that the precipitates under low strain conditions contained a large amount of Cr (Mo). However, the content of Cr (Mo) in the precipitates at a high strain rate decreased, while the content of Fe increased. It would be concluded that Cr (Mo) would reduce the compressive strength and plasticity of GH4720Li alloy, while Fe would increase the compressive strength and plasticity of GH4720Li alloy. In addition, under the condition of a low strain rate, the shape of Cr (Mo) precipitates obtained at 20°C was lamellar, but it was spherical at 800°C. The compressive strength of GH4720Li composites with lamellar precipitates was higher than that of spherical precipitates.


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