Performance Analysis of Heat Sinks Designed for Additive Manufacturing

2020 ◽  
Author(s):  
Andrew Scott White ◽  
David Saltzman ◽  
Stephen Lynch
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Additive Manufacturing ◽  
Technical Committee ◽  
Heat Sinks ◽  
Higher Power ◽  
Design Competition ◽  
Specific Material ◽  
Heat Sink Design ◽  
Better Than

Abstract Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have enabled production of complex heat transfer devices previously impossible to traditionally manufacture. This paper introduces three novel prototypes, originally designed for a prior ASME Student Heat Sink Design Competition sponsored by the K-16 (Heat Transfer in Electronic Devices) technical committee, to demonstrate the abilities of selective laser melting processes in the fabrication of A357 aluminum, EOS aluminum, and copper heat sinks. The performance of each of these prototypes has been determined experimentally, and the effects of specific material and design choices are analyzed. Comparisons of experimental results show that the copper and EOS aluminum prototypes performed better than the A357 aluminum due to increased thermal conductivity; however, the gains in thermal performance from EOS aluminum to copper were much lower despite the large difference in thermal conductivity.

scholarly journals Experimental and Numerical Examinations of Temperature Distributions along SSF Pin Fins Cast through Semisolid Materials Processing

2019 ◽  
Vol 8 (12) ◽  
pp. 500-503
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Stainless Steel ◽  
Heat Sinks ◽  
Materials Processing ◽  
Length Scale ◽  
Pin Fin ◽  
Temperature Distributions ◽  
Pin Fins ◽  
Enhancing Heat Transfer

Heat sinks or fins stand deployed for enhancing heat transfer. That’s why, planned experiments remain fortified for examining the impacts of SSF pin fin on thermal dispersal concerning constant thermal value 6 W/cm2 . For that five chromel-alumel thermocouples are preferred, above and beyond, SSF pin fins materials of stainless steel and aluminum. As anticipated, for both the stated SSF pin fins, temperature declines for increasing length scale. Besides, both results are comparable with each other. However, temperature distributions over SSF aluminum pin fin declines relatively at faster rate comparable to that over SSF stainless steel pin fin. Obviously, it may be owing to higher thermal conductivity of SSF aluminum pin fin. Therefore, it carries superior, pleasant and momentous thermal performances.

Thermal Conductivity Testing Apparatus for 3D Printed Materials

2017 ◽  
Author(s):  
Tiffaney Flaata ◽  
Gregory J. Michna ◽  
Todd Letcher
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Additive Manufacturing ◽  
3D Printing ◽  
Polymer Composite ◽  
Heat Exchangers ◽  
Fused Deposition ◽  
3D Printed ◽  
Printed Materials ◽  
Metal Polymer

Additive manufacturing, the layer-by-layer creation of parts, was initially used for rapid prototyping of new designs. Recently, due to the decrease in the cost and increase in the resolution and strength of additively manufactured parts, additive manufacturing is increasingly being used for production of parts for end-use applications. Fused Deposition Modeling (FDM), a type of 3d printing, is a process of additive manufacturing in which a molten thermoplastic material is extruded to create the desired geometry. Many potential heat transfer applications of 3d printed parts, including the development of additively manufactured heat exchangers, exist. In addition, the availability of metal/polymer composite filaments, first used for applications such as tooling for injection molding applications and to improve wear resistance, could lead to increased performance 3d printed heat exchangers because of the higher thermal conductivity of the material. However, the exploitation of 3d printing for heat transfer applications is hindered by a lack of reliable thermal conductivity data for as-printed materials, which typically include significant void fractions. In this experimental study, an apparatus to measure the effective thermal conductivity of 3d printed composite materials was designed and fabricated. Its ability to accurately measure the thermal conductivity of polymers was validated using a sample of acrylic, whose conductivity is well understood. Finally, the thermal conductivities of various 3d printed polymer, metal/polymer composite, and carbon/polymer composite filaments were measured and are reported in this paper. The materials used are acrylonitrile butadiene styrene (ABS), polylactic acid (PLA), stainless steel/PLA, Brass/PLA, and Bronze/PLA.

Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks

1999 ◽  
Vol 123 (3) ◽  
pp. 315-318 ◽  
Author(s):  
Keiji Sasao ◽  
Mitsuru Honma ◽  
Atsuo Nishihara ◽  
Takayuki Atarashi
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Numerical Analysis ◽  
Numerical Method ◽  
Heat Sink ◽  
Flow Resistance ◽  
Air Flow ◽  
Heat Sinks ◽  
Flow And Heat Transfer ◽  
Conventional Methods

A numerical method for simulating impinging air flow and heat transfer in plate-fin type heat sinks has been developed. In this method, all the fins of an individual heat sink and the air between them are replaced with a single, uniform element having an appropriate flow resistance and thermal conductivity. With this element, fine calculation meshes adapted to the shape of the actual heat sink are not needed, so the size of the calculation mesh is much smaller than that of conventional methods.

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
V. Egan ◽  
P. A. Walsh ◽  
E. Walsh ◽  
R. Grimes
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Volume Flow Rate ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Superior Performance ◽  
Low Profile ◽  
In Series ◽  
Heat Sink Design

Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale existing technologies. To achieve this, the power consumed has to be dissipated over smaller areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which incorporate one of the smallest commercially available fans in series with two different heat sink designs. The first of these is the conventionally used finned heat sink design, which was specifically optimized and custom manufactured in the current study to complement the driving fan. While the second design proposed is a novel “finless” type heat sink suitable for use in low profile applications. Together the driving fan and heat sinks combined were constrained to have a total footprint area of 465 mm2 and a profile height of only 5 mm, making them ideal for use in portable electronics. The objective was to evaluate the performance of the proposed finless heat sink design against a conventional finned heat sink, and this was achieved by means of thermal resistance and overall heat transfer coefficient measurements. It was found that the proposed finless design proved to be the superior cooling solution when operating at low fan speeds, while at the maximum fan speed tested of 8000 rpm both provided similar performance. Particle image velocimetry measurements were used to detail the flow structures within each heat sink and highlighted methods, which could further optimize their performance. Also, these measurements along with corresponding global volume flow rate measurements were used to elucidate the enhanced heat transfer characteristics observed for the finless design. Overall, it is shown that the proposed finless type heat sink can provide superior performance compared with conventional finned designs when used in low profile applications. In addition a number of secondary benefits associated with such a design are highlighted including lower cost, lower mass, lower acoustics, and reduced fouling issues.

The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink

2002 ◽  
Vol 124 (3) ◽  
pp. 164-169 ◽  
Author(s):  
H. B. Ma ◽  
G. P. Peterson
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Fluid Flow ◽  
Temperature Distribution ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Solid Material ◽  
Heat Sinks ◽  
Transfer Performance ◽  
Desktop Computers

An extensive numerical analysis of the temperature distribution and fluid flow in a heat sink currently being used for cooling desktop computers was conducted, and demonstrated that if the base of a heat sink was fabricated as a heat pipe instead of a solid material, the heat transfer performance could be significantly increased. It was shown that as the heat sink length increases, the effect of the thermal conductivity of the base on the heat transfer performance increases to be a predictable limit. As the thermal conductivity is increased, the heat transfer performance of heat sinks is enhanced, but cannot exceed this limit. When the thermal conductivity increases to 2,370 W/m-K, the heat transfer performance of the heat sinks will be very close to the heat transfer performance obtained assuming a base with infinite thermal conductivity. Further increases in the thermal conductivity would not significantly improve the heat transfer performance of the heat sinks.

Diamond Heat Sinks For High Temperature Electronics: Simuilation, And Thermal Analysis

1995 ◽  
Vol 416 ◽  
Author(s):  
Nickolaos Strifas ◽  
Aris Christou
Keyword(s):  
Thermal Conductivity ◽  
Thermal Analysis ◽  
High Temperature ◽  
Thermal Resistance ◽  
Substrate Material ◽  
Heat Sinks ◽  
Substrate Thickness ◽  
High Temperature Electronics ◽  
Die Attach ◽  
Heat Sink Design

ABSTRACTperformance that can be achieved by utilizing a diamond heat - sink design which minimizes junction - to - case thermal resistance. Effects of the thermal conductivity of the substrate material, the thermal conductivity of the die attach material, the substrate thickness, and the die attach thickness onl Ihe thermal resistance are addressed. The results indicate that the temperature increase could be 3 to 4 times less with diamond heat-sinks when compared to other materials.

scholarly journals Experimental analysis of effect of base with different inner geometries filled nano PCM for the thermal performance of the plate fin heat sink

2021 ◽  
pp. 243-243
Author(s):  
Periyannan Lakshmanan ◽  
Saravanan Periyasamy ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Reynolds Number ◽  
Phase Shift ◽  
Experimental Research ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Base Plate ◽  
Heat Sinks

Experimental research demonstrates the performance of electronic devices on plate fin heat sinks in order to guarantee that operating temperatures are kept as low as possible for reliability. Paraffin wax (PCM) is a substance that is used to store energy and the aluminum plate fin cavity base is chosen as a Thermal Conductivity Enhancer (TCEs). The effects of PCM material (Phase shift material), cavity form base (Rectangular, Triangular, Concave and Convex) with PCM, Reynolds number (Re= 4000-20000) on heat transfer effectiveness of plate fin heat sinks were experimentally explored in this research. The thermal performance of concave base plate fin heat sink with PCM is increased up to 7.8% compared to other cavity base heat sinks.

The Flow and Heat Transfer Characteristic of Curved Channel CPU Water-Cooled Heat Sinks

2013 ◽  
Vol 391 ◽  
pp. 213-216
Author(s):  
Yan Feng Liu ◽  
Xiang Hong Li ◽  
Shi Ping Li
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Transfer Characteristic ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Curved Channel ◽  
Flow And Heat Transfer ◽  
Heat Sink Temperature ◽  
Better Than

This article conducted numerical simulation and experimental study of curved channel laminar flow and heat transfer characteristics with different Reynolds number and different heat fluxes, it also showed the comparison with straight rectangular channel of a same heat transfer area. The results showed that: cooling effect of curved channel heat sink is better than that of straight rectangular channel heat sink, temperature distribution appears to be more uniform as well; The experimental results showed that the curved channel heat sink can effectively satisfy the needs of the CPU cooling.

Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity

1995 ◽  
Vol 117 (4) ◽  
pp. 294-300 ◽  
Author(s):  
D. Mukutmoni ◽  
Y. K. Joshi ◽  
M. D. Kelleher
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Fluid Flow ◽  
Natural Convection ◽  
Computational Study ◽  
Fluid Velocity ◽  
Heat Sinks ◽  
Electronic Components ◽  
Liquid Immersion ◽  
Fluid Velocity Field

A computational study of natural convection in an enclosure as applied to applications in cooling of electronic components is reported. The investigation is for a configuration consisting of a three by three array of heated protrusions placed on a vertical substrate. The vertical sidewalls are all insulated, and the top and bottom walls serve as isothermal heat sinks. A thin layer at the back of each protrusion is the heat source, where heat is generated uniformly and volumetrically. The coolant is the flourinert liquid FC75. The code was first validated with experimental results reported earlier on the same configuration. The effect of the substrate conductivity, κs on the heat transfer and fluid flow was then studied for power levels of 0.1 and 0.7 Watts per protrusion. The computations indicate that the effect of increasing κs is dramatic. The protrusion temperatures which were found to be nominally steady, were substantially reduced. The percentage of generated power that is directly conducted to the substrate increased with an increase in κs. The fluid velocity field, which was unsteady, was not significantly affected by changes in κs.

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