Advanced Packaging and Thermal Management of High-Power DC-DC Converters

2019 ◽  
Author(s):  
Sevket U. Yuruker ◽  
Raphael K. Mandel ◽  
Patrick McCluskey ◽  
Michael M. Ohadi ◽  
Shiladri Chakraborty ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Power ◽  
High Performance ◽  
Magnetic Core ◽  
Dual Active Bridge ◽  
Thermally Conductive ◽  
Significant Area ◽  
Unique Shape ◽  
Advanced Packaging ◽  
High Performance Systems

Abstract Thermal management of high-power electronics is often a major obstacle in achieving improved packaging density. Emergence of SiC devices allows higher voltage and temperature limits, but thermal management is still a bottleneck in achieving compact, reliable and high-performance systems. This study introduces the design of an advanced packaging configuration of a dual-active-bridge 10 kW DC-DC converter module with 97% efficiency and ∼1.5 × 104 kW/m3 power density based on preliminary modeling analysis. The proposed packaging scheme allows for significant volume reduction and considerably lighter weight at greater power levels than commercially available converter modules. We introduce an improved placement of high power/high frequency MOSFET switches on the board that enables double-sided cooling, where the dissipated heat is removed from both sides of the switches via manifold-microchannel cooler modules. The cooler modules are additively manufactured monolithic structures made out of a thermally and electrically conductive material, which in turn allows them to double function as electrical terminals for the switches. Their unique shape minimizes footprint utilization on the board while still providing significant area enhancement over the heat dissipating chips’ footprint. Moreover, thermal management of other components with significant heat flux, such as the transformer coils and magnetic core are also accomplished via dielectric liquid cooling with electrically insulating but thermally conductive 3D printed coolers. The overall circuit diagram, assembly configuration and flow routing within the system are demonstrated. The advantages of the proposed design over commercially available modules are discussed in detail.

scholarly journals Power, Performance, and Thermal Management for High-Performance Systems

2007 ◽  
Author(s):  
Heather Hanson ◽  
Stephen W. Keckler ◽  
Karthick Rajamani ◽  
Soraya Ghiasi ◽  
Freeman Rawson ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
Power Performance ◽  
High Performance Systems

Potential thermally conductive alumina filled epoxy composite for thermal management of high power LEDs

2016 ◽  
Vol 28 (1) ◽  
pp. 856-867 ◽  
Author(s):  
P. Anithambigai ◽  
M. K. Dheepan Chakravarthii ◽  
D. Mutharasu ◽  
L. H. Huong ◽  
T. Zahner ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Epoxy Composite ◽  
Thermally Conductive

High-Performance Thermal Management for High-Power High-Frequency Transformers

EPE Journal ◽  
2009 ◽  
Vol 19 (2) ◽  
pp. 20-27 ◽  
Author(s):  
M. Pavlovsky ◽  
S. W. H. de Haan ◽  
J. A. Ferreira
Keyword(s):  
Thermal Management ◽  
High Power ◽  
High Frequency ◽  
High Performance

scholarly journals A Novel Method to Prepare Transparent, Flexible and Thermally Conductive Polyethylene/Boron Nitride Films

Nanomaterials ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 111
Author(s):  
Mingming Yi ◽  
Meng Han ◽  
Junlin Chen ◽  
Zhifeng Hao ◽  
Yuanzhou Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Self Assembly ◽  
High Performance ◽  
High Thermal Conductivity ◽  
Polyethylene Film ◽  
High Concentration ◽  
Thermally Conductive ◽  
Novel Method

The high thermal conductivity and good insulating properties of boron nitride (BN) make it a promising filler for high-performance polymer-based thermal management materials. An easy way to prepare BN-polymer composites is to directly mix BN particles with polymer matrix. However, a high concentration of fillers usually leads to a huge reduction of mechanical strength and optical transmission. Here, we propose a novel method to prepare polyethylene/boron nitride nanoplates (PE/BNNPs) composites through the combination of electrostatic self-assembly and hot pressing. Through this method, the thermal conductivity of the PE/BNNPs composites reach 0.47 W/mK, which gets a 14.6% improvement compared to pure polyethylene film. Thanks to the tight bonding of polyethylene with BNNPs, the tensile strength of the composite film reaches 1.82 MPa, an increase of 173.58% compared to that of pure polyethylene film (0.66 MPa). The fracture stress was also highly enhanced, with an increase of 148.44% compared to pure polyethylene film. Moreover, the addition of BNNPs in PE does not highly reduce its good transmittance, which is preferred for thermal management in devices like light-emitting diodes. This work gives an insight into the preparation strategy of transparent and flexible thermal management materials with high thermal conductivity.

МЕТОДЫ ДОСТИЖЕНИЯ МАКСИМАЛЬНОЙ ЭФФЕКТИВНОСТИ ПЛАТФОРМЫ ПРОТОТИПИРОВАНИЯ ВЫСОКОПРОИЗВОДИТЕЛЬНЫХ СИСТЕМ НА КРИСТАЛЛЕ НА ЗАДАЧАХ ИСКУССТВЕННОГО ИНТЕЛЛЕКТА

2020 ◽  
Vol 96 (3s) ◽  
pp. 585-588
Author(s):  
С.Е. Фролова ◽  
Е.С. Янакова
Keyword(s):  
Neural Network ◽  
Artificial Intelligence ◽  
Computer Vision ◽  
High Performance ◽  
Systems On Chip ◽  
High Performance Systems ◽  
On Chip ◽  
Network Technologies ◽  
Neural Network Technologies

Предлагаются методы построения платформ прототипирования высокопроизводительных систем на кристалле для задач искусственного интеллекта. Изложены требования к платформам подобного класса и принципы изменения проекта СнК для имплементации в прототип. Рассматриваются методы отладки проектов на платформе прототипирования. Приведены результаты работ алгоритмов компьютерного зрения с использованием нейросетевых технологий на FPGA-прототипе семантических ядер ELcore. Methods have been proposed for building prototyping platforms for high-performance systems-on-chip for artificial intelligence tasks. The requirements for platforms of this class and the principles for changing the design of the SoC for implementation in the prototype have been described as well as methods of debugging projects on the prototyping platform. The results of the work of computer vision algorithms using neural network technologies on the FPGA prototype of the ELcore semantic cores have been presented.

scholarly journals High Area-Efficient Parallel Encoder with Compatible Architecture for 5G LDPC Codes

Symmetry ◽  
2021 ◽  
Vol 13 (4) ◽  
pp. 700
Author(s):  
Yufei Zhu ◽  
Zuocheng Xing ◽  
Zerun Li ◽  
Yang Zhang ◽  
Yifan Hu
Keyword(s):  
High Performance ◽  
Ldpc Codes ◽  
Low Complexity ◽  
Cmos Technology ◽  
Area Efficiency ◽  
Prior Art ◽  
New Radio ◽  
High Area ◽  
Significant Area ◽  
Area Efficient

This paper presents a novel parallel quasi-cyclic low-density parity-check (QC-LDPC) encoding algorithm with low complexity, which is compatible with the 5th generation (5G) new radio (NR). Basing on the algorithm, we propose a high area-efficient parallel encoder with compatible architecture. The proposed encoder has the advantages of parallel encoding and pipelined operations. Furthermore, it is designed as a configurable encoding structure, which is fully compatible with different base graphs of 5G LDPC. Thus, the encoder architecture has flexible adaptability for various 5G LDPC codes. The proposed encoder was synthesized in a 65 nm CMOS technology. According to the encoder architecture, we implemented nine encoders for distributed lifting sizes of two base graphs. The eperimental results show that the encoder has high performance and significant area-efficiency, which is better than related prior art. This work includes a whole set of encoding algorithm and the compatible encoders, which are fully compatible with different base graphs of 5G LDPC codes. Therefore, it has more flexible adaptability for various 5G application scenarios.

scholarly journals High-performance chemical- and light-inducible recombinases in mammalian cells and mice

2019 ◽  
Vol 10 (1) ◽  
Author(s):  
Benjamin H. Weinberg ◽  
Jang Hwan Cho ◽  
Yash Agarwal ◽  
N. T. Hang Pham ◽  
Leidy D. Caraballo ◽  
...  
Keyword(s):  
Gene Expression ◽  
Mammalian Cells ◽  
High Performance ◽  
Genome Engineering ◽  
Genetic Circuits ◽  
Control Of Gene Expression ◽  
Expression Control ◽  
Gene Expression Control ◽  
High Performance Systems ◽  
Spatiotemporal Control

Abstract Site-specific DNA recombinases are important genome engineering tools. Chemical- and light-inducible recombinases, in particular, enable spatiotemporal control of gene expression. However, inducible recombinases are scarce due to the challenge of engineering high performance systems, thus constraining the sophistication of genetic circuits and animal models that can be created. Here we present a library of >20 orthogonal inducible split recombinases that can be activated by small molecules, light and temperature in mammalian cells and mice. Furthermore, we engineer inducible split Cre systems with better performance than existing systems. Using our orthogonal inducible recombinases, we create a genetic switchboard that can independently regulate the expression of 3 different cytokines in the same cell, a tripartite inducible Flp, and a 4-input AND gate. We quantitatively characterize the inducible recombinases for benchmarking their performances, including computation of distinguishability of outputs. This library expands capabilities for multiplexed mammalian gene expression control.

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