Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

2017 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Di Zhang ◽  
Jeff Suhling
Keyword(s):  
High Temperature ◽  
Failure Modes ◽  
Elevated Temperatures ◽  
Automotive Electronics ◽  
Reliability Models ◽  
Solder Interconnects ◽  
Current Trends ◽  
Lane Departure ◽  
Solder Joint Fatigue ◽  
Lead Free Solders

Current trends in the automotive industry point to increasing role of electronics for vehicle control, safety, efficiency and entertainment. Examples include lane-departure warning systems, collision avoidance systems, vehicle stability systems, and drive assist systems. Many of the automotive electronics systems are located under the hood of the vehicle mounted directly on engine or on transmission with sustained exposure to temperatures greater than 150°C in conjunction with vibration. Solder joint fatigue is a dominant failure modes under high-temperature vibration. Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions many of which are based on formulation of Sn, Ag and Cu. While it is well known that solder interconnects, accrue damage much faster when vibrated at elevated temperatures, the models for assessment of life under simultaneous temperature and vibration are scarce. State-of-art reliability models for solder joints focus on single stresses of vibration or thermal cycling. There is need for models for evaluating the survivability of leadfree solder assemblies to ensure 10-years, 100,000 miles life in automotive environments. In this paper, a new model has been proposed for life prediction of electronics under simultaneous temperature-vibration.

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

2017 ◽  
Author(s):  
Karumbu Meyyappan ◽  
Milena Vujosevic ◽  
Qifeng Wu ◽  
Pramod Malatkar ◽  
Charles Hill ◽  
...  
Keyword(s):  
Autonomous Vehicles ◽  
Failure Modes ◽  
Damage Model ◽  
Automotive Electronics ◽  
Electronic Components ◽  
Standard Requirement ◽  
Reliability Models ◽  
Knowledge Based ◽  
Industry Standards ◽  
Solder Joint Fatigue

Electronic products used in autonomous vehicles can be subjected to harsh road conditions. Transportation induced vibration is one such reliability risk to be addressed as part of qualification. Vibration use data and reliability models are very extensively studied for fully packaged systems exposed to vibration risks during shipping. MIL-STD-810G and ISTA4AB are some of the industry standards that address these risks. On the other hand, USCAR-2 and GMW-3172 are couple of standards that may be more relevant for electronics used in automotive applications, where electronic components are exposed to vibration risks during their entire lifetime. Even though the usage model and duration for fully packaged systems in shipping and automotive electronics are different, the source of energy (road conditions), driving the risks are similar. The industry standards based damage model appear to be generic, covering a wide variety of products. In this paper, a knowledge based qualification (KBQ) framework, is used to map use conditions to accelerated test requirements for two failure modes: solder joint fatigue and socket contact fretting. The mechanisms chosen are distinct with different damage metric and drivers. The KBQ obtained qualification requirements were discussed relative to standard requirement with the objective to verify how well industry standard models reflect field reliability risks. For the chosen failure mechanisms and use condition data, it was observed that the industry standards lead to erroneous conclusions about vibration risk in the field.

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Geeta Limaye
Keyword(s):  
High Temperature ◽  
High Speed ◽  
High Cycle Fatigue ◽  
Failure Modes ◽  
Elevated Temperatures ◽  
Natural Frequencies ◽  
Image Correlation ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Increase With Increase

Current trends in the automotive industry warrant a variety of electronics for improved control, safety, efficiency and entertainment. Many of these electronic systems like engine control units, variable valve sensor, crankshaft-camshaft sensors are located under-hood. Electronics installed in under-hood applications are subjected simultaneously to mechanical vibrations and thermal loads. Typical failure modes caused by vibration induced high cycle fatigue include solder fatigue, copper trace or lead fracture. The solder interconnects accrue damage much faster when vibrated at elevated temperatures. Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. Presently, the literature on mechanical behavior of lead-free alloys under simultaneous harsh environment of high-temperature vibration is sparse. In this paper, the reduction in stiffness of the PCB with temperature has been demonstrated by measuring the shift in natural frequencies. The test vehicle consisting of a variety of lead-free SAC305 daisy chain components including BGA, QFP, SOP and TSOPs has been tested to failure by subjecting it to two elevated temperatures and harmonic vibrations at the corresponding first natural frequency. The test matrix includes three test temperatures of 25C, 75C and 125C and simple harmonic vibration amplitude of 10G which are values typical in automotive testing. PCB deflection has been shown to increase with increase in temperature. The full field strain has been extracted using high speed cameras operating at 100,000 fps in conjunction with digital image correlation. Material properties of the PCB at test temperatures have been measured using tensile tests and dynamic mechanical analysis. FE simulation using global-local finite element models is thus correlated with the system characteristics such as modal shapes, natural frequencies and displacement amplitudes for every temperature. The solder level stresses have been extracted from the sub-models. Stress amplitude versus cycles to failure curves are obtained at all the three test temperatures. A comparison of failure modes for different surface mount packages at elevated test temperatures and vibration has been presented in this study.

scholarly journals High Temperature Silicon Integrated Circuits and Passive Components for Commercial and Military Applications

1998 ◽  
Author(s):  
Richard R. Grzybowski ◽  
Ben Gingrich
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Elevated Temperatures ◽  
Silicon On Insulator ◽  
Passive Component ◽  
Oil Well ◽  
Automotive Electronics ◽  
Passive Components ◽  
Silicon Integrated Circuits

Advances in silicon-on-insulator (SOI) integrated circuit technology and the steady development of wider band gap semiconductors like silicon carbide are enabling the practical deployment of high temperature electronics. High temperature civilian and military electronics applications include distributed controls for aircraft, automotive electronics, electric vehicles and instrumentation for geothermal wells, oil well logging and nuclear reactors. While integrated circuits are key to the realization of complete high temperature electronic systems, passive components including resistors, capacitors, magnetics and crystals are also required. This paper will present characterization data obtained from a number of silicon high temperature integrated evaluated over a range of elevated temperatures and aged at a selected high temperature. This paper will also present a representative cross section of high temperature passive component characterization data for device types needed by many applications. Device types represented will include both small signal and power resistors and capacitors. Specific problems encountered with the employment of these devices in harsh environments will be discussed for each family of components. The goal in presenting this information is to demonstrate the viability of a significant number of commercially available silicon integrated circuits and passive components that operate at elevated temperatures as well as to encourage component suppliers to continue to optimize a selection of their product offerings for operation at higher temperatures. In addition, systems designers will be encouraged to view this information with an eye toward the conception and implementation of reliable and affordable high temperature systems.

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

2018 ◽  
Vol 140 (2) ◽  
Author(s):  
Karumbu Meyyappan ◽  
Milena Vujosevic ◽  
Qifeng Wu ◽  
Pramod Malatkar ◽  
Charles Hill ◽  
...  
Keyword(s):  
Failure Modes ◽  
Field Performance ◽  
Test Methods ◽  
Automotive Electronics ◽  
Automotive Market ◽  
Damage Models ◽  
Knowledge Based ◽  
Industry Standards ◽  
Solder Joint Fatigue ◽  
Test Requirements

This paper intends to address an important gap between reliability standards and the physics of how components respond to real use conditions using a knowledge-based qualification (KBQ) process. Bridging the gap is essential to developing test methods that better reflect field performance. With the growth in importance of automotive market and the wide usage of electronics in this market, vibration-induced failures was chosen for this study. MIL-STD-810G and ISTA4AB are couple of industry standards that address the risk of shipping finished goods to a customer. For automotive electronic products that are exposed to vibration conditions all through their life, USCAR-2 and GMW3172 are more relevant. Even though the usage models and transportation duration for shipping fully packaged systems is different from automotive electronics, the source of energy (road conditions), driving the risks, are similar. The industry standards-based damage models appear to be generic, covering a wide variety of products and failure modes. Whereas, the KBQ framework, used in this paper, maps use conditions to accelerated test requirements for only two failure modes: solder joint fatigue and socket contact fretting. The mechanisms were chosen to be distinct with different damage metric and drivers. The process is intended to explain how industry standards reflect field risks for two of the risks relevant for automotive electronics.

Mechanical Response of T300/BMP350 Composites under Tensile Loading at Room and Elevated Temperatures

2014 ◽  
Vol 1035 ◽  
pp. 138-143
Author(s):  
Ping Zhou ◽  
Pu Rong Jia ◽  
Wen Ge Pan
Keyword(s):  
High Temperature ◽  
Failure Modes ◽  
Elevated Temperatures ◽  
Mechanical Response ◽  
Effect Of Temperature ◽  
Matrix Composites ◽  
Stress Strain ◽  
Damage And Failure ◽  
Different Temperatures ◽  
Static Tensile

In this paper, the effect of elevated temperature on the behavior of carbon fiber-reinforced T300/BMP350 unidirectional laminates was studied by loading static tensile on 0°, 90°and ±45° lay-up. The stress-strain relationships of the laminates under different temperatures were obtained. The effect of temperature on the mechanical properties of materials was systematically studied. The damage and failure mechanisms of the material were studied by analyzing the material stress-strain curves and the failure modes. Results show that the T300/BMP350 polyimide matrix composites have a strong resistance to high temperature. For 0° and 90° lay-up, the retentions of tensile strength and modulus are more than 80% and 50%, respectively. High temperature has little effect on the material failure modes. Finally, based on the test results, an empirical formula which relates strength and temperature of the material was fitted.

High temperature impression creep behavior and microstructures of wrought ZM21 magnesium alloy

2021 ◽  
pp. 146442072110476
Author(s):  
D Ebenezer ◽  
SR Koteswara Rao ◽  
S Vijayan ◽  
R Rajeswari
Keyword(s):  
Activation Energy ◽  
High Temperature ◽  
Magnesium Alloy ◽  
Creep Behavior ◽  
Elevated Temperatures ◽  
Automotive Electronics ◽  
Impression Creep ◽  
Aerospace Applications ◽  
Power Law Creep ◽  
Zm21 Magnesium Alloy

Mg-Zn alloys are promising candidates for their application in automotive, electronics and aerospace applications. For their successful application, one of the performance parameters that needs to be evaluated is their creep behavior at elevated temperatures. Hence this paper evaluates the high temperature creep behavior of wrought ZM21 magnesium alloy by impression test The tests were performed under constant temperature and stress. A flat ended cylindrical punch was used to create impressions. The temperature was varied between 398 K and 598 K while the stresses were varied from 200 MPa to 500 MPa (normalized stress: 0.014 ≤  σimp/ G ≥ 0.032). A power-law creep deformation was assumed to calculate creep exponent and activation energy using the steady state minimum impression velocity obtained from impression tests. The creep behavior was analyzed with the help of impression creep curves and plastic deformation was analyzed with the help of micrographs. It was found that creep exponent varied between 4.5 and 6 and activation energy between 73.28 and 113.35 kJ/mol were obtained. From the study it was concluded that the creep mechanism involved was pipe-diffusion-controlled dislocation climb.

High Cycle Fatigue Life-Prediction for Lead-Free Interconnects Under Simultaneous High Temperature and Vibration

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Geeta Limaye
Keyword(s):  
High Temperature ◽  
High Speed ◽  
High Cycle Fatigue ◽  
Failure Modes ◽  
Elevated Temperatures ◽  
Natural Frequencies ◽  
Image Correlation ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Increase With Increase

Current trends in the automotive industry warrant a variety of electronics for improved control, safety, efficiency and entertainment. Many of these electronic systems like engine control units, variable valve sensor, crankshaft-camshaft sensors are located under-hood. Electronics installed in under-hood applications are subjected simultaneously to mechanical vibrations and thermal loads. Typical failure modes caused by vibration induced high cycle fatigue include solder fatigue, copper trace or lead fracture. The solder interconnects accrue damage much faster when vibrated at elevated temperatures. Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. Presently, the literature on mechanical behavior of lead-free alloys under simultaneous harsh environment of high-temperature vibration is sparse. In this paper, the reduction in stiffness of the PCB with temperature has been demonstrated by measuring the shift in natural frequencies. The test vehicle consisting of a variety of lead-free SAC305 daisy chain components including BGA, QFP, SOP and TSOPs has been tested to failure by subjecting it to two elevated temperatures and harmonic vibrations at the corresponding first natural frequency. The test matrix includes three test temperatures of 25C, 75C and 125C and simple harmonic vibration amplitude of 10G which are values typical in automotive testing. PCB deflection has been shown to increase with increase in temperature. The full field strain has been extracted using high speed cameras operating at 100,000 fps in conjunction with digital image correlation. Material properties of the PCB at test temperatures have been measured using tensile tests and dynamic mechanical analysis. FE simulation using global-local finite element models is thus correlated with the system characteristics such as modal shapes, natural frequencies and displacement amplitudes for every temperature. The solder level stresses have been extracted from the sub-models. Stress amplitude versus cycles to failure curves are obtained at all the three test temperatures. A comparison of failure modes for different surface mount packages at elevated test temperatures and vibration has been presented in this study.

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

2018 ◽  
Author(s):  
Mohammad S. Alam ◽  
K. M. Rafidh Hassan ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Mechanical Behavior ◽  
High Temperatures ◽  
Elevated Temperatures ◽  
Lead Free ◽  
Specimen Preparation ◽  
Stress Strain ◽  
Initial Modulus ◽  
Lead Free Solders

Lead free solders are renowned as interconnects in electronic packaging due to their relatively high melting point, attractive mechanical properties, thermal cycling reliability, and environment friendly chemical properties. The mechanical behavior of lead free solders is highly dependent on the operating temperature. Previous investigations on mechanical characterization of lead free solders have mainly emphasized stress-strain and creep testing at temperatures up to 125 °C. However, electronic devices, sometimes, experience harsh environment applications including well drilling, geothermal energy, automotive power electronics, and aerospace engines where solders are exposed to very high temperatures from 125–200 °C. Mechanical properties of lead free solders at elevated temperatures are limited. In this work, we have investigated the mechanical behavior SAC305 (96.5Sn-3.0Ag-0.5Cu) and SAC_Q (SAC+Bi) lead free solders at extreme high temperatures up to 200 °C. Stress-strain tests were performed on reflowed uniaxial specimens at four elevated temperatures (T = 125, 150, 175, and 200 °C). In addition, changes of the mechanical behavior of these alloys due to isothermal aging at T = 125 °C have been studied. Extreme care has been taken during specimen preparation so that the fabricated solder uniaxial test specimens accurately reflect the solder material microstructures present in actual lead free solder joints. High temperature tensile properties of the solders including initial modulus, yield stress, and ultimate tensile strength have been compared. As expected, our results show substantial degradations of the mechanical properties of lead-free solders at higher temperatures. With prior aging, these degradations become even more significant. Comparison of the results has shown that the addition of Bi to traditional SAC alloys improves their high temperature properties and significantly reduces their aging induced degradations.

High Temperature Silicon Integrated Circuits and Passive Components for Commercial and Military Applications

1999 ◽  
Vol 121 (4) ◽  
pp. 622-628 ◽  
Author(s):  
R. R. Grzybowski ◽  
B. Gingrich
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Elevated Temperatures ◽  
Silicon On Insulator ◽  
Passive Component ◽  
Oil Well ◽  
Automotive Electronics ◽  
Passive Components ◽  
Silicon Integrated Circuits

Advances in silicon-on-insulator (SOI) integrated circuit technology and the steady development of wider band gap semiconductors like silicon carbide are enabling the practical deployment of high temperature electronics. High temperature civilian and military electronics applications include distributed controls for aircraft, automotive electronics, electric vehicles and instrumentation for geothermal wells, oil well logging, and nuclear reactors. While integrated circuits are key to the realization of complete high temperature electronic systems, passive components including resistors, capacitors, magnetics, and crystals are also required. This paper will present characterization data obtained from a number of silicon high temperature integrated evaluated over a range of elevated temperatures and aged at a selected high temperature. This paper will also present a representative cross section of high temperature passive component characterization data for device types needed by many applications. Device types represented will include both small signal and power resistors and capacitors. Specific problems encountered with the employment of these devices in harsh environments will be discussed for each family of components. The goal in presenting this information is to demonstrate the viability of a significant number of commercially available silicon integrated circuits and passive components that operate at elevated temperatures as well as to encourage component suppliers to continue to optimize a selection of their product offerings for operation at higher temperatures. In addition, systems designers will be encouraged to view this information with an eye towards the conception and implementation of reliable and affordable high temperature systems.

High-Temperature Instability of A Cr2Nb-Nb(Cr) Microlaminate Composite

1996 ◽  
Vol 54 ◽  
pp. 374-375
Author(s):  
M. Larsen ◽  
R.G. Rowe ◽  
D.W. Skelly
Keyword(s):  
Heat Treatment ◽  
Solid Solution ◽  
High Temperature ◽  
Elevated Temperatures ◽  
Aircraft Engine ◽  
Lattice Parameter ◽  
Microstructural Stability ◽  
Elevated Temperature Strength ◽  
Cross Sectional ◽  
Bcc Structure

Microlaminate composites consisting of alternating layers of a high temperature intermetallic compound for elevated temperature strength and a ductile refractory metal for toughening may have uses in aircraft engine turbines. Microstructural stability at elevated temperatures is a crucial requirement for these composites. A microlaminate composite consisting of alternating layers of Cr2Nb and Nb(Cr) was produced by vapor phase deposition. The stability of the layers at elevated temperatures was investigated by cross-sectional TEM.The as-deposited composite consists of layers of a Nb(Cr) solid solution with a composition in atomic percent of 91% Nb and 9% Cr. It has a bcc structure with highly elongated grains. Alternating with this Nb(Cr) layer is the Cr2Nb layer. However, this layer has deposited as a fine grain Cr(Nb) solid solution with a metastable bcc structure and a lattice parameter about half way between that of pure Nb and pure Cr. The atomic composition of this layer is 60% Cr and 40% Nb. The interface between the layers in the as-deposited condition appears very flat (figure 1). After a two hour, 1200 °C heat treatment, the metastable Cr(Nb) layer transforms to the Cr2Nb phase with the C15 cubic structure. Grain coarsening occurs in the Nb(Cr) layer and the interface between the layers roughen. The roughening of the interface is a prelude to an instability of the interface at higher heat treatment temperatures with perturbations of the Cr2Nb grains penetrating into the Nb(Cr) layer.

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