Thermal Performance Enhancement of Glass Interposer

2015 ◽  
Author(s):  
Sangbeom Cho ◽  
Yogendra K. Joshi
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Lower Cost ◽  
Performance Enhancement ◽  
Vapor Chamber ◽  
Low Loss ◽  
Packaging Technology ◽  
High Electrical Resistivity ◽  
Fundamental Limitations ◽  
Out Of Plane

As demands on performance for mobile electronics continue to increase, traditional packaging technology is facing its limit in number of input/outputs (I/Os) and thermal challenges. Glass interposers offer many advantages over previous packaging technology for mobile electronics, including ultra-high electrical resistivity, low loss, and lower cost at processed interposer levels. However, it has two fundamental limitations; brittleness and relatively low thermal conductivity (∼1 W/mK), compared to Si (∼150 W/mK). This paper presents a study on thermal performance enhancement of glass interposer based on thermal modeling, and compares it with silicon interposer. The model captures in-plane and out-of-plane thermal performance enhancement with copper structures incorporated in the interposer. To further study the effect of advanced cooling schemes on interposer technology, an integrated vapor chamber design is evaluated through computational modeling.

Multi-scale thermal modeling of glass interposer for mobile electronics application

2016 ◽  
Vol 26 (3/4) ◽  
pp. 1157-1171 ◽  
Author(s):  
Sangbeom Cho ◽  
Venky Sundaram ◽  
Rao Tummala ◽  
Yogendra Joshi
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Thermal Performance ◽  
Memory Bandwidth ◽  
Vapor Chamber ◽  
Packaging Technology ◽  
Content Type ◽  
Low Thermal Conductivity ◽  
Multi Scale

Purpose – The functionality of personal mobile electronics continues to increase, in turn driving the demand for higher logic-to-memory bandwidth. However, the number of inputs/outputs supported by the current packaging technology is limited by the smallest achievable electrical line spacing, and the associated noise performance. Also, a growing trend in mobile systems is for the memory chips to be stacked to address the growing demand for memory bandwidth, which in turn gives rise to heat removal challenges. The glass interposer substrate is a promising packaging technology to address these emerging demands, because of its many advantages over the traditional organic substrate technology. However, glass has a fundamental limitation, namely low thermal conductivity (∼1 W/m K). The purpose of this paper is to quantify the thermal performance of glass interposer-based electronic packages by solving a multi-scale heat transfer problem for an interposer structure. Also, this paper studies the possible improvement in thermal performance by integrating a fluidic heat spreader or vapor chamber within the interposer. Design/methodology/approach – This paper illustrates the multi-scale modeling approach applied for different components of the interposer, including Through Package Vias (TPVs) and copper traces. For geometrically intricate and repeating structures, such as interconnects and TPVs, the unit cell effective thermal conductivity approach was used. For non-repeating patterns, such as copper traces in redistribution layer, CAD drawing-based thermal resistance network analysis was used. At the end, the thermal performance of vapor chamber integrated within a glass interposer was estimated by using an enhanced effective thermal conductivity, calculated from the published thermal resistance data, in conjunction with the analytical expression for thermal resistance for a given geometry of the vapor chamber. Findings – The limitations arising from the low thermal conductivity of glass can be addressed by using copper structures and vapor chamber technology. Originality/value – A few reports can be found on thermal performance of glass interposers. However thermal characteristics of glass interposer with advanced cooling technology have not been reported.

scholarly journals Preparation and Thermal Performance Enhancement of Low Temperature Eutectic Composite Phase Change Materials Based on Na2SO4·10H2O

Materials ◽  
2018 ◽  
Vol 11 (11) ◽  
pp. 2230 ◽  
Author(s):  
Pumin Hou ◽  
Jinfeng Mao ◽  
Fei Chen ◽  
Yong Li ◽  
Xian Dong
Keyword(s):  
Thermal Conductivity ◽  
Phase Change ◽  
Thermal Performance ◽  
Phase Change Materials ◽  
Performance Enhancement ◽  
Expanded Graphite ◽  
Nucleating Agent ◽  
Thermal Reliability ◽  
Composite Phase Change Materials ◽  
Mass Fractions

In this paper, a series of Na2SO4·10H2O–KCl eutectic mixtures were prepared by adding different mass fractions of KCl (1 wt.%, 3 wt.%, 5 wt.%, or 7 wt.%) to Na2SO4·10H2O. Polyacrylamide (PAM) was proposed as the thickener, sodium tetraborate decahydrate (STD) was proposed as the nucleating agent, and expanded graphite (EG) was proposed as the high thermal conductivity medium for Na2SO4·10H2O–5 wt.% KCl eutectics. The results showed that in Na2SO4·10H2O–5 wt.% KCl eutectics with 5 wt.% PAM and 5 wt.% STD, almost no phase separation occurred, and the degree of supercooling was reduced to 0.4 °C. The thermal performance of Na2SO4·10H2O–5 wt.% KCl composite phase change materials (CPCMs) with varying contents of EG was explored. The results showed that EG could improve the thermal conductivity effectively and that the mass fraction of EG should be no more than 3%, otherwise the crystallization value and supercooling would deteriorate. The thermal reliability of the Na2SO4·10H2O–5 wt.% KCl eutectic CPCMs containing 5 wt.% PAM, 5 wt.% STD, and 3 wt.% EG was investigated, mainly through the ambient temperature, thermal cycling test, and TGA analysis. The results demonstrated that these CPCMs showed perfect thermal reliability.

Thermal Performance Enhancement of a Shallow Solar Pond Based on Nanofluids

2020 ◽  
Vol 12 (1) ◽  
pp. 01016-1-01016-5
Author(s):  
A. Terfai ◽  
◽  
Y. Chiba ◽  
M. N. Bouaziz ◽  
◽  
...  
Keyword(s):  
Thermal Performance ◽  
Performance Enhancement ◽  
Solar Pond

Maximizing Heat Transfer Through Joint Fin Systems

2005 ◽  
Vol 128 (2) ◽  
pp. 203-206 ◽  
Author(s):  
A.-R. A. Khaled
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Performance ◽  
Critical Length ◽  
The Other ◽  
Rigid Fixation ◽  
Convection Coefficient ◽  
Heat Transfer Characteristics ◽  
Cold Side ◽  
Transfer Characteristics

Heat transfer through joint fins is modeled and analyzed analytically in this work. The terminology “joint fin systems” is used to refer to extending surfaces that are exposed to two different convective media from its both ends. It is found that heat transfer through joint fins is maximized at certain critical lengths of each portion (the receiver fin portion which faces the hot side and the sender fin portion that faces the cold side of the convective media). The critical length of each portion of joint fins is increased as the convection coefficient of the other fin portion increases. At a certain value of the thermal conductivity of the sender fin portion, the critical length for the receiver fin portion may be reduced while heat transfer is maximized. This value depends on the convection coefficient for both fin portions. Thermal performance of joint fins is increased as both thermal conductivity of the sender fin portion or its convection coefficient increases. This work shows that the design of machine components such as bolts, screws, and others can be improved to achieve favorable heat transfer characteristics in addition to its main functions such as rigid fixation properties.

scholarly journals Recent Advancements in Technical Design and Thermal Performance Enhancement of Solar Greenhouse Dryers

2021 ◽  
Vol 13 (13) ◽  
pp. 7025
Author(s):  
Shiva Gorjian ◽  
Behnam Hosseingholilou ◽  
Laxmikant D. Jathar ◽  
Haniyeh Samadi ◽  
Samiran Samanta ◽  
...  
Keyword(s):  
Thermal Performance ◽  
Fossil Fuels ◽  
Performance Enhancement ◽  
Renewable Energy Sources ◽  
Ghg Emissions ◽  
Heat Pumps ◽  
Energy Sources ◽  
Key Factor ◽  
Hybrid Configuration ◽  
Vegetables And Fruits

The food industry is responsible for supplying the food demand of the ever-increasing global population. The food chain is one of the major contributors to greenhouse gas (GHG) emissions, and global food waste accounts for one-third of produced food. A solution to this problem is preserving crops, vegetables, and fruits with the help of an ancient method of sun drying. For drying agricultural and marine products, several types of dryers are also being developed. However, they require a large amount of energy supplied conventionally from pollutant energy sources. The environmental concerns and depletion risks of fossil fuels persuade researchers and developers to seek alternative solutions. To perform drying applications, sustainable solar power may be effective because it is highly accessible in most regions of the world. Greenhouse dryers (GHDs) are simple facilities that can provide large capacities for drying agricultural products. This study reviews the integration of GHDs with different solar technologies, including photovoltaic (PV), photovoltaic-thermal (PVT), and solar thermal collectors. Additionally, the integration of solar-assisted greenhouse dryers (SGHDs) with heat pumps and thermal energy storage (TES) units, as well as their hybrid configuration considering integration with other renewable energy sources, is investigated to improve their thermal performance. In this regard, this review presents and discusses the most recent advances in this field. Additionally, the economic analysis of SGHDs is presented as a key factor to make these sustainable facilities commercially available.

scholarly journals Enhancement of the Thermal Performance of the Paraffin-Based Microcapsules Intended for Textile Applications

Polymers ◽  
2021 ◽  
Vol 13 (7) ◽  
pp. 1120
Author(s):  
Virginija Skurkyte-Papieviene ◽  
Ausra Abraitiene ◽  
Audrone Sankauskaite ◽  
Vitalija Rubeziene ◽  
Julija Baltusnikaite-Guzaitiene
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Comparative Method ◽  
Multiwall Carbon Nanotubes ◽  
Acrylic Resin ◽  
Positive Influence ◽  
Outer Shell ◽  
Ir Camera ◽  
Spacer Fabric ◽  
Thermally Conductive

Phase changing materials (PCMs) microcapsules MPCM32D, consisting of a polymeric melamine-formaldehyde (MF) resin shell surrounding a paraffin core (melting point: 30–32 °C), have been modified by introducing thermally conductive additives on their outer shell surface. As additives, multiwall carbon nanotubes (MWCNTs) and poly (3,4-ethylenedioxyoxythiophene) poly (styrene sulphonate) (PEDOT: PSS) were used in different parts by weight (1 wt.%, 5 wt.%, and 10 wt.%). The main aim of this modification—to enhance the thermal performance of the microencapsulated PCMs intended for textile applications. The morphologic analysis of the newly formed coating of MWCNTs or PEDOT: PSS microcapsules shell was observed by SEM. The heat storage and release capacity were evaluated by changing microcapsules MPCM32D shell modification. In order to evaluate the influence of the modified MF outer shell on the thermal properties of paraffin PCM, a thermal conductivity coefficient (λ) of these unmodified and shell-modified microcapsules was also measured by the comparative method. Based on the identified optimal parameters of the thermal performance of the tested PCM microcapsules, a 3D warp-knitted spacer fabric from PET was treated with a composition containing 5 wt.% MWCNTs or 5 wt.% PEDOT: PSS shell-modified microcapsules MPCM32D and acrylic resin binder. To assess the dynamic thermal behaviour of the treated fabric samples, an IR heating source and IR camera were used. The fabric with 5 wt.% MWCNTs or 5 wt.% PEDOT: PSS in shell-modified paraffin microcapsules MPCM32D revealed much faster heating and significantly slower cooling compared to the fabric treated with the unmodified ones. The thermal conductivity of the investigated fabric samples with modified microcapsules MPCM32D has been improved in comparison to the fabric samples with unmodified ones. That confirms the positive influence of using thermally conductive enhancing additives for the heat transfer rate within the textile sample containing these modified paraffin PCM microcapsules.

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