Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Kazi Mirza ◽  
Mahendra Harsha ◽  
Jeff Suhling ◽  
Kai Goebel
Keyword(s):  
High Reliability ◽  
Thermal Conditions ◽  
Remaining Useful Life ◽  
Leading Indicators ◽  
Damage State ◽  
Thermal Profile ◽  
Aging Conditions ◽  
History Approach ◽  
Damage Mapping ◽  
Mathematical Relationships

Electronic systems may be subjected to prolonged and intermittent periods of storage prior to deployment or usage. Prior studies have shown that leadfree solder interconnects show measurable degradation in the mechanical properties even after brief exposures to high temperature. In this paper, a method has been developed for the determining equivalent storage time to produce identical damage at a different temperature. Electronics subjected to accelerated tests often have a well-defined thermal profile for a specified period of time. Quantification of the thermal profile in field deployed electronics may be often difficult because of variance in the environment conditions and usage profile. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. Approach for mapping damage in leadfree second-level interconnects under between thermal conditions is new. High reliability applications such as avionics and missile systems may be often exposed to long periods of storage prior to deployment. Effect of storage at different temperature conditions can be mapped using the presented approach. A framework has been developed to investigate the system state and estimate the remaining useful life of solder ball subjected to a variety of isothermal aging conditions including 60°C, 75°C and 125°C for periods of time between 1-week and 4-week. Data on damage precursors has been collected and analyzed to derive physics based damage mapping relationships for aging. Mathematical relationships have been derived for the damage mapping to various thermal storage environments to facilitate determining appropriate time-temperature combination to reach a particular level of damage state. Activation energy for the leading indicators of failure is also computed. Specific damage proxies examined include the phase-growth indicator and the intermetallic thickness. The viability of the approach has been demonstrated for leadfree test assemblies subjected to multiple thermal aging at 60° C, 75°C and 125°C. Damage mapping relationships are derived from data based on the two separate leading indicators.

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

2009 ◽  
Author(s):  
Pradeep Lall ◽  
Rahul Vaidya ◽  
Vikrant More ◽  
Jeff Suhling ◽  
Kai Goebel
Keyword(s):  
Residual Life ◽  
Thermal Environment ◽  
High Reliability ◽  
Remaining Useful Life ◽  
Damage State ◽  
Core System ◽  
Thermal Environments ◽  
Marquardt Algorithm ◽  
Tools And Techniques ◽  
Electronic Assemblies

Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantification of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including −55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.

Leading Indicators of Damage for Prognostication of Leadfree Electronics Subjected to Multiple Thermo-Mechanical Environments

2009 ◽  
Author(s):  
Pradeep Lall ◽  
Rahul Vaidya ◽  
Vikrant More ◽  
Jeff Suhling ◽  
Kai Goebel
Keyword(s):  
Residual Life ◽  
Thermal Environment ◽  
High Reliability ◽  
Damage State ◽  
Core System ◽  
Thermal Environments ◽  
Marquardt Algorithm ◽  
Tools And Techniques ◽  
Deployed Systems ◽  
Electronic Assemblies

Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantification of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including −55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.

scholarly journals Effect of Thermal Treatments on the Mechanical Properties Enhancement of High Reliability Metallic Materials by Laser Shock Processing

2014 ◽  
Vol 783-786 ◽  
pp. 2376-2381
Author(s):  
J.L. Ocaña ◽  
M. Díaz ◽  
J.A. Porro ◽  
L. Ruiz de Lara ◽  
C. Correa
Keyword(s):  
Mechanical Properties ◽  
High Reliability ◽  
Thermal Conditions ◽  
Point Of View ◽  
Experimental Point ◽  
Metallic Materials ◽  
Laser Shock ◽  
Laser Shock Processing ◽  
Integral Assessment ◽  
Shock Processing

Laser shock processing (LSP) is increasingly applied as an effective technology for the improvement of metallic materials mechanical properties in different types of components as a means of enhancement of their fatigue life behavior. As reported in previous contributions by the authors, a main effect resulting from the application of the LSP technique consists on the generation of relatively deep compression residual stresses fields into metallic components allowing an improved mechanical behaviour, explicitly the life improvement of the treated specimens against wear, crack growth and stress corrosion cracking. Additional results accomplished by the authors in the line of practical development of the LSP technique at an experimental level (aiming its integral assessment from an interrelated theoretical and experimental point of view) are presented in this paper. Concretely, experimental results on the residual stress profiles and associated mechanical properties modification successfully reached in typical materials under different LSP irradiation conditions are presented. In this case, the specific behavior of a widely used material in high reliability components (especially in nuclear and biomedical applications) as AISI 316L is analyzed, the effect of possible “in-service” thermal conditions on the relaxation of the LSP effects being specifically characterized.

Die Attachment for −120°C to +20°C Thermal Cycling of Microelectronics for Future Mars Rovers—An Overview1

2000 ◽  
Vol 123 (2) ◽  
pp. 105-111 ◽  
Author(s):  
Randall K. Kirschman ◽  
Witold M. Sokolowski ◽  
Elizabeth A. Kolawa
Keyword(s):  
Electronic Device ◽  
Thermal Environment ◽  
High Reliability ◽  
Thermal Conditions ◽  
Thermal Control ◽  
Electronic System ◽  
Primary Concern ◽  
Die Attachment ◽  
Mission Duration ◽  
Night And Day

Active thermal control for electronics on Mars rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of ≈−90°C to a high of ≈+20°C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional—even high-reliability—electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal, and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately one earth year. Our conclusion, from a review of literature and personal contacts, is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus, die attachment does not appear to be a roadblock to eliminating thermal control for rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars rovers.

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Mahendra Harsha ◽  
Jeff Suhling ◽  
Kai Goebel
Keyword(s):  
Thermal Cycling ◽  
Microstructural Evolution ◽  
Thermal Aging ◽  
Prolonged Exposure ◽  
Residual Life ◽  
High Reliability ◽  
Electronic Systems ◽  
Damage Initiation ◽  
Aging Conditions ◽  
Insight Into

Electronics in high reliability applications may be stored for extended periods of time prior to deployment. Prior studies have shown the elastic modulus and ultimate tensile strength of the SAC leadfree alloys reduces under prolonged exposure to high temperatures [Zhang 2009]. The thermal cycle magnitudes may vary over the lifetime of the product. Long-life systems may be re-deployed several times over the use life of the product. Previously, the authors have identified damage pre-cursors for correlation of the damage progression with the microstructural evolution of damage in second level interconnects [Lall 2004a-d, 2005a-b, 2006a-f, 2007a-e, 2008a-f, 2009a-d, 2010a-j]. Leadfree assemblies with Sn3Ag0.5Cu solder have been subjected to variety of thermal aging conditions including 60°C, 85°C and 125°C for periods of time between 1-week and 2-months, thermal cycling from −55°C to 125°C, −40°C to 95°C and 3°C to 100°C. The presented methodology uses leading indicators of failure based on microstructural evolution of damage to identify accrued damage in electronic systems subjected to sequential stresses of thermal aging and thermal cycling. Damage equivalency relationships have been developed to map damage accrued in thermal aging to the reduction in thermo-mechanical cyclic life based on damage proxies. Accrued damage between different thermal cyclic magnitudes has also been mapped for from −55°C to 125°C, −40°C to 95°C and 3°C to 100°C thermal cycles. The presented method for interrogation of the accrued damage for the field deployed electronics, significantly prior to failure, may allow insight into the damage initiation and progression of the deployed system. The expected error with interrogation of system state and assessment of residual life has been quantified.

Data Driven Prognostics for Rotating Machinery

2013 ◽  
pp. 120-133 ◽  
Author(s):  
Eric Bechhoefer
Keyword(s):  
Detection Threshold ◽  
Remaining Useful Life ◽  
Condition Based Maintenance ◽  
Data Driven ◽  
Health Indicator ◽  
Damage State ◽  
Condition Indicators ◽  
Gear Fault ◽  
Useful Life ◽  
Threshold Setting

A prognostic is an estimate of the remaining useful life of a monitored part. While diagnostics alone can support condition based maintenance practices, prognostics facilitates changes to logistics which can greatly reduce cost or increase readiness and availability. A successful prognostic requires four processes: 1) feature extraction of measured data to estimate damage; 2) a threshold for the feature, which, when exceeded, indicates that it is appropriate to perform maintenance; 3) given a future load profile, a model that can estimate the remaining useful life of the component based on the current damage state; and 4) an estimate of the confidence in the prognostic. This chapter outlines a process for data-driven prognostics by: describing appropriate condition indicators (CIs) for gear fault detection; threshold setting for those CIs through fusion into a component health indicator (HI); using a state space process to estimate the remaining useful life given the current component health; and a state estimate to quantify the confidence in the estimate of the remaining useful life.

Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Nokibul Islam ◽  
Prakriti Choudhary ◽  
Jeff Suhling
Keyword(s):  
Residual Life ◽  
Prognostic Indicators ◽  
Leading Indicators ◽  
Damage State ◽  
Solder Interconnects ◽  
Damage Progression ◽  
Plastic Ball ◽  
Phase Size ◽  
Electronic Assemblies

In this paper, a methodology for prognostication-of-electronics has been developed for accurate assessment of residual life in a deployed electronic components, and determination of damage-state in absence of macro-indicators of failure. Proxies for leading indicators-of-failure have been identified and correlated with damage progression under thermomechanical loads. Examples of proxies include — microstructural evolution characterized by average phase size and intermetallic growth rate in solder interconnects. Validity of damage proxies has been investigated for both 63Sn37Pb leaded and SnAgCu leadfree electronics. Structures examined include — plastic ball grid array format electronic and MEMS Packages and discrete devices assembled with FR4-06 laminates. Focus of the research presented in this paper is on interrogation of the aged material’s damage state and enhancing the understanding of damage progression. The research is aimed at development of damage relationships for determination of residual life of aged electronics and assessment of design margins instead of life prediction of new components. The prognostic indicators presented in this paper, can be used for health monitoring of electronic assemblies.

Prognosis Methodologies for Health Management of Electronics and MEMS Packaging

2004 ◽  
Author(s):  
Pradeep Lall ◽  
Nokibul Islam ◽  
Kaysar Rahim ◽  
Jeff Suhling
Keyword(s):  
Printed Circuit Board ◽  
Prediction Models ◽  
Health Management ◽  
Residual Life ◽  
Structural Evolution ◽  
Remaining Useful Life ◽  
Circuit Board ◽  
Leading Indicators ◽  
Phase Size ◽  
Material State

The current state-of-art in managing system reliability is geared towards the development of life-prediction models for unaged pristine materials under known loading conditions based on relationships such as the Paris’s Power Law [Paris, et. al 1960, 1961], Coffin-Manson Relationship [Coffin 1954; Tavernelli, et. al. 1959; Smith, et. al. 1964; Manson, et. al. 1964] and the S-N Diagram. There is need for methods and processes which will allow interrogation of complex systems and sub-systems to determine the remaining useful life prior to repair or replacement. This capability of determination of material or system state is called “prognosis”. In this paper, a methodology for prognosis-of-electronics has been demonstrated with data of leading indicators of failure for accurate assessment of product damage significantly prior to appearance of any macro-indicators of damage. Proxies for leading indicators of failure have been developed including – micro-structural evolution characterized by average phase size and interfacial stresses at interface of silicon structures. Structures examined include – electronics package, MEMS Packages and interconnections on a metal backed printed circuit board typical of electronics deployed in harsh environments. Since, an aged material knows its state the research presented in this paper focuses on enhancing the understanding of material damage to facilitate proper interrogation of material state. Mathematical relationship has been developed between phase growth rate and time-to-1-percent failure to enable the computation of damage manifested and a forward estimate of residual life.

Remaining Useful Life Prognosis of Supercapacitors Under Temperature and Voltage Aging Conditions

2018 ◽  
Vol 65 (5) ◽  
pp. 4357-4367 ◽  
Author(s):  
Asmae El Mejdoubi ◽  
Hicham Chaoui ◽  
Jalal Sabor ◽  
Hamid Gualous
Keyword(s):  
Remaining Useful Life ◽  
Life Prognosis ◽  
Aging Conditions ◽  
Useful Life

scholarly journals Intelligent Online Monitoring of Rolling Bearing: Diagnosis and Prognosis

Entropy ◽  
2021 ◽  
Vol 23 (7) ◽  
pp. 791
Author(s):  
Hassane Hotait ◽  
Xavier Chiementin ◽  
Lanto Rasolofondraibe
Keyword(s):  
Short Term Memory ◽  
Spatial Clustering ◽  
Rolling Bearing ◽  
Remaining Useful Life ◽  
Suggested Method ◽  
Health Indicator ◽  
Damage State ◽  
Rolling Bearings ◽  
Regressive Model ◽  
Input Model

This paper suggests a new method to predict the Remaining Useful Life (RUL) of rolling bearings based on Long Short Term Memory (LSTM), in order to obtain the degradation condition of the rolling bearings and realize the predictive maintenance. The approach is divided into three parts: the first part is the clustering to detect the damage state by the density-based spatial clustering of applications with noise. The second one is the health indicator construction which could give a better reflection of the bearing degradation tendency and is selected as the input for the prediction model. In the third part of the RUL prediction, the LSTM approach is employed to improve the accuracy of the prediction. The rationale of this work is to combine the two methods—the density-based spatial clustering of applications with noise and LSTM—to identify the abnormal state in rolling bearings, then estimate the RUL. The suggested method is confirmed by experimental data of bearing life cycle, and the RUL prediction results of the model LSTM are compared with the nonlinear au-regressive model with exogenous input model. In addition, the constructed health indicator is compared with the spectral kurtosis feature. The results demonstrated that the suggested method is more appropriate than the nonlinear au-regressive model with exogenous input model for the prediction of bearing RUL.

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