Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot

2013 ◽  
Author(s):  
Michael Manno ◽  
Peng Wang ◽  
Avram Bar-Cohen
Keyword(s):  
Heat Flux ◽  
Hot Spot ◽  
Critical Factor ◽  
Spatial Separation ◽  
Thermal Design ◽  
Thermoelectric Cooling ◽  
Current Profile ◽  
Flux Profile ◽  
On Chip ◽  
Temporal Interaction

On-chip kW-level hotspots have become a significant factor in the thermal design of modern electronic packages. Thermoelectric cooling has been shown to be capable of suppressing such hotspots, but it is not yet clear how to best deploy embedded thermoelectric microcoolers for notional hot spot scenarios. This paper will present the results of recent work on thermoelectric “self cooling” of transient hotspots. A 3-D multi-physics numerical model is used to simulate the spatial and temporal temperature variations associated with a dynamic hotspot on a germanium substrate, for which the hotspot heat flux varies over time. The temporal interaction between the hotspot and the thermoelectric microcooler for specified hotspot duty cycle, hotspot heat flux profile, and thermoelectric cooler current profile will be examined. Due to the spatial separation between the cooler and the hotspot, the results suggest that anticipatory cooling, with a prescribed current profile, is a critical factor in the efficient removal of a transient hotspot.

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

Finite Element Analysis of Thermoelectric Refrigeration on the Heat Surface of the Chip Packaging

2014 ◽  
Vol 501-504 ◽  
pp. 2271-2275
Author(s):  
Wen Tao Gao ◽  
Qing Hai Luo ◽  
Gao Feng Li ◽  
Sheng Hao Xiao
Keyword(s):  
Numerical Simulation ◽  
Finite Element ◽  
Hot Spot ◽  
Research Direction ◽  
Thermal Design ◽  
Thermoelectric Cooling ◽  
Surface Integral ◽  
Local Cooling ◽  
Element Analysis ◽  
Thermoelectric Refrigeration

On the basis of analysis of the principle of thermoelectric refrigeration and the research on the thermoelectric refrigeration technology and the thermal theoretical analysis of electronic components by domestic and foreign scholars, research on thermoelectric cooling of the uniform heat packaging surface from both the surface integral heat radiating and the local hot spot cooling of the chip by finite element numerical simulation and cooling both the chip and the heat from the whole surface of the local hot spots, using the finite element method of numerical simulation techniques Package uniform surface heat thermoelectric cooling study found the thermoelectric cooling hot surfaces in a uniform local cooling effect and temperature distribution, and pointed out that the chip thermoelectric cooling and thermal design layout surface will be in the future to improve the electroniccomponents of a hot heat important research direction.

Thermal Management of On-Chip Hot Spot

2009 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Peng Wang
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Switching Speed ◽  
Primary Driver ◽  
Management Approaches ◽  
On Chip ◽  
Physical Phenomena

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip “hot spots”. The application of on-chip high heat flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric microcoolers — using mini-contcat enhancement and in-plane thermoelectric currents, orthotropic TIM’s/heat spreaders, and phase-change microgap coolers.

Thermal Management of On-Chip Hot Spot

2012 ◽  
Vol 134 (5) ◽  
Author(s):  
Avram Bar-Cohen ◽  
Peng Wang
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Switching Speed ◽  
Two Phase ◽  
Advantages And Disadvantages ◽  
On Chip

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared.

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Abas Abdoli ◽  
George S. Dulikravich ◽  
Genesis Vasquez ◽  
Siavash Rastkar
Keyword(s):  
Heat Flux ◽  
Thermal Stresses ◽  
Hot Spot ◽  
Heat Removal ◽  
High Heat ◽  
Heat Transfer Analysis ◽  
Deformation Analysis ◽  
High Heat Flux ◽  
Cooling Design ◽  
Microchannel Cooling

Two-layer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 × 2.45 mm footprint and a hot spot of 0.5 × 0.5 mm in its center was studied in this research. Two different cases were simulated in which heat fluxes of 1500 W cm−2 and 2000 W cm−2 were applied at the hot spot. Heat flux of 1000 W cm−2 was applied on the rest of the chip. Each microchannel layer had 20 channels with an aspect ratio of 4:1. Direction of the second microchannel layer was rotated 90 deg with respect to the first layer. Fully three-dimensional (3D) conjugate heat transfer analysis was performed to study the heat removal capacity of the proposed two-layer microchannel cooling design for high heat flux chips. In the next step, a linear stress analysis was performed to investigate the effects of thermal stresses applied to the microchannel cooling design due to variations of temperature field. Results showed that two-layer microchannel configuration was capable of removing heat from high heat flux chips with a hot spot.

New Thermal Issues on the Modelling of Tool-Workpiece Interaction: Application to Dry Cutting of AISI 1045 Steel

2011 ◽  
Vol 223 ◽  
pp. 286-295 ◽  
Author(s):  
Cédric Courbon ◽  
Tarek Mabrouki ◽  
Joël Rech ◽  
Denis Mazuyer ◽  
Enrico D'Eramo
Keyword(s):  
Heat Flux ◽  
Hot Spot ◽  
Orthogonal Cutting ◽  
Chip Thickness ◽  
Contact Length ◽  
Dry Cutting ◽  
Aisi 1045 Steel ◽  
Aisi 1045 ◽  
1045 Steel ◽  
Coated Carbide

The present work proposes to enhance the thermal interface denition in Finite Element (FE) simulations of machining. A user subroutine has been developed in Abaqus/Explicit © to implement a new experimentally-based heat partition model extracted from tribological tests. A 2D Arbitrary-Lagragian-Eulerian (ALE) approach is employed to simulate dry orthogonal cutting of AISI 1045 steel with coated carbide inserts. Simulation results are compared to experimental ones over a whole range of cutting speeds and feed rates in terms of average cutting forces, chip thickness, tool chip contact length and heat flux. This study emphasizes that heat transfer and temperature distribution in the cutting tool are drastically in uenced by the thermal formulation used at the interface. Consistency of the numerical results such as heat flux transmitted to the tool, peak temperature as well as hot spot location can be denitively improved.

On-Chip Two-Phase Cooling With Refrigerant 85 $\mu{\rm m}$-Wide Multi-Microchannel Evaporator Under Hot-Spot Conditions

2012 ◽  
Vol 2 (2) ◽  
pp. 311-320 ◽  
Author(s):  
Etienne Costa-Patry ◽  
Stefano Nebuloni ◽  
Jonathan Olivier ◽  
John Richard Thome
Keyword(s):  
Hot Spot ◽  
Two Phase ◽  
On Chip ◽  
Two Phase Cooling

Optimal scheduling algorithms of system chip power density based on network on chip

2021 ◽  
pp. 120-127
Author(s):  
Jiashen Li ◽  
◽  
Yun Pan ◽  
Keyword(s):  
Dynamic Programming ◽  
Power Density ◽  
Simulated Annealing Algorithm ◽  
Dynamic Programming Algorithm ◽  
Network On Chip ◽  
Thermal Design ◽  
Optimal Scheduling ◽  
Programming Algorithm ◽  
System Throughput ◽  
On Chip

The improvement of chip integration leads to the increase of power density of system chips, which leads to the overheating of system chips. When dispatching the power density of system chips, some working modules are selectively closed to avoid all modules on the chip being turned on at the same time and to solve the problem of overheating. Taking 2D grid-on-chip network as the research object, an optimal scheduling algorithm of system-on-chip power density based on network-on-chip (NoC) is proposed. Under the constraints of thermal design power (TDP) and system, dynamic programming algorithm is used to solve the optimal application set throughput allocation from bottom to top by dynamic programming for the number and frequency level of each application configuration processor under the given application set of network-on-chip. On this basis, the simulated annealing algorithm is used to complete the application mapping aiming at heat dissipation effect and communication delay. The open and closed processor layout is determined. After obtaining the layout results, the TDP is adjusted. The maximum TDP constraint is iteratively searched according to the feedback loop of the system over-hot spots, and the power density scheduling performance of the system chip is maximized under this constraint, so as to ensure the system core. At the same time, chip throughput can effectively solve the problem of chip overheating. The experimental results show that the proposed algorithm increases the system chip throughput by about 11%, improves the system throughput loss, and achieves a balance between the system chip power consumption and scheduling time.

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

2013 ◽  
Author(s):  
Leila Choobineh ◽  
Dereje Agonafer ◽  
Ankur Jain
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Temperature Distribution ◽  
Analytical Modeling ◽  
Three Dimensional ◽  
Heat Transfer Process ◽  
Thermal Design ◽  
Research Attention ◽  
On Chip

Heterogeneous integration in microelectronic systems using interposer technology has attracted significant research attention in the past few years. Interposer technology is based on stacking of several heterogeneous chips on a common carrier substrate, also referred to as the interposer. Compared to other technologies such as System-on-Chip (SoC) or System-in-Package (SiP), interposer-based integration offers several technological advantages. However, the thermal management of an interposer-based system is not well understood. The presence of multiple heat sources in various die and the interposer itself needs to be accounted for in any effective thermal model. While a finite-element based simulation may provide a reasonable temperature prediction tool, an analytical solution is highly desirable for understanding the fundamentals of the heat transfer process in interposers. In this paper, we describe our recent work on analytical modeling of heat transfer in interposer-based microelectronic systems. The basic governing energy conservation equations are solved to derive analytical expressions for the temperature distribution in an interposer-based microelectronic system. These solutions are combined with an iterative approach to provide the three-dimensional temperature field in an interposer. Results are in excellent agreement with finite-element solutions. The analytical model is utilized to study the effect of various parameters on the temperature field in an interposer system. Results from this work may be helpful in the thermal design of microelectronic systems containing interposers.

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