Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources

2007 ◽  
Author(s):  
John R. Hartenstine ◽  
Richard W. Bonner ◽  
Jared R. Montgomery ◽  
Tadej Semenic
Keyword(s):  
Saturation Temperature ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Working Fluid ◽  
High Heat Flux ◽  
Flow Loop ◽  
Large Area ◽  
Two Phase ◽  
Porous Wick

Two-phase flow loop technologies capable of acquiring high heat fluxes (>1kW/cm2) from large area heat sources (10cm2) are being considered for the next generation naval thermal requirements. A loop thermosyphon device (∼1 meter tall) was fabricated and tested that included several copper porous wick structures in cylindrical evaporators. The first two were standard annular monoporous and biporous wick designs. The third wick consists of an annular evaporator wick and an integral secondary slab wick for improved liquid transport. In this configuration a circular array of cylindrical vapor vents are formed integral to the primary and secondary transport wick composite. Critical heat fluxes using these wick structures were measured between 240W/cm2 and 465W/cm2 over a 10cm2 area with water as the working fluid at 70°C saturation temperature. A thermosyphon model capable of predicting flow rate at various operating conditions based on a separated flow model is presented.

The Simulation of Heat Pipe Evaporator in Concentration Solar Cell

2010 ◽  
Vol 44-47 ◽  
pp. 1207-1212 ◽  
Author(s):  
Zi Long Wang ◽  
Hua Zhang ◽  
Hai Tao Zhang
Keyword(s):  
Heat Flux ◽  
Solar Cell ◽  
Heat Pipe ◽  
Saturation Temperature ◽  
High Heat ◽  
Maximum Temperature ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Solar Cell Performance

Considering the problem of the concentrating solar cell efficiency restricted by the temperature. The closed two-phase thermosyphon was used to dissipation heat in concentrating solar cell at high heat flux, which adopted water as the working fluid. The temperature distribution of evaporator had significant effect on solar cell performance and heat pipe efficiency. A numerical simulation model of evaporator was established by FLUENT. During the computing process, the heat flux, filling ratio of liquid and saturation temperature were taken into account. It was found that the maximum temperature of evaporator was less than 85°C, when the solar cell operated in 140 to 180 suns, in the conditions of evaporator size (Length×Width×Height, 100×100×30 mm), the optimum charging ratio of liquid is between 27%～30%. The smaller saturation temperature would bring the better heat transfer characters.

A Numerical Model of a Reciprocating-Mechanism Driven Heat Loop for Two-Phase High Heat Flux Cooling

2016 ◽  
Vol 8 (4) ◽  
Author(s):  
Olubunmi Popoola ◽  
Ayobami Bamgbade ◽  
Yiding Cao
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Numerical Model ◽  
Performance Optimization ◽  
Numerical Study ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Transfer Device

An effective design option for a cooling system is to use a two-phase pumped cooling loop to simultaneously satisfy the temperature uniformity and high heat flux requirements. A reciprocating-mechanism driven heat loop (RMDHL) is a novel heat transfer device that could attain a high heat transfer rate through a reciprocating flow of the two-phase working fluid inside the heat transfer device. Although the device has been tested and validated experimentally, analytical or numerical study has not been undertaken to understand its working mechanism and provide guidance for the device design. The objective of this paper is to develop a numerical model for the RMDHL to predict its operational performance under different working conditions. The developed numerical model has been successfully validated by the existing experimental data and will provide a powerful tool for the design and performance optimization of future RMDHLs. The study also reveals that the maximum velocity in the flow occurs near the wall rather than at the center of the pipe, as in the case of unidirectional steady flow. This higher velocity near the wall may help to explain the enhanced heat transfer of an RMDHL.

Optimization of Refrigeration Systems for High-Heat-Flux Microelectronics

2008 ◽  
Author(s):  
P. E. Phelan ◽  
Y. Gupta ◽  
H. Tyagi ◽  
R. Prasher ◽  
J. Cattano ◽  
...  
Keyword(s):  
Heat Flux ◽  
Energy Consumption ◽  
System Design ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Compressor Inlet

Increasingly, military and civilian applications of electronics require extremely high heat fluxes, on the order of 1000 W/cm2. Thermal management solutions for these severe operating conditions are subject to a number of constraints, including energy consumption, controllability, and the volume or size of the package. Calculations indicate that the only possible approach to meeting this heat flux condition, while maintaining the chip temperature below 50 °C, is to utilize refrigeration. Here we report an initial optimization of the refrigeration system design. Because the outlet quality of the fluid leaving the evaporator must be held to approximately less than 20%, in order to avoid reaching critical heat flux, the refrigeration system design is dramatically different from typical configurations for household applications. In short, a simple vapor-compression cycle will require excessive energy consumption, largely because of the superheat required to return the refrigerant to its vapor state before the compressor inlet. A better design is determined to be a “two-loop” cycle, in which the vapor-compression loop is coupled thermally to a primary loop that directly cools the high-heat-flux chip.

scholarly journals Thermal Assessment of Nano-Particulate Graphene-Water/Ethylene Glycol (WEG 60:40) Nano-Suspension in a Compact Heat Exchanger

Energies ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1929 ◽  
Author(s):  
M. Sarafraz ◽  
Mohammad Safaei ◽  
Zhe Tian ◽  
Marjan Goodarzi ◽  
Enio Bandarra Filho ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Ethylene Glycol ◽  
Thermal Performance ◽  
Evaluation Criteria ◽  
High Heat ◽  
Operating Conditions ◽  
Working Fluid ◽  
High Heat Flux ◽  
Micro Channel

In the present study, we report the results of the experiments conducted on the convective heat transfer of graphene nano-platelets dispersed in water-ethylene glycol. The graphene nano-suspension was employed as a coolant inside a micro-channel and heat-transfer coefficient (HTC) and pressure drop (PD) values of the system were reported at different operating conditions. The results demonstrated that the use of graphene nano-platelets can potentially augment the thermal conductivity of the working fluid by 32.1% (at wt. % = 0.3 at 60 °C). Likewise, GNP nano-suspension promoted the Brownian motion and thermophoresis effect, such that for the tests conducted within the mass fractions of 0.1%–0.3%, the HTC of the system was improved. However, a trade-off was identified between the PD value and the HTC. By assessing the thermal performance evaluation criteria (TPEC) of the system, it was identified that the thermal performance of the system increased by 21% despite a 12.1% augmentation in the PD value. Furthermore, with an increment in the fluid flow and heat-flux applied to the micro-channel, the HTC was augmented, showing the potential of the nano-suspension to be utilized in high heat-flux thermal applications.

Spatial and Temporal Wall Temperature Fluctuations in Two-Phase Flow in Microgap Coolers

2010 ◽  
Author(s):  
Jessica Sheehan ◽  
Avram Bar-Cohen
Keyword(s):  
Heat Transfer ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Volumetric Cooling ◽  
Very High

Heat transfer to an evaporating refrigerant and/or dielectric liquid in a microgap channel can provide very high heat transfer coefficients and volumetric cooling rates. Recent studies at Maryland have established the dominance of the annular flow regime in such microgap channels and related the observed high-quality peak of an M-shaped heat transfer coefficient curve to the onset of local dryout. The present study utilizes infrared thermography to locate such nascent dryout regions and operating conditions. Data obtained with a 210 micron microgap channel, operated with a mass flux of 195.2 kg/m2-s and heat fluxes of 10.3 to 26 W/cm2 are presented and discussed.

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

2015 ◽  
Vol 137 (4) ◽  
Author(s):  
Craig Green ◽  
Peter Kottke ◽  
Xuefei Han ◽  
Casey Woodrum ◽  
Thomas Sarvey ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Three Dimensional ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
High Heat Flux ◽  
Two Phase ◽  
Forced Cooling ◽  
Fluidic Routing

Three-dimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking exacerbates an already difficult thermal problem. Localized hotspots within individual tiers can provide an additional challenge when the high heat flux region is buried within the stack. Numerous investigations have been launched in the previous decade seeking to develop cooling solutions that can be integrated within the 3D stack, allowing the cooling to scale with the number of tiers in the system. Two-phase cooling is of particular interest, because the associated reduced flow rates may allow reduction in pumping power, and the saturated temperature condition of the coolant may offer enhanced device temperature uniformity. This paper presents a review of the advances in two-phase forced cooling in the past decade, with a focus on the challenges of integrating the technology in high heat flux 3D systems. A holistic approach is applied, considering not only the thermal performance of standalone cooling strategies but also coolant selection, fluidic routing, packaging, and system reliability. Finally, a cohesive approach to thermal design of an evaporative cooling based heat sink developed by the authors is presented, taking into account all of the integration considerations discussed previously. The thermal design seeks to achieve the dissipation of very large (in excess of 500 W/cm2) background heat fluxes over a large 1 cm × 1 cm chip area, as well as extreme (in excess of 2 kW/cm2) hotspot heat fluxes over small 200 μm × 200 μm areas, employing a hybrid design strategy that combines a micropin–fin heat sink for background cooling as well as localized, ultrathin microgaps for hotspot cooling.

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Fabio Battaglia ◽  
Farah Singer ◽  
David C. Deisenroth ◽  
Michael M. Ohadi
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Forced Convection ◽  
Heat Removal ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Two Phase ◽  
Total Thermal Resistance

Abstract In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. The force-fed manifold microchannel cooling concept was utilized to substantially improve the cooling performance. In our design, the heat sink was integrated with the simulated heat source, through a single solder layer and substrate, thus reducing the total thermal resistance. The system was characterized and tested experimentally in two different configurations: the passive (buoyancy-driven) loop and the forced convection loop. Parametric studies were conducted to examine the role of different controlling parameters. It was demonstrated that the thermosiphon loop can handle heat fluxes in excess of 200 W/cm2 with a cooling thermal resistance of 0.225 (K cm2)/W for the novel cooling concept and moderate fluctuations in temperature. In the forced convection mode, a more uniform temperature distribution was achieved, while the heat removal performance was also substantially enhanced, with a corresponding heat flux capacity of up to 500 W/cm2 and a thermal resistance of 0.125 (K cm2)/W. A detailed characterization leading to these significant results, a comparison between the performance between the two configurations, and a flow visualization in both configurations are discussed in this paper.

Forced Convection Boiling in Microchannels for Improved Heat Transfer

2006 ◽  
Author(s):  
Thomas B. Baummer ◽  
Ebrahim Al-Hajri ◽  
Michael M. Ohadi ◽  
Serguei V. Dessiatoun
Keyword(s):  
Heat Transfer ◽  
Aspect Ratio ◽  
Heat Removal ◽  
High Heat ◽  
Heat Fluxes ◽  
Working Fluid ◽  
High Heat Flux ◽  
Surface Areas ◽  
Feed Pressure ◽  
Wide Range

This paper presents experimental results from research investigating the heat transfer capabilities of microchannel surfaces using a novel force-fed boiling and evaporation technique. The evaporative surfaces being investigated consist of a series of parallel, high-aspect ratio, open topped microchannels. The different sample surfaces vary in channel density, channel aspect ratio, and channel width and have heat transfer surface areas up to ten times their nominal surface areas. Liquid enters the channels of the evaporative surface from above through a developed system of feed channels. This method organizes a liquid-vapor circulation at the boiling surface that results in dissipation of very high heat fluxes in the boiling/thin film evaporation mode. By using the force-fed boiling technique, nominal area heat transfer rates of 100,000 W/m2-K have been achieved with HFE-7100 as the working fluid [1]. In force-fed boiling, the many very short microchannels are working in parallel; therefore the feed pressure and pumping power are very low. This technique may prove valuable to a wide range of heat transfer applications, particularly for heat removal at high heat flux surfaces.

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

2017 ◽  
Author(s):  
David C. Deisenroth ◽  
Avram Bar-Cohen ◽  
Michael Ohadi
Keyword(s):  
Heat Flux ◽  
Mass Flux ◽  
Electronics Cooling ◽  
Flow Regimes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Two Phase ◽  
Channel Geometry ◽  
Cooling Channels

Two-phase cooling has become an increasingly attractive option for thermal management of high-heat flux electronics. Cooling channels embedded directly on the back of the heat source (chip) facilitate two-phase boiling/evaporation effectiveness, eliminating many thermal resistances generated by more traditional, remote chip-cooling approaches. Accordingly, manifold-microchannel flow paths in embedded cooling systems can allow very high heat fluxes with low junction temperatures. But, the effect of the feeding manifold design, channel geometry, and the associated shear, stagnation zones, and centripetal accelerations with varying heat flux and mass flux are not well understood. This study builds upon our previous work and elucidates effects of channel geometry, mass flux, and outlet quality on the boiling/evaporation flow regimes in a manifolded microgap channel.

Effect of Gravitational Orientation on Flow Boiling of Water in 1054 × 197 µm Parallel Minichannels

2004 ◽  
Author(s):  
Satish G. Kandlikar ◽  
Prabhu Balasubramanian
Keyword(s):  
Heat Transfer ◽  
High Speed ◽  
Flow Boiling ◽  
High Heat ◽  
Operating Conditions ◽  
Microgravity Environment ◽  
High Heat Flux ◽  
Two Phase ◽  
Mass Fluxes ◽  
Heat Transfer Degradation

Microchannels and minichannels are being considered for high heat flux applications under microgravity environment in space missions. An experimental study is undertaken to determine the effect of gravitational orientation on flow boiling characteristics of water in a set of six parallel minichannels, each 1054 μm wide by 197 μm deep and 63.5 mm long with a hydraulic diameter of 333 μm. Three orientations — horizontal, vertical downflow and vertical upflow — are investigated under identical operating conditions of heat and mass fluxes. High-speed images are obtained to reveal the detailed two-phase flow structure and liquid-vapor interactions. The experimental data and high speed flow visualization indicate that compared to the horizontal case, the flow becomes less chaotic for vertical upflow, while the reversed flow becomes more pronounced in vertical downflow case. The resulting in increase in the back-flow is responsible for channel-to-channel flow maldistribution and heat transfer degradation. From the heat transfer data it is concluded that the performance of the tested channels under microgravity environment will be similar to the horizontal flow case.

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