A Study on Polymer Pin Fin Based Heat Sinks

2007 ◽  
Author(s):  
Ajmal Ansari
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Heat Sink ◽  
Heat Sinks ◽  
Polymer Additives ◽  
Pin Fin ◽  
Recent Developments ◽  
Engineering Polymers

Recent developments in polymer additives and formulations have made available resins that have thermal conductivity that is one to two orders of magnitude higher than that of typical engineering polymers. Such polymers can be potentially used for designing heat sinks. There are two primary advantages of polymer heat sinks: ability to form shapes that may not be feasible with metal and flexibility that allows the heat sink to be bent in various shapes. This paper presents results from a study that was conducted to determine the suitability of commercially available Flexible Heat Sink Material for use in cooling high power LED’s.

Hydoroil-Based Micro Pin Fin Heat Sink

2006 ◽  
Author(s):  
Ali Kosar ◽  
Chih-Jung Kuo ◽  
Yoav Peles
Keyword(s):  
Heat Sink ◽  
Hydraulic Performance ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Nusselt Numbers ◽  
Friction Factors ◽  
Pin Fins ◽  
Micro Pin Fins

An experimental study on thermal-hydraulic performance of de-ionized water over a bank of shrouded NACA 66-021 hydrofoil micro pin fins with wetted perimeter of 1030-μm and chord thickness of 100 μm has been performed. Average heat transfer coefficients have been obtained over effective heat fluxes ranging from 4.0 to 308 W/cm2 and mass velocities from 134 to 6600 kg/m2s. The experimental data is reduced to the Nusselt numbers, Reynolds numbers, total thermal resistances, and friction factors in order to determine the thermal-hydraulic performance of the heat sink. It has been found that prodigious hydrodynamic improvement can be obtained with the hydrofoil-based micro pin fin heat sink compared to the circular pin fin device. Fluid flow over pin fin heat sinks comprised from hydrofoils yielded radically lower thermal resistances than circular pin fins for a similar pressure drop.

Pin-Fin Heat Sink With Horizontal Base and Blocked Edges

2008 ◽  
Author(s):  
D. Sahray ◽  
H. Shmueli ◽  
N. Segal ◽  
G. Ziskind ◽  
R. Letan
Keyword(s):  
Heat Transfer ◽  
Free Convection ◽  
Contact Resistance ◽  
Cross Section ◽  
Heat Input ◽  
Heat Sink ◽  
Numerical Study ◽  
Heat Sinks ◽  
Transfer Enhancement ◽  
Pin Fin

In the present work, horizontal-base pin fin heat sinks exposed to free convection in air are studied. They are made of aluminum, and there is no contact resistance between the base and the fins. For the same base dimensions the fin height and pitch vary. The fins have a constant square cross-section. The edges of the sink are blocked: the surrounding insulation is flush with the fin tips. The effect of fin height and pitch on the performance of the sink is studied experimentally and numerically. In the experiments, the heat sinks are heated using foil electrical heaters. The heat input is set, and temperatures of the base and fins are measured. In the corresponding numerical study, the sinks and their environment are modeled using the Fluent 6 software. The results show that heat transfer enhancement due to the fins is not monotonic. The differences between sparsely and densely populated sinks are analyzed for various fin heights. Also assessed are effects of the blocked edges as compared to the previously studied cases where the sink edges were exposed to the surroundings.

scholarly journals Experimental and Numerical Examinations of Temperature Distributions along SSF Pin Fins Cast through Semisolid Materials Processing

2019 ◽  
Vol 8 (12) ◽  
pp. 500-503
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Stainless Steel ◽  
Heat Sinks ◽  
Materials Processing ◽  
Length Scale ◽  
Pin Fin ◽  
Temperature Distributions ◽  
Pin Fins ◽  
Enhancing Heat Transfer

Heat sinks or fins stand deployed for enhancing heat transfer. That’s why, planned experiments remain fortified for examining the impacts of SSF pin fin on thermal dispersal concerning constant thermal value 6 W/cm2 . For that five chromel-alumel thermocouples are preferred, above and beyond, SSF pin fins materials of stainless steel and aluminum. As anticipated, for both the stated SSF pin fins, temperature declines for increasing length scale. Besides, both results are comparable with each other. However, temperature distributions over SSF aluminum pin fin declines relatively at faster rate comparable to that over SSF stainless steel pin fin. Obviously, it may be owing to higher thermal conductivity of SSF aluminum pin fin. Therefore, it carries superior, pleasant and momentous thermal performances.

Flexible graphene composites with high thermal conductivity as efficient heat sinks in high-power LEDs

2018 ◽  
Vol 52 (2) ◽  
pp. 025103 ◽  
Author(s):  
J Oliva ◽  
A I Mtz-Enriquez ◽  
A I Oliva ◽  
R Ochoa-Valiente ◽  
C R Garcia ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Heat Sinks ◽  
High Thermal Conductivity

Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals

2001 ◽  
Author(s):  
V. S. Travkin
Keyword(s):  
Heat Sink ◽  
Solid Phase ◽  
Physical Characteristics ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Pin Fin ◽  
Three Samples ◽  
Non Local ◽  
Scale Design ◽  
Research And Design

Abstract The primary difficulty in semiconductor heat sink (and many other types of heat exchangers) research and design is not a lack of interest or money, but rather confusion with what being looked for and adequacy of the tools used for the search. As recently shown, there are few meaningful parameters (apart from sizes and weight) or physical characteristics of interest in semiconductor cooler design are local values. Even the maximum temperature of the base Tmax or semiconductor temperature are not local. In this work outlined the description in detail of arguments on how, and for what reasons, the measured data are to be simulated or measured and represented in a way that allows design goals to be formulated primarily with bulk physical characteristics. We demonstrate why studies of only averaged local integrated variables are not enough. Four sample semiconductor heat sinks of two morphologies (three samples of round pin fin and one sample of longitudinal rib fin sinks) were studied by different techniques and models. There were changes in by-pass values, external heat flux and flow rate. The results are depicted with using new parameters that better represent the needs of a design process as well as the usual parameters used in the past. Characteristics reported are the heat transfer rate in solid phase, relative fin effectiveness, and influence of only morphology features among others. Some suggestions for heat sink design are discussed.

High Power CPU Cooling Experiment

1995 ◽  
Author(s):  
Elizabeth B. Nadworny ◽  
T. Gary Yip ◽  
Nader Farag
Keyword(s):  
Heat Transfer ◽  
High Power ◽  
Power Dissipation ◽  
Heat Removal ◽  
Data Acquisition System ◽  
Heat Sinks ◽  
Small Scale ◽  
Heat Transfer Area ◽  
Pin Fin ◽  
Transfer Parameters

Abstract This experimental study focuses on the enhancement of the heat removal process by modifying the geometry of pin fin heat sinks, while maintaining the same effective heat transfer area. The pins are cut at an angle to reduce the blockage of air flow across the surface. To perform this study, a small scale wind tunnel facility has been designed specifically for testing high power dissipation processors and other ULSI components. The facility is fully automated and controlled by an HP3852A Data Acquisition System interfaced with a 486 based PC computer. The average surface temperature, Reynolds number, Nusselt number and other relevant heat transfer parameters were reduced from the data collected. Results from the study show that a heat sink with an angled trailing edge produces the greatest enhancement of heat removal. The mechanism for the improved heat transfer is the larger temperature gradient across the surface, which is obtained by lowering the minimum temperature on the surface.

Thermal Optimization of Microchannel Heat Sink With Pin Fin Structures

2003 ◽  
Author(s):  
Duckjong Kim ◽  
Sung Jin Kim
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Fluid Flow ◽  
Heat Sink ◽  
Volume Averaging ◽  
Heat Sinks ◽  
Pumping Power ◽  
Heat Transfer Characteristics ◽  
Pin Fin ◽  
Flow And Heat Transfer

In the present work, a novel compact modeling method based on the volume-averaging technique and its application to the analysis of fluid flow and heat transfer in pin fin heat sinks are presented. The pin fin heat sink is modeled as a porous medium. The volume-averaged momentum and energy equations for fluid flow and heat transfer in pin fin heat sinks are obtained using the local volume-averaging method. The permeability, the Ergun constant and the interstitial heat transfer coefficient required to solve these equations are determined experimentally. To validate the compact model proposed in this paper, 20 aluminum pin fin heat sinks having a 101.43 mm × 101.43 mm base size are tested with an inlet velocity ranging from 1 m/s to 5 m/s. In the experimental investigation, the heat sink is heated uniformly at the bottom. Pressure drop and heat transfer characteristics of pin fin heat sinks obtained from the porous medium approach are compared with experimental results. Upon comparison, the porous medium approach is shown to predict accurately the pressure drop and heat transfer characteristics of pin fin heat sinks. Finally, surface porosities of the pin fin heat sink for which the thermal resistance of the heat sink is minimal are obtained under constraints on pumping power and heat sink size. The optimized pin fin heat sinks are shown to be superior to the optimized straight fin heat sinks in thermal performance by about 50% under the same constraints on pumping power and heat sink size.

Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks

1999 ◽  
Vol 123 (3) ◽  
pp. 315-318 ◽  
Author(s):  
Keiji Sasao ◽  
Mitsuru Honma ◽  
Atsuo Nishihara ◽  
Takayuki Atarashi
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Numerical Analysis ◽  
Numerical Method ◽  
Heat Sink ◽  
Flow Resistance ◽  
Air Flow ◽  
Heat Sinks ◽  
Flow And Heat Transfer ◽  
Conventional Methods

A numerical method for simulating impinging air flow and heat transfer in plate-fin type heat sinks has been developed. In this method, all the fins of an individual heat sink and the air between them are replaced with a single, uniform element having an appropriate flow resistance and thermal conductivity. With this element, fine calculation meshes adapted to the shape of the actual heat sink are not needed, so the size of the calculation mesh is much smaller than that of conventional methods.

The Effect of Orientation on the Performance of Small Free-Convection Heat Sinks for Use With a Thermoelectric Cryotherapy Device

2020 ◽  
Vol 13 (4) ◽  
Author(s):  
Mark Baldry ◽  
Victoria Timchenko ◽  
Chris Menictas
Keyword(s):  
Free Convection ◽  
Heat Sink ◽  
Rapid Development ◽  
Heat Sinks ◽  
Convection Heat ◽  
Pin Fin ◽  
Flat Base ◽  
Free Convection Heat ◽  
Performance Decline ◽  
Metal 3D Printing

Abstract The rapid development of metal 3D printing techniques has enabled the exploration of complex free-convection heat sink designs. Small free-convection heat sinks with pin-fin arrays (or novel geometries) are widely employed at different orientations in a variety of electronic devices, yet there is limited understanding of how orientation impacts their heat transfer behavior. This article characterizes the orientation-dependent performance of a small, tapered pin, free-convection heat sink (named HS17) manufactured with direct metal laser sintering for use with a thermoelectric scalp cryotherapy device for the prevention of chemotherapy-induced alopecia. A validated numerical model and custom-built free-convection test rig were used to investigate the heat sink’s performance over the orientation range of 0 deg to 135 deg. HS17 maintained relatively robust performance over the 0 deg to 90 deg range; however, the thermal resistance (Rth) at 112.5 deg and 135 deg was 6% and 11% higher compared to the 90 deg case, respectively. The heat sink design was modified to include a 22.5 deg wedge base (named HS17-W) to mitigate this performance decline, which is important to ensure safe and continued operation of the cryotherapy device. Compared to the flat base heat sink, the wedge-base design successfully reduced Rth from 11.9 K/W, 12.5 K/W, and 12.8 K/W to 11.5 K/W, 11.8 K/W, and 12.3 K/W at 90 deg, 112.5 deg, and 135 deg, respectively. These results demonstrate the effectiveness of the current proposed design to improve the performance of free-convection heat sinks at downward-facing orientations.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

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